• Journal of the Korea Institute of Military Science and Technology
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• v.11 no.4
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• pp.149-158
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• 2008

This article provides strength estimation of T-joint area which made of composite material. Inner and outer structures of medium range surveillance radar are all made of sandwich structure which is made with composite material(CFRP) and aluminum honeycomb core. Since the radar is voluminous and has very complex inner structure, the whole structure cannot be made as one piece. Therefore, usage of T-joints is inevitable. Since some of stress concentration areas were located around T-joint area, series of strength estimations were conducted. Three different configurations were tested to improve mechanical properties(primarily on strength). The results show an improvement on strength to meet calculated strength on stress concentrated T-joint area.

• Composites Research
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• v.22 no.2
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• pp.1-6
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• 2009

The mechanical characteristics of gamma-ray irradiated UHMWPE specimens were investigated under various heat treatment conditions. The heat treatment was performed in the range of annealing and remelting temperatures. The annealing treatment below the temperature of $130^{\circ}C$ hardly induced changes in the tensile strength, the strain at the failure and the hardness. However the remelting treatment above $140^{\circ}C$ deteriorated those mechanical properties. It was shown in an FTIR analysis that the annealing treatment caused some oxidation of free radicals created by the pretreatment of the irradiation. These quantitative data represented by the behavior of mechanical properties might be used as basic informations for the design and analysis of various artificial joints.

• Journal of the Korean Ceramic Society
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• v.39 no.10
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• pp.955-962
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• 2002

The microstructure change of brazed $Si_3N_4$/Stainless steel 316 joint with Cu buffer layer were examined to clarify the effects of brazing process conditions such as brazing time and temperature on the mechanical properties and reliability of brazed joints. For the brazed joint above 900${\circ}C$, the Cu buffer layer was completely dissolved into brazing alloy and the thickness of reaction product formed at $Si_3N_4$/brazing alloy joint interface was abruptly increased, which could increase the amounts of residual stress developed in the joint. The fracture strength of brazed $Si_3N_4$/Stainless steel 316 joint with Cu buffer layer at 950${\circ}C$ was much reduced comparing to those of joints brazed at the lower temperature. But, it was found that the effects of brazing time was not critical on the mechanical properties as well as the reliability of $Si_3N_4$/Stainless steel 316 joint with Cu buffer layer brazed at the temperature below 900${\circ}C$.

• Journal of Korean Society of Steel Construction
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• v.22 no.5
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• pp.455-463
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• 2010

This paper describes the experimental study on the mechanical characteristics of a steel plate-reinforced concrete joint. As an alternative reinforced concrete structure, the SC modular construction method is widely used and studied in the field ofindustrial facility field. However, the structure characteristics of RC and SC joint are not yet studied completely. In this paper, the beam-type construction joint of RC and SC walls was made to simulate the application of SC module to the large RC structure. Also, an out-of-plane loading was applied to the test specimen in order to evaluate flexural strength and structural properties of the beam-type RC-SC joint.

• Journal of Welding and Joining
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• v.20 no.2
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• Journal of the Korean Society of Safety
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• v.18 no.3
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• pp.69-74
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• 2003

To investigate the partial discharge and electric field distribution in cable joint parts, we measured the partial discharge and electric field in specimen. The specimens which cross-linked polyethylene(XLPE) and ethylene propylene diene ethylene(EPDM) are used to insulating material for underground cable md cable jointing parts. The polymers are used to insulating material in switchgear which is a kind of transformer equipment and in ultra-high voltage cable. Its using is increasing gradually, the electrical insulation properties are not only excellent but also mechanical property is excellent. And because it is possible to be made void of several type in insulator while it is produced, which the electrical field distribution is changed by void, it has a critical influence to insulator performance. The underground cable is connecting by the jointing material, insulating breakdown and the electric ageing which are caused by several mixing impurity and the damage of cable insulator layer, which reduced the life of cable while intermediate joint kit is connected. Therefore, the computer simulation is used to estimating insulator performance, XLPE is used to the insulating material of ultra-high voltage cable and EPDM is used to insulator layer in joint material kit, and which are produced as specimen. And it is analyzed the electric field concentrating distribution and partial discharge by modeling of computer simulation in void and cable joint kit.

• Proceedings of the KWS Conference
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• 2000.04a
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• pp.193-196
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• 2000

• Proceedings of the KWS Conference
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• 1999.05a
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• pp.98-99
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• 1999

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.63-65
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• 2003

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.112-113
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• 2001