• Title/Summary/Keyword: internal thermal conductance

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Influences of Wearing Different Thermal Insulated Clothings on Thermoregulatory Responses from $25^{\circ}C$ Environment to 18$^{\circ}C$ Environment ($25^{\circ}C$환경에서 $18^{\circ}C$환경으로 노출시 보온력이 상이한 의복의 착용이 체온조절 반응에 미치는 영향)

  • 이종민
    • Journal of the Korean Society of Clothing and Textiles
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    • v.22 no.7
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    • pp.826-832
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    • 1998
  • In order to understand the influences of wearing clothings with different thermal insula-tions when men were exposed from $25^{\circ}C$ environment to 18$^{\circ}C$ environment, thermoregulatory responses were measured on 4 healthy female college students. Subjects rested wearing T-shirts, trousers, and socks called LC(total weight 541g) at 25$\pm$1$^{\circ}C$, 50$\pm$5% R.H. and then exposed to the room conditioned in 18$\pm$1$^{\circ}C$, 50$\pm$5$^{\circ}C$ R.H. with LC as it was(LC Type) or with T-shirts, trousers, socks, training wear upper garment, the training wear lower garment called HC (total weight 1368g)(HC Type) for 120 min. The results can be summarized as follows: 1) When subjects were exposed from $25^{\circ}C$ environment to 18$^{\circ}C$ environment, decrease of rectal temperature was significantly smaller in LC Type than in HC Type. 2)Increase of heat production and weight loss had no significant difference between two types of clothing. 3)Internal thermal conductance was higher in HC Type and external thermal conductance was higher in LC Type. Therefore total thermal conductance was higher in LC Type than in HC Type. 4)Decrease of skin temperature was greater in LC Type than in HC Type. 5)Subjects felt colder with LC Type than with HC Type, but did not feel differently in comfort sensation between two types of clothing. It was suggested that less decrease of rectal temperature in LC type inspite of more dry heat loss from body might be ascribed to a shift of blood from the shell area to the core area originating in the vasoconstriction and the lowered internal thermal conductance. In conclu-sion, the importance of the state of internal heat distribution in the homeostasis seemed to be reaffirmed.

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Uncooled Microbolometer FPA Sensor with Wafer-Level Vacuum Packaging (웨이퍼 레벨 진공 패키징 비냉각형 마이크로볼로미터 열화상 센서 개발)

  • Ahn, Misook;Han, Yong-Hee
    • Journal of Sensor Science and Technology
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    • v.27 no.5
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    • pp.300-305
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    • 2018
  • The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

A Study on Design and Performance of a Heat pipe for the application to Solar collector (태양열 집열기용 열파이프의 구조와 작동 특성에 관한 연구)

  • 임광빈;김철주;박이동;황영규;강환국
    • Proceedings of the Korea Society for Energy Engineering kosee Conference
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    • 1993.05a
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    • pp.70-78
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    • 1993
  • Heat pipes, applied to flat plate solar collectors, have a long and slender configuration with relatively low heat flux on the evaporator. Such a heat pipe has a tendency to build-up a liquid pool at the lower half of evaporator zone, and at this pool occurs such complicated phenomena of evaporation and fluid dynamics as superheat, sudden generation of bubble, its likely explosive growth process and flooding etc. In the present study, we tried to solve those problems by means of adjusting the two principle design parameters, liquid fill charge and wick length, using 4 heat pipes and 3 thermosyphons, with different values of parameter respectively. The corresponding results can be summarized as followings, - The thermal conductance of heat pipes was largely improved by el eliminating wick from adiabatic and condenser zone. - But on evaporator zone wick is inevitable to reduce behavior of the build -up of liquid pool , where arise diverse internal complex phenomena. - The liquid fill charge should have to be increased by 10∼20% more than the quantity to saturate the wick.

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