• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.75-78
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• 1995

This paper presents the feasibility of laser ablation process in 3-D micro machining of MEMS (micro Electro Mechanical System)parts. The micro machining characteristics of polymer(Energy fluence, pulse repetition rate, number of pulse, ablation rate)are investigated and 3-D micro machined samples are demonstrated.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.12
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• pp.1359-1365
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• 2011

The changes of ablation characteristics with respect to laser parameters and material parameters during pulsed laser ablation of solids were discussed with experimental results. Although laser wavelength, laser pulse width, and laser pulse energy are the primary factors to be considered, it is shown that other parameters such as laser spot size and material properties also critically influence on the ablation results. It is further demonstrated that the microstructural characteristics of the target can lead to completely different ablation rate and surface morphology.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.99-103
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• 2012

Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.887-890
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• 1997

Recently micromachining using DPSSL(Diode Pumped Solid State Laser) with 3rd harmonic wavelength is actively studied in laser machining area. Micromachining using DPSSL have outstanding advantages as UV source comparing with excimer laser in various aspect such a maintenance cost, maskless machining, high repetition rate and so on. In this study micro-drilling of PCB type substrate which consists of Cu-PI-Cu layer was performed using DPSS Nd:YAG laser(355nm, wavelength) in vector scanning method. Experimental and numerical method(Matlab simulation, FEM) are used to optimize process parameter and control machining depth. The man mechanism of this process is laser ablation. It is known that there is large gap between energy threshold of copper and that of PI. Matlab simulation considering energy threshold of material is performed to effect of duplication of pulse and FEM thermal analysis is used to predict the ablation depth of copper. This study could be widely used in various laser micromachining including via hole microdrilling of PCB, and micromachining of semiconductor components, medical parts and printer nozzle and so on.

• Journal of the korean academy of Pediatric Dentistry
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• v.27 no.4
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• pp.558-563
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• 2000

The lasers have been used in dentistry for more than 30 years and the application of lasers for drilling dental hard tissue has been investigated since the early developement of lasers. Recently, the Er:YAG laser was invented for hard tissue ablation. The Er:YAG laser, having a wavelength of 2.94um, is highly absorbed in both water and hydroxiapatite, leading to a very effective material for hard tissue removal by bursting off the solid tissue component that is, enamel and dentin are removed by the Er :YAG laser by water vaporization and microexplosion, without any melting of inorganic tissues. Therefore, the Er:YAG laser produced round craters with well defined margins and the surrounding tissues had no cracks and no charring. When used for cavity preparation, pulpal damage should not occur if hear buildup is minimized by careful selection of exposure parameters and by use of a water spray. The present study demonstrated that the Er:YAG laser cut the tooth substance adequately for composite resin restoration, without having undesirable side effects such as harmful effects on the pulp, discoloration or cracking etc. Also, the child patients were well cooperative during laser treatment mainly because of little noise, lesser vibration and minimal pain compared to conventional means of cavity preparation.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.31-36
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• 2009

In this paper, the laser cutting characteristics of the flexible PCB using high power Nd:YAG UV laser were investigated. A specific FPCB model was selected for the experiment. Test sheets were made, which had equal materials and layer structure to those of the outline (OL) region and the contact pad (CP) region in the FPCB. The experiment is made up of two stages. In the first stage of the experiment, the laser cutting fluence was found, which is the threshold fluence to cut the test sheets completely. The laser cutting fluence of the OL sheet is $1781.26{\sim}1970.16\;J/cm^2$ and that of the CP sheet is $2109.34{\sim}2134.34\;J/cm^2$. In the second stage, cutting performance and its qualities were analyzed by the experiment. The laser cutting performance remained almost unchanged for all laser and process parameter sets. The average cutting width (top side/bottom side) of the OL sheet was $40.45\;{\mu}m/11.52\;{\mu}m$ and that of the CP sheet was $22.14\;{\mu}m/10.93\;{\mu}m$. However, the laser cutting qualities were different according to the parameters. The adjacent region of the cutting line on the OL sheet was carbonized as the beam speed was low and the overlap coefficient was high. The surface quality around the cutting line of the CP sheet was about the same. Carbonization and debris occurred on the surface of the cutting line. As a result of the experiment, the cutting qualities were better as the overlap coefficient was made low and beam speed high. Therefore, the overlap coefficient 2 or 3 is proper for the FPCB laser cutting.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.382-386
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• 2012

A femtosecond laser with 775nm central wavelength and 150 fs of temporal pulse width was used for multi layered glass cutting applications. Ultrashort pulse was effectively used for clean glass cutting with $50{\mu}m$ depth and minimum cutting width. Laser beam was split to two stages and focused on the top surfaces of each layer. Ablation threshold of used glass was measured to be $2.59J/cm^2$. In experiments, 200mW laser power and 1mm/s scanning speed was used for preliminary experiment. Air gap was the major defect occurring parameter and laser power was less sensitive to glass cutting in the experiment. The maximum cutting speed was measured to be 60mm/min with 2kHz, however, Maximum 3m/min cutting speed can be achievable with a commercially available laser with 100kHz.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1889-1892
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• 2003

The fabrication of micro-size patterning on alumina substrate is generated by laser direct writing, which has high precision and selectivity of various laser beam energies. The depth and width of patterns is affected by laser parameter such as laser power, scan rate. Through the chemical and mechanical polishing Pd seeds was effectively got rid of alumina substrate for selectivity electroless Ni plating. Thermal treatment is good method for changing electrical property of conductor line, because the treatment can control of the grain size.