• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.6
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• pp.269-275
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• 2005

Ni/Ni-aluminide/Ti/Ti-aluminide laminate composite, considered as a functionally gradient material, was manufactured by thin foil hot press technique. Thick intermetallic layers of NiAl and $TiAl_3$ were formed by a self-propagating high-temperature synthesis (SHS) reaction, and thin continuous taters of $Ni_3Al$ and TiAl were formed by a solid-state diffusion. Fracture resistance with loading along the crack arrester direction is higher than crack divider direction due to the interruption of crack growth in metal layers. The $Ni_3Al$ and NiAl intermetallic layer showed cleavage and intergranular fracture behavior, respectively, while the fracture mode of $TiAl_3$ layer was found to be an intragranular cleavage. The debonding between metal and intermetallic layer and the pores were observed in the Ni/Ni-aluminide layers, resulting in the lower fracture resistance. With the results of acoustic emission (AE) source characterization the real time of failure and the effect of AE to crack growth could be monitored.

• Applied Chemistry for Engineering
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• v.7 no.5
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• pp.913-924
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• 1996

In this study HDS(hydrodesulfurization) of thiophene was researched over nickel catalysts added with small amounts of neodymium which were prepared by different methods such as unsupported coprepricipitated NdNi catalysts, unsupported intermetallic $NdNi_5$ catalysts, and carbon supported NdNi catalyst. The HDS activity was remarkably increased when a small amounts of neodymium was added to unsupported coprecipitated Ni catalysts. Thus it was known that the role of Nd is important in HDS of thiophene of Ni catalysts. For the case of unsupported intermetallic $NdNi_5$, the intermetallic crystallinity was destroyed to oxide and sulfide after calcination and presulfidation respectively. The HDS activity of thiophene can be explained by surface area of unsupported catalysts. And Nd acts like as structural promoter keeping the high surface area of unsupported catalysts. The HDS activity was increased by each ten times based on 1 gr. of nickel in the order of unsupported intermetallic $NdNi_5$, unsupported coprecipitated NdNi, and carbon supported NdNi catalysts according to different preparation method of catalysts.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.61-67
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• 2003

The interfacial reaction between ultra-small 58Bi-42Sn solder and Au/Ni/Ti under bump metallurgy (UBM) for ultra-fine flip chip application was investigated. The ultra-small 58Bi-42Sn solder bump, about $46{\mu}m$ in diameter, was fabricated by using the lift-off method and reflowed using the rapid thermal annealing (RTA) system. The intermetallic compounds were characterized using a secondary electron microscopy (SEM), an energy dispersive spectroscopy (EDS), and an x-ray diffractometer (XRD). The faceted and polygonal intermetallic compounds were found in the Bi-Sn solder bumps on $Au(0.1{\mu}m)/Ni/Ti$ UBM and they were indentified as $(Au_xBi_yNi_{1-x-y})Sn_2$ Phase. The intermetallic compounds grown from the $Au(0.1{\mu}m)/Ni/Ti$ UBMinterface were dispersed in the solder bump.

• Korean Journal of Materials Research
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• v.25 no.6
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• pp.269-273
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• 2015

The effect of adding Ca on the microstructural and mechanical properties of as-cast Mg-11Li-3Zn-1Sn(wt%) alloys were investigated. Mg-11Li-3Zn-1Sn-0.4Mn with different Ca additions (0.4, 0.8, 1.2 wt%) were cast under an $SF_6$ and $Co_2$ atmosphere at $720^{\circ}C$. The cast billets were homogenized at $400^{\circ}C$ for 12h and extruded at $200^{\circ}C$. The microstructural and mechanical properties were analyzed by OM, XRD, SEM, and tensile tests. The addition of Ca to the Mg-11Li-3Zn-1Sn-0.4Mn alloy resulted in the formation of $Ca_2Mg_6Zn_3$, MgSnCa intermetallic compound. By increasing Ca addition, the volume fraction and size of $Ca_2Mg_6Zn_3$ with needle shape were increased. This $Ca_2Mg_6Zn_3$ intermetallic compound was elongated to the extrusion direction and refined to fine particles due to severe deformation during hot extrusion. The elongation of the 0.8 wt% Ca containing alloy improved remarkably without reduction strength due to the formation of fine grain and $Ca_2Mg_6Zn_3$ intermetallic compounds by Ca addition. It is probable that fine and homogeneous $Ca_2Mg_6Zn_3$ intermetallic compounds played a significant role in the increase of mechanical properties.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.54-56
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• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.35-41
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Korean Journal of Materials Research
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• v.15 no.7
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• pp.439-443
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• 2005

The oxidation behavior and the thermal stability of nanocrystalline Al-25Ti-8Mn intermetallic compound were investigated. $Al_3Ti$ intermetallic compound, which has a potential for high temperature structural material, was fabricated by mechanical alloying(MA) with $8at.\%$ Mn to enhance the thermal stability and ductility. And Al-25Ti-8Mn intermetallic compound was sintered by spark plasma sintering(SPS) at $700^{\circ}C$. After sintering process, cubic $Ll_2$ structure was maintained without phase transformation and the grain size was about 50nm. To investigate the oxidation behavior of the specimens, thermal gravimetric analysis(TGA) was performed at 700, 800, 900, and $1000^{\circ}C$ for 24 h in $O_2$. As the temperature increased from $700^{\circ}C\;to\;900^{\circ}C$ the weight gain of specimens increased. However at $1000^{\circ}C$, unlike the oxidation behavior of $700^{\circ}C\;to\;900^{\circ}C$, the weight gain of specimen decreased drastically and the transition from linear rate region to parabolic rate region occurred rapidly due to the dense $\alpha-Al_2O_3$.

• Korean Journal of Materials Research
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• v.18 no.1
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• pp.38-44
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• 2008

The micro-structural changes, strength characteristics, and micro-fractural behaviors at the joint interface between a Sn-4.0wt%Ag-0.5wt%Cu solder ball and UBM treated by isothermal aging are reported. From the reflow process for the joint interface, a small amount of intermetallic compound was formed. With an increase in the isothermal aging time, the type and amount of the intermetallic compound changed. The interface without an isothermal treatment showed a ductile fracture. However, with an increase in the aging time, a brittle fracture occurred on the interface due mainly to the increase in the size of the intermetallic compounds and voids. As a result, a drastic degradation in the shear strength was observed. From a microshear test by a scanning electron microscope, the generation of micro-cracks was initiated from the voids at the joint interface. They propagated along the same interface, resulting in coalescence with neighboring cracks into larger cracks. With an increase in the aging time, the generation of the micro-structural cracks was enhanced and the degree of propagation also accelerated.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.19 no.2
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• pp.161-176
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• 2021

In this study, the electrochemical behavior of Sm on the binary liquid Al-Ga cathode in the LiCl-KCl molten salt system is investigated. First, the co-reduction process of Sm(III)-Al(III), Sm(III)-Ga(III), and Sm(III)-Ga(III)-Al(III) on the W electrode (inert) were studied using cyclic voltammetry (CV), square-wave voltammetry (SWV) and open circuit potential (OCP) methods, respectively. It was identified that Sm(III) can be co-reduced with Al(III) or Ga(III) to form Al_zSm_y or Ga_xSm_y intermetallic compounds. Subsequently, the under-potential deposition of Sm(III) at the Al, Ga, and Al-Ga active cathode was performed to confirm the formation of Sm-based intermetallic compounds. The X-ray diffraction (XRD) and scanning electron microscopy-energy dispersive spectroscopy (SEM-EDS) analyses indicated that Ga₃Sm and Ga₆Sm intermetallic compounds were formed on the Mo grid electrode (inert) during the potentiostatic electrolysis in LiCl-KCl-SmCl₃-AlCl₃-GaCl₃ melt, while only Ga₆Sm intermetallic compound was generated on the Al-Ga alloy electrode during the galvanostatic electrolysis in LiCl-KCl-SmCl₃ melt. The electrolysis results revealed that the interaction between Sm and Ga was predominant in the Al-Ga alloy electrode, with Al only acting as an additive to lower the melting point.

• Journal of Powder Materials
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• v.30 no.2
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• pp.101-106
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• 2023

Liquid metal extraction (LME), a pyrometallurgical recycling method, is popular owing to its negligible environmental impact. LME mainly targets rare-earth permanent magnets having several rare-earth elements. Mg is used as a solvent metal for LME because of its selective and eminent reactivity with rare-earth elements in magnets. Several studies concerning the formation of Dy-Fe intermetallic compounds and their effects on LME using Mg exist. However, methods for reducing these compounds are unavailable. Fe reacts more strongly with B than with Dy; B addition can be a reducing method for Dy-Fe intermetallic compounds owing to the formation of Fe₂B, which takes Fe from Dy-Fe intermetallic compounds. The FeB alloy is an adequate additive for the decomposition of Fe₂B. To accomplish the former process, Mg must convey B to a permanent magnet during the decomposition of the FeB alloy. Here, the effect of Mg on the transfer of B from FeB to permanent magnet is observed through microstructural and phase analyses. Through microstructural and phase analysis, it is confirmed that FeB is converted to Fe₂B upon B transfer, owing to Mg. Finally, the transfer effect of Mg is confirmed, and the possibility of reducing Dy-Fe intermetallic compounds during LME is suggested.