• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.9-19
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• 2020

Transferring of functional nanofilms onto target substrates is a cornerstone to developing nanofilm-based nextgeneration applications. In this work, we provide a brief review of recent advances on nanofilm transfer methods by categorizing them into the following three methods: wet-etching transfer, electrochemical delamination, and mechanical transfer. Furthermore, the mechanical transfer method, which is regarded as a promising technology owing to its facile, substrate recyclable, and widely applicable process, is overviewed by focusing on fracture mechanics approaches. Finally, the perspectives and challenges for future development of the mechanical transfer method are discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.11
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• pp.2771-2776
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• 2000

In this work, the effect of surface treatment of prepreg on the mode I fracture behavior was studied. Unidirectional (0-deg) double cantilever beam (DCB) specimens were used for fracture tests. Two groups of DCB specimens were made: the first group was made of prepregs surface-treated by Ar(sup)+ ion beam under oxygen environment and the second group was made of regular prepregs. For both groups, fracture resistance curve (R-curve) was determined and compared to each other, Results showed that resistance behavior of the first group is better than that of the second group. That is, mode I fracture toughness, G(sub)Ic of the first group is 24% larger than that of the second group. SEM examination shows that the improvement of G(sub)Ic is due to the increase of interfacial strength between plies.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.1
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• pp.7-18
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• 1998

In the flip chip interconnection on organic substrates using eutectic Pb/Sn solder bumps highly reliable Under Bump Metallurgy (UBM) is required to maintain adhesion and solder wettability. Various UBM systems such as 1$\mu$m Al/0.2$\mu$m Pd/1$\mu$m Cu, laid under eutectic Pb/Sn solder were investigated with regard to their interfacial reactions and adhesion proper-ties. The effects of numbers of solder reflow and aging time on the growth of intermetallic compounds (IMCs) and on the solder ball shear strength were investigated. Good ball shear strength was obtained with 1$\mu$m Al/0.2$\mu$m Ti/5$\mu$m Cu and 1$\mu$m Al/0.2$\mu$m ni/1$\mu$m Cu even after 4 solder reflows or 7 day aging at 15$0^{\circ}C$. In contrast 1$\mu$m Al/0.2$\mu$m Ti/1$\mu$m Cu and 1$\mu$mAl/0.2$\mu$m Pd/1$\mu$m 쳐 show poor ball shear strength. The decrease of the shear strength was mainly due to the direct contact between solder and nonwettable metal such as Ti and Al resulting in a delamination. In this case thin 1$\mu$m Cu and 0.2$\mu$m Pd diffusion barrier layer were completely consumed by Cu-Sn and pd-Sn reaction.

• Journal of Fisheries and Marine Sciences Education
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• v.9 no.2
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• pp.188-197
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• 1997

The fracture toughness of three different kinds of epoxy-matrix composites containing the same volume fraction of reinforcement and the variation of fracture toughness of glass-carbon fiber/epoxy hybrid composites due to the change of test temperature and different glass fiber content were investigated in this study. Glass fiber/epoxy composite provided much higher fracture toughness than that of other composites because of the high strain at failure of glass fiber. Particularly the carbon fiber/epoxy composite exhibited the low fracture toughness caused by the low strain energy absorbing capacity of carbon fiber. And it was found that the strain at failure of reinforcement and interfacial delamination absorbing a significant amount of impact energy played an important role to increase fracture toughness of composites. The fracture toughness of the glass-carbon fiber hybrid composites increased with increasing the glass fiber content and decreased with raising the test temperature. The residual stress arising from the different thermal expansion between the matrix and reinforcement influenced the fracture toughness of composites.

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.121-126
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• 2000

Metal/Ceramic structures have many attractive properties, with great potential for applications that demand high stiffness, as well as chemical and biological stability, thermal and electrical insulation. They are currently in use for mechanical and thermal protection in cutting tool and engine parts. With all their great advantage, ceramics suffer from one major problem they are brittle, and are especially susceptible to cracking from surface contacts. Delamination at the interfaces with adjacent layers is a particularly disturbing problem, and can cause premature failure of a composite system. so determination of adhesive properties of coating is one of the most important problems for the extension of the use of coated materials. In this work, mechanical characteristics of Interface of ceramic/Metal composites are evaluated by means of hardness test, indentation test apparent interfacial toughness and bonding strength test. The interface indentation test provides a relation between the applied load(P) and the length of the crack(a) created at the interface between the coating and the substrate.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.364-367
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• 2007

In nano-imprint lithography (NIL) process, which has shown to be a good method to fabricate polymeric patterns, several kinds of pattern defects due to thermal effects during polymer flow and mold release operation have been reported. A typical defect in NIL process with high aspect ratio and low resist thickness pattern is a resist fracture during the mold release operation. It seems due to interfacial adhesion between polymer and mold. However, in the present investigation, FEM simulation of NIL molding process was carried out to predict the defects of the polymer pattern and to optimize the process by FEA. The embossing operation in NIL process was investigated in detail by FEM. From the analytical results, it was found that the lateral flow of polymer resin and the applied pressure in the embossing operation induce the weld line and the drastic lateral strain at the edge of pattern. It was also shown that the low polymer-thickness result in the delamination of polymer from the substrate. It seems that the above phenomena cause the defects of the final polymer pattern. To reduce the defect, it is important to check the initial resin thickness.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.3
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• pp.326-333
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• 2010

In this study, DAQ and TRA modules were applied to the CFRP single specimen testing method using AE. A method for crack identification in CFRP specimens based on k-mean clustering and wavelet transform analysis are presented. Mode I on DCB under vertical loading and mode II on 3-points ENF testing under share loading have been carried out, thereafter k-mean method for clustering AE data and wavelet transition method per amplitude have been applied to investigate characteristics of interfacial fracture in CFRP composite. It was found that the fracture mechanism of Carbon/Epoxy Composite to estimate of different type of fractures such as matrix(epoxy resin) cracking, delamination and fiber breakage same as AE amplitude distribution using a AE frequency analysis. In conclusion, the presented results provide a foundation for using wavelet analysis as efficient crack detection tool. The advantage of using wavelet analysis is that local features in a displacement response signal can be identified with a desired resolution, provided that the response signal to be analyzed picks up the perturbations caused by the presence of the crack.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.7
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• pp.929-933
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• 2010

Four-point bending tests were performed to investigate the interfacial adhesion of Cu-Cu bonding fabricated by thermo-compression process for three dimensional packaging. A pair of Cu-coated Si wafers was bonded under a pressure of 15 kN at $350^{\circ}C$ for 1 h, followed by post annealing at $350^{\circ}C$ for 1 h. The bonded wafers were diced into $30\;mm\;{\times}\;3\;mm$ pieces for the test. Each specimen had a $400-{\mu}m$-deep notch along the center. An optical inspection module was installed in the testing apparatus to observe crack initiation at the notch and crack propagation over the weak interface. The tests were performed under a fixed loading speed, and the corresponding load was measured. The measured interfacial adhesion energy of the Cu-to-Cu bonding was $9.75\;J/m^2$, and the delaminated interfaces were analyzed after the test. The surface analysis shows that the delamination occurred in the interface between $SiO_2$ and Ti.

• Journal of the Korean Society for Nondestructive Testing
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• v.26 no.2
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• pp.77-83
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• 2006

Ultrasonic nonlinearity has been considered as a solution for the detection of microcracks or interfacial delamination in a layered structure. The distinguished phenomenon in nonlinear ultrasonics is the generation of higher-order harmonic waves during the propagation. Therefore, in order to quantify the nonlinearity, the conventional method measures a parameter defined as the amplitude ratio of a second-order harmonic component and a fundamental frequency component included in the propagated ultrasonic wave signal. However, its application In field inspection is not easy at the present stage because no standard methodology has yet been made to accurately estimate this parameter. Thus, the aim of this paper is to propose an advanced signal processing technique for the precise estimation of a nonlinear ultrasonic parameter, which is based on power spectral and bispectral analysis. The method of estimating power spectrum and bispectrum of the pulse-like ultrasonic wave signal used in the commercial SAM (scanning acoustic microscopy) equipment is especially considered in this study The usefulness of the proposed method Is confirmed by experiments for a Newton ring with a continuous air gap between two glasses and a real semiconductor sample with local delaminations. The results show that the nonlinear parameter obtained tv the proposed method had a good correlation with the delamination.

• Composites Research
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• v.30 no.5
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• pp.316-322
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• 2017

Carbon fiber is a material with excellent mechanical, electrical and thermal properties, which is widely used as a composite material made of a polymer matrix. However, this composite material has a weak point of interlaminar delamination due to weak interfacial bond with polymer matrix compared with high strength and elasticity of carbon fiber. In order to solve this problem, it is essential to use reinforcements. Due to excellent mechanical properties, graphene have been expected to have large improvement in physical properties as a reinforcing material. However, the aggregation of graphene and the weak interfacial bonding have resulted in failure to properly implement reinforcement effect. In order to solve this problems, dispersibility will be improved. In this study, functionalization of graphene nanoplatelet was proceeded with melamine and mixed with epoxy polymer matrix. The carbon fiber reinforced polymer composites were fabricated using the prepared graphene nanoplatelet/epoxy and flexural properties and interlaminar shear strength were measured. As a result, it was confirmed that the dispersibility of graphene nanoplatelet was improved and the mechanical properties of the composite material were increased.