• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.33 no.4
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• pp.15-20
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• 2001

The function of the moisture-proof paper is to prevent moisture from adsorbing into the packed goods. Water-vapor transmission rate of the moisture-proof paper should be less than 100g/$m^2$.24hr and the optimum rate would be less than 50g/$m^2$.24hr. In general the moisture-proof paper has been made by laminating polyethylene or polypropylene on top of the base paper. However this kind of moisture-proof paper has a problem in recycling so that it brings about environmental pollution. In general the moisture-proof paper has been made by laminating polyethylene or polypropylene on top of the base paper. However this kind of moisture-proof paper has a problem in recycling so that it brings about environmental pollution. The purpose of this paper was to make moisture-proof paper using the mixture of SB latex and wax emulsion which was recyclable and environmentally friendly. Water vapor transmission rate showed less than 50g/$m^2$.24hr in mixture ratio of 85:15, 87:13, 90:10. Especially the mixture ratio of 87:13 showed the most favorable water-vapor transmission rate. However, the moisture-proof layer was destroyed slightly by folding in packing. It has been observed that there was no close relationship between water-vapor transmission rate of the moisture-proof paper and grammage of the base paper, but the density of base paper had influenced on water vapor transmission rate. It was also observed that the moisture-proof paper could be recycled. The moisture-proof paper was similar to base paper in degree of the pulping, and there was no significant difference in dispersion between moisture-proof paper and base paper. Most of wax particles which caused the spots during drying process could be removed by flotation process. Tensile strength and tear strength of both moisture-proof paper and base paper after pulping were measured to examine the fiber bonding, and no significant difference in physical properties was observed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.396-400
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• 2003

A new synthesis process for nano laminating Ti$_3$SiC$_2$ has been developed using TiCx (x=0.67) and Si powder as starting materials by a reaction hot pressing. Bulk Ti$_3$SiC$_2$ was fabricated using a green body consisting of TiCx and Si by a hot pressing under the pressures of 25 MPa at 1420-1550 $^{\circ}C$ for 90 min. The synthesized Ti$_3$SiC$_2$ was consisting of only TiCx and Ti$_3$SiC$_2$. The relative density of sintered bulk Ti$_3$SiC$_2$ was increased as the hot pressing temperature was increased, which was mainly due to the increase in TiCx contents in synthesized Ti$_3$SiC$_2$. The synthesized Ti$_3$SiC$_2$ bulk was consisted of nano sized lamella structure of 20-100 nm in thickness. It was found that TiCx particles in Ti$_3$SiC$_2$ would increase the 3-point bending strength of synthesized Ti$_3$SiC$_2$ bulk. The maximum 3-P. bending strength of synthesized Ti$_3$SiC$_2$ bulk was more than 800 MPa. The Vickers hardness of synthesized Ti$_3$SiC$_2$bulk was as low as 5 Gpa, which was decreased with the indentation load. The quasi-plastic deformation behaviors were observed around indentation mark on Ti$_3$SiC$_2$.

• Polymer(Korea)
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• v.36 no.2
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• pp.119-123
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• 2012

Adhesion strength of polyurethane adhesive for laminated metal plate was investigated. Also, the effect of laminating conditions on the adhesion strength was understood by measuring peel strength as a function of adhesion temperature and time. The amount of isocyanate appearing due to the unblocking of oxime in polyurethane adhesive affected the strength of adhesion with hydroxyl on the metal plate or aluminum foil and it was controlled by adhesion temperature and time. However, the excess of temperature and time in laminating process caused the lowering of adhesion strength because of the decrease of solvent content as well as thermal degradation of the adhesive.

• Journal of the Korea Convergence Society
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• v.11 no.6
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• pp.83-88
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• 2020

Recently, radiation shielding sheets made of eco-friendly materials have been widely used in medical institutions. The shielding sheet is processed into a solid form by thermoforming by mixing a shielding material with a polymer material. The base is resin-based and has a limit in tensile strength, and for this purpose, fibers such as non-woven fabrics are used on the surface. The shielding sheet process technology has a problem in that the tensile strength rapidly decreases when the content of the shielding material is increased to increase the shielding performance. In order to improve this, this study intends to compare and evaluate the method of laminating and coating the fibers in the sheet process. In comparison of the three types of sheets, there was no difference in shielding performance between the fiber-coated sheet and the compression sheet, but there was a large difference in tensile strength.

• The Transactions of the Korean Institute of Electrical Engineers P
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• v.65 no.2
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• pp.142-150
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• 2016

This paper developed new manufacture process technology of slim type flexible flat lighting product used lower power white LED. Flexible flat lighting is applied to letter sign lighting, traffic lighting, interior wall lighting, flat lighting, aquarium back lighting, wreath light etc. Main manufacture process technology were developed drawing software for electronics circuit, inkjet electronic circuit pattern and inkjet white ink coating. For pattern printing it was utilized for piezoelectonic inkjet head printing technology. Also high vacuum pressure laminating technology was waterproofing for LED flat lighting protection. Hence, form process technology we were manufactured for flexible flat lighting product of the power 12 W, input voltage 48 V and plane size $480{\times}480mm$. It acquired a these validity from experiment results.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.18 no.4
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• pp.310-317
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• 2008

The objective of the survey is to define and judge exposure profiles semi-qualitative data in high risk processes using styrene. The survey was conducted on 98 factories out of 229 factories based on data from periodic working environment monitoring for styrene. Styrene is widely utilized as a raw material for PS and co-polymers such as ABS, SAN, SBR, SBL, unsaturated polyester resins(UPR) and others. An approximate breakdown of styrene's markets in Korea is PS 30%, expandable PS 17%, ABS 33%, SAN 5%, SBL 4%, SBR 3%, UPR 1% and other 7%. Although UPR accounts for 1% of total amount of styrene, workers dealing with it are exposed to very high concentrations up to 64 ppm. Especially styrene is widely used in the laminating process of fiberglass reinforced plastics(FRP) manufacturing industry. The Applications using styrene are largely classified into two sections which are applied to styrene monomer(SM) and UPR. SM is utilized for a raw material of resins, surfactant and adhesive. UPR is employed for FRP and non-FRP. For SM control targets are mixing colors and packing in the gelcoat resins manufacturing industry(MI), for UPR control targets out of works using UPR are 1) laminating in the MI of plastics, automobile parts and boats, 2) mixing and packing in the SMC/BMC MI, 3) molding and cutting in the other specific plastics MI, 4) mixing and coating in artificial marble product MI, 5) dipping in the electric motors & transformers MI, 6) molding in the button MI, 7) painting in the musical instrument MI. Findings from the study have given the information for the high risk processes and working practices so that occupational health professionals could focus on targeted workplaces to prevent occupational diseases. It is also useful to develop a control strategies and specific controls for high risk processes and facilities using styrene.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.21-28
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• 2004

We have demonstrated the applicability of dry film photoresist (DFR) in photolithography process for fine pitch solder bumping on the polytetrafluoroethylene (PTFE/Teflon ) printed circuit board (PCB). The copper lines were formed with 100$\mu\textrm{m}$ width and 18$\mu\textrm{m}$ thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200$\mu\textrm{m}$. The DFRs of 15$\mu\textrm{m}$ thickness were laminated by hot roll laminator, by varying laminating temperature from $100{\circ}C$ to 15$0^{\circ}C$ and laminating speed from 0.28-0.98cm/s. We have found the optimum process of DFR lamination on PTFE PCB and accomplished the formation of indium solder bumps. The optimum lamination condition was temperature of $150^{\circ}C$ and speed of about 0.63cm/s. And the smallest size of indium solder bump was diameter of 50$\mu\textrm{m}$ with pitch of 100$\mu\textrm{m}$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.10 s.241
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• pp.1298-1306
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• 2005

In this paper, Part II, we realized the Serpentine Laminating Micromirer (SLM) which was proposed in the accompanying paper, Part I, by means of the injection molding process in mass production. In the SLM, the higher level of chaotic mixing can be achieved by combining two general chaotic mixing mechanisms of splitting/recombination and chaotic advection by the successive arrangement of 'F'-shape mixing units in two layers. Mold inserts for the injection molding process of the SLM were fabricated by SU-8 photolithography and nickel electroplating. The SLM was realized by injection molding of COC (cyclic olefin copolymer) with the fabricated mold inserts and thermal bonding of two injection molded COC substrates. To compare the mixing performance, a T-type micromixer was also fabricated. Mixing performances of micromixers were experimentally characterized in terms of an average mixing color intensity of a pH indicator, phenolphthalein. Experimental results show that the SLM has much better mixing performance than the I-type micromixer and chaotic mixing was successfully achieved from the SLM over the wide range of Reynolds number (Re). The chaotic micromixer, SLM proposed in this study, could be easily integrated in Micro-Total-Analysis- System , Lab-on-a-Chip and so on.

• Textile Coloration and Finishing
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• v.34 no.4
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• pp.224-233
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• 2022

Recently, consumer tastes of various classes at home and abroad prefer comfortable, unadorned, and simple clothing, and the athleisure trend, which can be used freely in daily life as well as exercise, has expanded to overall clothing products. Existing materials used for athleisure are composite knitted fabrics using polyester yarn and PU yarn, which has problems due to a chronic lack of color fastness and contamination by dyes even when PU laminating is applied, making it difficult to apply various colors. There is a quality problem in which deformation of the product occurs due to lack of durability. In this study, CDP yarn(75de/72f) and PU yarn(40de) were selected to commercialize the circular knitting for athleisure using CDP yarn in order to solve the problems that occur in the dyeing and laminating process when using polyester materials. CDP yarns were used to knit into single(CP75-S) and double(CP75-D) knit and single knit were found to be suitable as athleisure fabrics. After pretreatment and treatment under various conditions, the stainability of CDP circular knitting was examined. After pretreatment and dyeing process under various conditions, the property of scouring and dyeability of CP75-S were evaluated.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.67-70
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• 2007

LTCC (Low Temperature Co-fired Ceramic) has been emerged as a promising technology in packaging industry. In this technology the lamination and the sintering process are very important because they change the permittivity of ceramics and the dimension of metal pattern which have influences on electric property. In this paper we studied on influence of the permittivity and the dimension change by lamination pressure and sintering temperature of LTCC process. As a results, permittivity increase along with increasing of lamination pressure and sintering temperature.