• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.65-74
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• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.

• Journal of the Korea institute for structural maintenance and inspection
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• v.16 no.2
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• pp.10-18
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• 2012

Most of studies on existing strengthening methods were mainly on increase of stiffness and strength of shear strengthening to rectangular beam. As concrete of beam and slab is poured simultaneously on the characteristics of construction in reinforced concrete beam-slab structure, adjacent slab uniformed after hardening has T-shaped beam cross section which makes the flange of beam, enhances the stiffness of the beam and widens the area supporting compressive strength, but available data of flexural behavior of T-shaped beam are lacking. In this research the T-shaped beams would be made, then the reinforced effects and structural properties can be estimated according to the kinds of reinforced materials and reinforced position. The conclusions are shown as below. To sum up the experimental results, The specimen which was reinforce by CB embedded inside of concrete indicated excellent resistive behavior, internal force and stiffness when it was destroyed. The steel plate reinforced specimen of stiffness and internal force were increase but it expressed lower reinforce effects because of lowering anchored force between concrete. Fiber sheet strengthening showed superior effects but the interfacial delamination was found due to the lack of anchored force in destruction. So the measure is needed now.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.105-111
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• 2023

Electronic devices have been evolved to be mechanically flexible that can be endured repetitive deformation. This evolution emphasizes the importance of long-term reliability in metal wiring connecting electronic components, especially under bending fatigue in compressed environments. This study investigated methods to enhance adhesion between copper (Cu) and polyimide (PI) substrates, aiming to improve the reliability of copper wiring under such conditions. We applied oxygen plasma treatment and introduced a chromium (Cr) adhesion layer to the polyimide substrate. Our findings revealed that these adhesion enhancement methods significantly affect compression fatigue behavior. Notably, the chromium adhesion layer, while showing weaker fatigue characteristics at 1.5% strain, demonstrated superior performance at 2.0% strain with no delamination, outperforming other methods. These results offer valuable insights for improving the reliability of flexible electronic devices, including reducing crack occurrence and enhancing fatigue resistance in their typical usage environments.