• Journal of the Korean Wood Science and Technology
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• v.44 no.3
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• pp.315-322
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• 2016

Block-glued glulam is a structural material that can be used as a construction member of a large-section wooden building, which is produced by edgewise bonding of two or more glulam beam elements. The edgewise bonding performance of the block-glued glulam was examined through delamination test and block shear strength test. According to the test results, the block-glued glulam that was manufactured with 1.5 MPa of compressive pressure after applying $500g/m^2$ of Resorcinol adhesive showed the best edgewise bonding performance. The block-glued glulam produced in a good edgewise bonding condition was compared with a control glulam with the same section modulus for bending strength performance. The modulus of elasticity (MOE) in bending was similar to that of the control glulam. The modulus of rupture (MOR) of the block-glued glulam was higher by 27% than that of the control glulam. No interfacial failure or cohesive failure were observed in the edgewise bonding layer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.7 s.250
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• pp.779-786
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• 2006

Woven sisal textile reinforced composites were manufactured to evaluate fracture toughness, and tensile test. All specimens were immersed in water five times. All specimens are immersed in pure water during 9 days at room temperature, and dried in 1 day at $50^{\circ}C$. Two kinds of polymer matrices such as epoxy and vinyl-ester were used. Fractured surface were investigated to study the failure mechanism and fiber/matrix interfacial adhesion. It is shows that it can be enhanced to improve their mechanical performance to reveal the relationship between fracture toughness and water absorption fatigue according to different polymer matrices. Water uptake of the epoxy composites was found to increase with cycle times. Mechanical properties are dramatically affected by the water absorption cycles. Water-absorbed samples observed poor mechanical properties such as lower values of maximum strength and extreme elongation. The $K_{IC}$ values demonstrate a decrease in inclination with increasing cyclic times of wetting and drying fur the epoxy and vinyl-ester.

• The Korean Journal of Ceramics
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• v.3 no.2
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• pp.73-81
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• 1997

In this paper, it is intended to present more reproducible and quantitative method for adhesion assemssement. In scratch test, micromechanical analysis on the stress state beneath the indenter was carried out considering the additional blister field. The interface adhesion was quantified as work of adhesion through Griffith energy approach on the basis of the analyzed stress state. The work of adhesion for DLC film/WC-Co substrate calculated through the proposed analysis shows the identical value regardless of distinctly different critical loads measured with the change of film thickness and scratching speed. On the other hand, uniaxial loading was imposed on DCL film/Al substrate, developing the transverse film cracks perpendicular to loading direction. Since this film cracking behavior depends on the relative magnitude of adhesion strength to film fracture strength, the quantification of adhesion strength was given a trial through the micromechanical analysis of adhesion-dependence of film cracking patterns. The interface shear strength can be quantified from the measurement of strain $\varepsilon$s and crack spacing $\lambda$ at the cessation of film cracking.

• Korean Journal of Materials Research
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• v.14 no.9
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• pp.649-654
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• 2004

In this paper, the fracture toughness and mechanisms of failure in a random SiC-whisker/$Al_{2}O_3$ ceramic composite were investigated using in situ observations during mode I(opening) loading. $SiC_{w}/Al_{2}O_3$ composite was obtained by hot press sintering of $Al_{2}O_3$ powder and SiC whisker as the matrix and reinforcement, respectively. The whisker and powder were mixed using a turbo mill. The composite was produced at SiC whisker volume fraction of $0.3\%$. Compared with monolithic $Al_{2}O_3$, fracture toughness enhancement was observed in $SiC_{w}/Al_{2}O_3$ composite. This improved fracture toughness was attributed to SiC whisker bridging and crack deflection. $SiC_{w}/Al_{2}O_3$ composite exhibited typically brittle fracture behavior, but a fracture process zone was observed in this composite. This means that the load versus load-line displacement curve of $SiC_{w}/Al_{2}O_3$ composite from a fracture test may involve a small non-linear region near the peak load.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.439-449
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• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

• Journal of the Korean Society of Safety
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• v.30 no.6
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• pp.7-11
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• 2015

The present study investigates the impact shear strength of thermal aged Sn-3Ag-0.5Cu lead-free solder joints at impact speeds ranging from 0.5 m/s to 2.5 m/s. The specimens were thermal aged for 24, 100, 250 and 1000 hours at $100^{\circ}C$. The experimental results demonstrate that the shear strength of the solder joint decreases with an increase in the load speed and aging time. The shear strength of the solder joint aged averagely decreased by 43% with an increase in the strain rate. For the as-reflowed specimens, the mode II stress intensity factor ($K_{II}$) of interfacial IMC between Sn-3.0Ag-0.5Cu and a copper substrate also was found to decrease from $1.63MPa.m^{0.5}$ to $0.97MPa.m^{0.5}$ in the speed range tested here. The degradations in the shear strength and fracture toughness of the aged solder joints are mainly caused by the growth of IMC layers at the solder/substrate interface.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.121-126
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• 2000

Metal/Ceramic structures have many attractive properties, with great potential for applications that demand high stiffness, as well as chemical and biological stability, thermal and electrical insulation. They are currently in use for mechanical and thermal protection in cutting tool and engine parts. With all their great advantage, ceramics suffer from one major problem they are brittle, and are especially susceptible to cracking from surface contacts. Delamination at the interfaces with adjacent layers is a particularly disturbing problem, and can cause premature failure of a composite system. so determination of adhesive properties of coating is one of the most important problems for the extension of the use of coated materials. In this work, mechanical characteristics of Interface of ceramic/Metal composites are evaluated by means of hardness test, indentation test apparent interfacial toughness and bonding strength test. The interface indentation test provides a relation between the applied load(P) and the length of the crack(a) created at the interface between the coating and the substrate.

• Journal of the Korean Applied Science and Technology
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• v.17 no.4
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• pp.262-266
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• 2000

Acrylic pressure sensitive adhesives of n-butyl acrylate, 2-ethyl acrylate, methyl acrylate, vinyl acetate, acrylic acid, acrylonitrile and 2-hydroxyethyl acrylate were synthesized and basic physical properties of pressure sensitive adhesives with increasing the contents of 2-hydroxyethyl acrylate were investigated. 2-Hydroxyethyl acrylates effects on glass transition temperature, viscosity, hardening time and peel strength. Glass transition temperature(Tg) decreased with increasing the contents of 2-hydroxyethyl acrylate. Viscosity and hardening time were increased with increasing the contents of 2-hydroxyethyl acrylate. On the other hands, peel strength increased with increasing the contents of 2-hydroxyethyl acrylate up to 6 wt% and the decreased at further higher contents of 2-hydroxyethyl acrylate. In peel test, interfacial failure was occured in 8 wt% and 10wt%.

• Journal of Ocean Engineering and Technology
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• v.29 no.2
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• pp.186-190
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• 2015

$TiO_2$ nanoparticles can be used to improve the performance of carbon fiber-reinforced epoxy resin composites. In this study, the effect of the size of $TiO_2$ nanoparticles on the mechanical properties of carbon fiber-reinforced epoxy resin composites was investigated. The size of the $TiO_2$ nanoparticles was easily controlled using heat treatment. The size of the $TiO_2$ nanoparticles for this study were20nm, 100nm, and 200nm. Three types of carbon fibers with different diameters were also used in this study. The carbon fiber-reinforced epoxy resin composites with 20-nm $TiO_2$ powder showed the highest tensile strength compared to the other types of CFRP, regardless of the fiber maker or fiber diameter. The size of the $TiO_2$ powder and the diameter of the carbon fiber strongly affected the interfacial properties of all kinds of CFRP in this study.