• Journal of Welding and Joining
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• v.21 no.5
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• pp.525-533
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• 2003

The dimensional accuracy and global roughness between successive layers of VLM-s, which is a new rapid prototyping process using hotwire cutter and EPS foam, depend significantly on the operating parameters of hotwire cutter. In the present study, the effect of cutting angle on the kerf width and edge shape in hotwire cutting of EPS foam for the case of single-sloped cutting with one cutting angle was investigated. Through single-sloped cutting tests, the modified relationship between kerf width and effective heat input, considering the effect of the cutting angle, and the relationship between the melted area and the cutting angle were obtained. In order to investigate the effect of cutting angles on the thermal field in EPS foam, transient heat transfer analyses using single-sloped volumetric heat flux model and locally-conformed mesh were performed. Through the comparison between experimental and numerical results, it was shown that the proposed analysis model is needed to estimate the three-dimensional temperature distribution of the EPS foam for the case of single-sloped hotwire cutting.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.5
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• pp.14-19
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• 2010

A computational study was carried out to analyze the characteristics of supersonic (Mach 2.0) coaxial/off-axis jet's impingements on a slanted kerf surface in laser machining. The effects of various parameters such as gas pressure, distance between nozzle exit and kerf edge surface, and application of off-axis nozzles on the impingement phenomena of the assist-gas on kerf surface were observed. The present study showed that simply increasing the assist-gas pressure for coaxial supersonic nozzle was not effective to alleviate the strength of flow separation on kerf surface. It also presented the optimized operating condition of the coaxial nozzle to have the highest skin friction values over kerf surface.

• Laser Solutions
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• v.4 no.2
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• pp.47-57
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• 2001

This study deals with the laser cutting of stencil for the PCB. The most important aim of this study is to determine optimal conditions which make good-qualify stencil in Nd:YAG laser cutting. We made an experiment according to various variables (power. type of mask. gas pressure, cutting speed, and pulse width) and analyzed the cutting characteristics (surface roughness, kerf width. dross) . Each variable has optimal value for good-qualify cut edge under fixed condition. And neural network after learning experimental data with a million time iteration could predict surface roughness of cut edge under arbitrary condition approximately.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.989-992
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• 1997

The objective of this study is to develop stencil cutting process and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width on the cut edge quality were investigated. In order to analyze the cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. A a results, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial gerber file for PCB stencil manufacturing.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.128-132
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• 2006

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355nm and 80MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow rate, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repetition rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20{\mu}m$ and $10{\mu}m$ at more than 500mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed of laser material process.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.11-15
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• 2007

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355 nm and 80 MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using a laser with UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repletion rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20\;{\mu}m$ and $10\;{\mu}m$ at more than 500 mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed in laser material process.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.106-113
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• 2002

Stencil is used normally as a mask for seeder pasting on pad of PCB. The objective of this study is to develop stencil cutting system and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width old the cut edge quality were investigated. In order to analyse fille cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. As a result, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial Gerber file for PCB stencil manufacturing.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.63-68
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• 2014

For a nanoscale Cu/low-k wafer, inter-layer dielectric (ILD) and metal layers peelings, cracks, chipping, and delamination are the most common dicing defects by traditional diamond blade saw process. Sidewall void in sawing street is one of the key factors to bring about cracks and chipping. The aim of this research is to evaluate laser grooving & mechanical sawing parameters to eliminate sidewall void and avoid top-side chipping as well as peeling. An ultra-fast pico-second (ps) laser is applied to groove/singulate the 28-nanometer node wafer with Cu/low-k dielectric. A series of comprehensive parametric study on the recipes of input laser power, repetition rate, grooving speed, defocus amount and street index has been conducted to improve the quality of dicing process. The effects of the laser kerf geometry, grooving edge quality and defects are evaluated by using scanning electron microscopy (SEM) and focused ion beam (FIB). Experimental results have shown that the laser grooving technique is capable to improve the quality and yield issues on Cu/low-k wafer dicing process.

• International Journal of Precision Engineering and Manufacturing
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• v.4 no.1
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• pp.23-29
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• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.33-38
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• 2012

An experimental study was carried out to observe the characteristics of impingement of assist gas from a rectangular supersonic nozzle on kerf surface in laser machining. A micro-scale supersonic (Mach number 2.0) rectangular nozzle system was designed and fabricated for the purposes, and hot tests of the performance of the nozzle system was proceeded in the ITI corporation laboratory. For various related parameters such as laser powers, nozzle pressures and cutting speeds, the quality of the frontal view of cut edge surfaces was observed by a microscope. In the study, it was shown that the application of the present micro-rectangular supersonic nozzle in an off-axis configuration made it possible to cut a mild steel, by combinations of relatively low laser - powers, large standoff distances, and assist gas with no oxygen, which was not achieved by conventional laser cutting processes.