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A NOVEL BGA PACKAGE FOR RF APPLICATIONS

  • Degani, Y.;Dudderar, T.D.;Frye, R.C.;Gregus, J.A.;Jacala, J.;Kossives, D.;Lau, M.Y.;Low, Y.;Smith, P.R.;Tai, K.L.
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 1998년도 IUMRS-ICEM ABSTRACT BOOK
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    • pp.96.3-96
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    • 1998

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Roll-to-Roll Fabrication of Active-Matrix Backplanes Using Self-Aligned Imprint Lithography (SAIL)

  • Kim, Han-Jun;Almanza-Workman, Marcia;Chaiken, Alison;Jackson, Warren;Jeans, Albert;Kwon, Oh-Seung;Luo, Hao;Mei, Ping;Perlov, Craig;Taussig, Carl;Jeffrey, Frank;Braymen, Steve;Hauschildt, Jason
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1539-1543
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    • 2006

  • We have developed self-aligned imprint lithography (SAIL) technology, an innovative method for roll-to-roll (R2R) fabrication of electronic devices on flexible plastic substrates. In this paper, we present the first R2R-produced ${\alpha}$-Si TFTs built on a polyimide substrate using the SAIL process, and prove the feasibility of this technology to enable R2R fabrication of flexible display active matrix (AM) backplanes with high precision and throughput.

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