• Proceedings of the KWS Conference
• /
• 2005.06a
• /
• pp.31-33
• /
• 2005

In this study, the interfacial reactions and electrical properties of the Sn-35(wt%)Pb-2(wt%)Ag/Cu BGA solder joints after the thermal shock test were investigated with three different kinds of the underfill used commercially. The microstructural evolutions of the solder joints were observed using a scanning electron microscopy (SEM) and the electrical resistance of the solder joints were evaluated with the numbers of thermal shock cycle using the four-prove method. The increase in the $Cu_{6}Sn_{5}$ IMC thickness led to the increase in the electrical resistance with increasing the numbers of the thermal shock cycle. The increase in the electrical resistance of the BGA packages with the underfill was smaller than that without the underfill. The silica contained underfill led to the higher electrical resistance.

• Progress in Superconductivity and Cryogenics
• /
• v.15 no.2
• /
• pp.48-51
• /
• 2013

The thermal contact resistance (TCR) is one of the important components in the cryogenic systems. Especially, cryogenic measurement devices using a cryocooler can be affected by TCR because the systems have to consist of several metal components in contact with each other for heat transferring to the specimen without cryogen. Therefore, accurate measurement and understanding of TCR is necessary for the design of cryogenic measurement device using a cryocooler. The TCR occurs at the interface between metals and it can be affected by variable factors, such as roughness of metal surface, contact area and contact pressure. In this study, we designed TCR measurement system at various temperatures using a cryocooler as a heat sink and used steady state method to measure the TCR between metals. The copper is selected as a specimen in the experiment because it is widely used as a heat transfer medium in the cryogenic measurement devices. The TCR between Cu and Cu is measured for various temperatures and contact pressures. The effect of the interfacial materials on the TCR is also investigated.

• Journal of Adhesion and Interface
• /
• v.18 no.1
• /
• pp.1-7
• /
• 2017

This study is about basic sensor experiment using PDPS by common pencil. 20 mm length, 3 mm thickness of line using 4B pencil is optimum condition. In order to be stable at point of contact between pencil line and copper wire, silver paste is needed. At using the PDPS, thermal detecting is able and thermal properties is inversely proportional to electrical resistance in the based on empirical formula. The sensor can be also used in the composites mold via the empirical formula by the relationship between thermal impact and electrical resistance. The change of electrical resistance relates the interfacial property of composites. It leads to expectation of properties.

• Transactions of Materials Processing
• /
• v.27 no.3
• /
• pp.145-153
• /
• 2018

Magnesium material could be widely used in the automotive industry because of its high strength to weight ratio, but the electric resistance spot welding process of magnesium sheets is difficult because of its low electric resistance and high thermal conduction and thermal expansion. For this reason, an electric resistance surface friction spot welding process using rotating dies is suggested for the spot welding of magnesium metal sheets. This welding method can be characterized by three heating methods: (1) electric resistance heating on contacted surface, (2) surface friction heating by rotating dies, and (3) thermal conduction heating from heated steel electrodes, for the fusion of metal at the interfacial zone between the two magnesium sheets. This welding process also has variables to explore, such as welding currents, diameters of the steel electrode, and rotating dies. It was found that the welding strength could reach industrial requirements by applying a welding current of 11.0kA, with steel electrodes of 12mm diameter, with rotating dies of 4.4 mm diameter, under the condition of a revolution speed of 1200rpm of rotating dies, for the surface friction spot welding process of AZ31 magnesium alloy sheets of 1.4mm thickness.

• Composites Research
• /
• v.16 no.2
• /
• pp.62-67
• /
• 2003

Interfacial properties and damage sensing for the carbon fiber/epoxy-amine terminated (AT)-polyetherimide (PEI) composite were performed using microdroplet test and electrical resistance measurements. As AT-PEI content increased, the fracture toughness of epoxy-AT-PEI matrix increased, and interfacial shear strength (IFSS) increased due to the improved fracture toughness by energy absorption mechanisms of AT-PEI phase. The microdroplet in the carbon fiber/neat epoxy composite showed brittle microfailure mode. At 15 phr AT-PEI content ductile microfailure mode appeared because of improved fracture toughness. After curing, the change in electrical resistance $\Delta\textrm{R}$) with increasing AT-PEI content increased gradually because of thermal shrinkage. Under cyclic stress, in the neat epoxy case the reaching time until same stress was faster and their slope was higher than those of 15 phr AT-PEI. The result obtained from electrical resistance measurements under curing process and reversible stress/strain was correspondence well with matrix toughness properties.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2002.05c
• /
• pp.53-57
• /
• 2002

Reduction of insulation thickness would be beneficial not only for increasing the cable length but would also improve its thermal performance. An interfacial diffusion method was devised to reduce insulation thickness by improving the interfacial properties of XLPE cable insulation. In this paper, to evaluate superficially the interface properties between XLPE insulation and semiconducting layer, the dielectric and insulation properties of tan${\delta}$ and volume resistance were measured with temperature dependence. Above the results, dielectirc and insulation properties with semiconductor/XLPE were more anormal than its bulk caused by the interfacial properties.

• Proceedings of the Korean Society For Composite Materials Conference
• /
• 2000.11a
• /
• pp.17-21
• /
• 2000

Logarithmic electrical resistivity of the untreated or thin diameter carbon fiber composite increased suddenly to the infinity when the fiber fracture occurred by tensile electro-micromechanical test, whereas that of the ED or thick fiber composite increased relatively broadly up to the infinity. Electrical resistance of single-carbon fiber composite increased suddenly due to electrical disconnection by the fiber fracture in tensile electro-micromechanical test, whereas that of SFC increased stepwise due to the occurrence of the partial electrical contact with increasing the buckling or overlapping in compressive test. Electrical resistivity measurement can be very useful technique to evaluate interfacial properties and to monitor curing behavior of single-carbon fiber/epoxy composite under tensile/compressive loading.

• Composites Research
• /
• v.31 no.6
• /
• pp.412-420
• /
• 2018

In this work, phenolic resins containing conductive carbon fillers, such as, petroleum coke, carbon black, and graphite, were used to improve the surface heating elements by impregnating a pitch-based carbon paper. The influence of conductive carbon fillers on physicochemical properties of the carbon paper was investigated through electrical resistance measurement and thermal analysis. As a result, the surface resistance and interfacial contact resistivity of the carbon paper were decreased linearly by impregnating the carbon fillers with phenol resins. The increase of carbon filler contents led to the improvement of electrical and thermal conductivity of the carbon paper. Also, the heating characteristics of the surface heating element were examined through the applied voltage of 1~5 V. With the applied voltage, it was confirmed that the surface heating element exhibited a maximum heating characteristic of about $125.01^{\circ}C$(5 V). These results were attributed to the formation of electrical networks by filled micropore between the carbon fibers, which led to the improvement of electrical and thermal properties of the carbon paper.

• Journal of Ceramic Processing Research
• /
• v.13 no.spc2
• /
• pp.428-432
• /
• 2012

Polyamidimide (PAI)-colloidal silica (CS) nanohybrid films were synthesized by an advanced sol-gel process. The synthesized PAI-CS hybrid films have a uniform and stable chemical bonding and there is no interfacial defects observed by TEM. The thermal degradation ratio of PAI-CS (10 wt%) hybrid films is delayed by 100 ℃ compared with pure PAI sample determined by on set temperature range in TGA. The dielectric constant of PAI-CS (10 wt%) hybrid films decreases with increasing CS content up to about 5 wt% but increases at higher CS content, which is not explained simply by effective medium therories (EMT). The duration time of PAI-CS (10 wt%) hybrid coil is 38 sec, which is very longer than that of pure PAI coil sample. The PAI-CS (10 wt%) hybrid film has a higher breakdown voltage resistance than the pure PAI film at surge environment and exhibits superior heat resistance. The PAI-CS (10 wt%) sample shows the advanced and stable thermal emission properties in transformer module compared with the pure PAI sample. This result illustrates that the advanced thermal conductivity and expansion properties of PAI-CS sample in the case of appropriate sol-gel processes brings the stable thermal emission in transformer system. Therefore, new PAI-CS hybrid samples with such stable thermal emission properties are expected to be used as a high functional coating application in ET, IT and electric power products.

• Korean Chemical Engineering Research
• /
• v.58 no.1
• /
• pp.64-68
• /
• 2020

In this study, metal copper clad laminate can be prepared using epoxy composite filled with thermally conductive fillers. In order to improve the thermal conductivity of epoxy composites, it is important factor to form conductive networks through appropriate packing of conductive fillers in epoxy composite matrix and to decrease the amount of thermally resistant junctions involving a epoxy composite matrix layer between adjacent filler units. This is because epoxy has a thermal conductivity of only 0.2-0.3W, so in order to maintain high thermal conductivity, thermally conductive fillers are connected to each other, so that the gap between particles can be reduced to reduce thermal resistance. The purpose of this study is to find way to achieve highly thermally conductive in the epoxy composite matrix filled with Al₂O₃ and Boron Nitride(BN) filler by filler loading and uniform dispersion. As a results, the use of Al₂O₃/BN hybrid filler in epoxy matrix was found to be effective in increasing thermal conductivity of epoxy composite matrix due to the enhanced connectivity offered by more continuous thermally conductive pathways and uniform dispersion without interfacial voids in epoxy composite matrix. In addition, surface treatmented s-BN improves the filler dispersion and adhesion between the filler and the epoxy matrix, which can significantly decrease the interfacial thermal resistance and increase the thermal conductivity of epoxy composite matrix.