• 제목/요약/키워드: laser bump

검색결과 33건 처리시간 0.031초

유리기층의 레이저 텍스쳐링에 의한 미소융기의 형성 (Microbump formation during laser texturing of glass substrates)

  • 김동식;오부국
    • 한국레이저가공학회지
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    • 제4권3호
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    • pp.40-44
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    • 2001
  • Microbump formation during CO$_2$ laser texturing of glass substrates is examined in this paper. Experimental results show that different bump shapes (dome-shaped, with a central dimple, and with a peripheral rim) are generated depending on the laser fluence. A theoretical model for the process is suggested based on thermoelastic behavior but limited only to the dome-shaped bump. The dimensions (maximum height and base area) of the bump shows a logarithmic dependence on laser fluence as expected from the theory. Numerical computation reveals that the effect of thermal diffusion is not negligible for relatively long laser pulses.

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Resonance Phenomenon and Its Effects of Laser Texture Disk

  • Choa, Sung-Hoon;Wang, Geng
    • Journal of Mechanical Science and Technology
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    • 제14권7호
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    • pp.744-751
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    • 2000
  • To achieve lower flying height for high areal recording density, the laser zone texturing of the disk needs to be designed to reduce glide height. One problem of the laser bump design is that the regular laser bump pattern often produces glide resonance phenomenon, which leads to failure of the glide height test. However, it was found in this study that glide resonance is an intrinsic problem of the glide head used and resonance phenomenon depends on the type of the head slider, that is, the natural frequency of the slider body. Therefore, higher glide height or glide failure caused by glide resonance does not lead to head/media interface problem in the real drive operating conditions in which the data head is used. Pseudo-random bump pattern greatly reduces the glide resonance. Smaller bump pitch will also help to reduce the glide resonance. However, as bump spacing becomes smaller, glide height will be increased due to increased air pressure developed around the bumps. Lowering bump height is the most effect way to reduce glide avalanche.

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레이저 용접 블랭크 응용 자동차 범퍼 개발 (Application of Laser Welded Tailored Blank for Automobile Bumper Beam)

  • 서정;한유희;김태일;이문용;이광현
    • 한국레이저가공학회지
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    • 제2권1호
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    • pp.51-60
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    • 1999
  • In this paper, weldability and formability of Tailored-Blank (TB) and the structural impact testing of bump beam were investigated to apply TB to automobile bumper beam. The optimal $CO_2$ laser welding condition for TB of SPFC and SPRC steel plates with different thicknesses was obtained. Before welding, the cross section of butt joint was prepared only by shearing without milling process. Real type bump beam was produced by two kind of forming processes such as roll-forming and press-forming, and the good formability of TB was obtained. Impact test results of bump by using pendulum and barrier were satisfied the impact regulation of bump. Finally. It may be confirmed that laser welded TB is well-balanced material in both weight reduction and production cost of automobile bump.

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EXPERIMENTAL STUDY ON LASER AND HOT AIR REFLOW SOLDERING OF

  • Tian, Yanhong;Wang, Chunqing
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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    • pp.469-474
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    • 2002
  • Laser and hot air reflow soldering of PBGA solder ball was investigated. Experimental results showed that surface quality and shear strength of solder bumps reflowed by laser was superior than the solder bumps reflowed by hot air, and the microstructure inside the solder bumps reflowed by laser was much finer. Analysis on interfacial reaction showed that eutectic solder reacted with Au/Ni/Cu pad shortly after the solder was melted. Interface of solder bump reflowed by laser consists of a continuous AuSn$_4$ layer and remnant Au element. Needle-like AuSn$_4$ grew sidewise from interface, and then spread out to the entire interface region. A thin layer of Ni$_3$Sn$_4$ intermetallic compound was found at the interface of solder bump reflowed by hot air, AuSn$_4$ particles distributed inside the whole solder bump randomly. It is the combination effect of the continuous AuSn$_4$ layer and finer eutectic microstructure inside the solder bump reflowed by laser that resulted in higher shear strength.

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다구찌법을 이용한 IR 레이저 Flip-chip 접합공정 최적화 연구 (A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods)

  • 송춘삼;지현식;김주한;김종형;안효석
    • Journal of Welding and Joining
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    • 제26권3호
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    • pp.30-36
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    • 2008
  • A flip-chip bonding system using IR laser with a wavelength of 1064 nm was developed and associated process parameters were analyzed using Taguchi methods. An infrared laser beam is designed to transmit through a silicon chip and used for transferring laser energy directly to micro-bumps. This process has several advantages: minimized heat affect zone, fast bonding and good reliability in the microchip bonding interface. Approximately 50 % of the irradiated energy can be directly used for bonding the solder bumps with a few seconds of bonding time. A flip-chip with 120 solder bumps was used for this experiment and the composition of the solder bump was Sn3.0Ag0.5Cu. The main processing parameters for IR laser flip-chip bonding were laser power, scanning speed, a spot size and UBM thickness. Taguchi methods were applied for optimizing these four main processing parameters. The optimized bump shape and its shear force were modeled and the experimental results were compared with them. The analysis results indicate that the bump shape and its shear force are dominantly influenced by laser power and scanning speed over a laser spot size. In addition, various effects of processing parameters for IR laser flip-chip bonding are presented and discussed.

Contact Start-Stop 방식에서의 극저부상 높이에서 Head-Disk Interface Interactions 연구 (A Study on Head-Disk Interactions at Ultra-low Flying Height in Contact Start-Stop)

  • 조언정
    • Tribology and Lubricants
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    • 제19권2호
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    • pp.102-108
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    • 2003
  • The height of laser bumps has been considered as the limit of the minimum flying height in the contact start-stop (CSS) of hard disk drives. In this paper, tribological interactions at flying height under laser bumps are investigated in a spin stand for development of ultra-low flying head-disk interface. With the reduction of the spinning speed in a spin stand, the flying height is decreased under the height of laser bumps and, then, head-disk interactions are investigated using AE and stiction/friction signals. During seek tests and 20000 cycle-sweep tests, AE and stiction/friction signals are not significantly changed and there are no catastrophic failures of head-disk interface. Bearing analysis and AFM analysis show that there are signs of wear and plastic deformation on the disks. It is suggested that flying height could be as low as and, sometimes, lower than laser bump height.

단락된 가우스 광이 광학 디스크 재생 신호에 미치는 영향 (Influence of truncated gaussian beam on read-out signal in optical disc)

  • 박성종;정창섭
    • 한국광학회지
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    • 제7권4호
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    • pp.434-439
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    • 1996
  • 본 연구에서는 가우스 진폭을 갖는 입사광의 단락된 정도와 광학 디스크 상의 bump의 형태가 재생신호에 미치는 영향과 디스크 bump에 맺히는 회절광 PSF(point spread function)와의 관계를 알아보기 위해 스칼라 회절 이론을 사용하였다. 단락된 가우스 진폭으로 .sigma.=0, 0.5, 1.5, 2.5인 경우를 고려하였으며 bump의 높이는 n.DELTA.$_{o}$ =.lambda./4로서 이는 위상 높이 .PHI.$_{o}$ =.pi.가 된다. 또한 본 연구에서 고려한 bump 형태 즉 직사각형(.DELTA.p$_{o}$ =0)과 준 원추형(.DELTA.p$_{o}$ /2) 그리고 원추형(.DELTA.p$_{o}$ =p$_{o}$ )의 세 가지 경우이다. 본 연구에서 고려한 입사광의 단락된 정도가 작을 수록 bump에 맺는 중심 회절상의 반경이 작게 나타났으며 이때 재생 신호의 극대치는 입사광의 단락된 정도가 작을수록 bump에 맺는 중심 회절상의 반경이 작계 나타났으며 이때 재생 신호의 극대치는 입사광의 단락된 정도가 큰 경우보다 크게 나타났고 bump의 크기도 작게 나타났다. 이러한 결과들로부터 입사광의 단락된 정도가 작을수록 광학 디스크로부터 큰 재생 신호를 얻을 수 있으며 cross-talk가 줄어듬을 알 수 있었다. 그러므로 실제 광학 디스크에 가능한 단락된 정도가 작은 가우스 진폭을 갖는 레이저 광을 입사광으로 사용하면 유용하리라 생각된다.

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Investigation of Head-Disk Interactions at Ultra-low Flying HDI

  • Cho, Unchung
    • KSTLE International Journal
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    • 제3권2호
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    • pp.114-118
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    • 2002
  • In this work, head-disk interactions are studied when flying height becomes lower than laser bump height on the landing zone of a disk. With the reduction of the spinning speed in a spin stand, the flying height is decreased under the height of laser bumps. Conventional and padded pico sliders sweep between landing Bone and data zone and, then, the dynamic behavior of the pico sliders and head-disk impacts are investigated using AE and stiction/friction signals. After 200n cycle-sweep tests, bearing analysis and AFM analysis indicate that there are some signs of wear and plastic deformation in the landing zone of a disk, although AE and stiction/friction signals are not significantly changed during the sweep tests. The experimental results of this paper suggest that in CSS tests at component level, more rigorous examination methods of wear and plastic deformation might be necessary as flying height becomes getting lower.