• Title/Summary/Keyword: interfacial delamination

검색결과 62건 처리시간 0.036초

탄소섬유시트를 사용한 철근콘크리트 구조물의 휨 보강에 관한 실험적 연구 (An Experimental Study on Flexural Repair of Reinforced Concrete Beams with the CFRP Sheet)

  • 박정원;박상렬;민창식
    • 한국콘크리트학회:학술대회논문집
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    • 한국콘크리트학회 2000년도 봄 학술발표회 논문집
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    • pp.781-786
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    • 2000
  • This paper presents the behavior and strenghening effect of reinforced concrete rectangular beams strengthened sing CFRP sheets with different strengthening level. In general, normally strengthened beams are failed by interfacial shear failure (delamination) within concrete, instead of by tensile failure of the CFRP sheets. The delamination occurred suddenly and the concrete cover cracked vertically by flexure was spalled off due to the release energy. The ultimate load considerably increased with an increase of strengthening level, while the ultimate deflection significantly decreased. The tensile force of CFRP sheets and average shear stress of concrete at delamination failure were curvilinearly proportional to the strengthening level. Therefore, the increment of ultimate load obtained by strengthening was curvilinearly proportional to th strengthening level.

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Strengthening Effect of R/C Beams with different Strengthening Level

  • Park, Sang-Yeol;Park, Jeong-Won;Min, Chang-Shik
    • KCI Concrete Journal
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    • 제12권1호
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    • pp.113-120
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    • 2000
  • This paper presents the behavior and strengthening effect of reinforced concrete rectangular beams strengthened using CFRP sheets with different strengthening level. In general, normally strengthened beams are failed by interfacial shear failure (delamination) within concrete, instead of by tensile failure of the CFRP sheets. The delamination occurred suddenly and the concrete cover cracked vertically by flexure was spalled off due to the release energy. The strengthened beams were stiffer than the control beam before and after reinforcement yielding. The ultimate load considerably increased with an increase of strengthening level, while the ultimate deflection significantly decreased. The tensile force of CFRP sheets and average shear stress of concrete at delamination failure were curvilinearly proportional to the strengthening level. Therefore, the increment of ultimate load obtained by strengthening was curvilinearly proportional to the strengthening level. The averaged horizontal shear stress of concrete at the interface ranges between (equation omitted) and (equation omitted) (in kg/$\textrm{cm}^2$) depending on strengthening level.

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INFLUENCE OF INVESTMENT/CERAMIC INTERACTION LAYER ON INTERFACIAL TOUGHNESS OF BODY CERAMIC BONDED TO LITHIA-BASED CERAMIC

  • Park, Ju-Mi
    • 대한치과보철학회지
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    • 제44권6호
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    • pp.683-689
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    • 2006
  • Statement of problem. Interfacial toughness is important in the mechanical property of layered dental ceramics such as core-veneered all-ceramic dental materials. The interfaces between adjacent layers must be strongly bonded to prevent delamination, however the weak interface makes delamination by the growth of lateral cracks along the interface. Purpose. The purpose of this study was to determine the effect of the reaction layer on the interfacial fracture toughness of the core/veneer structure according to the five different divesting. Materials and methods. Thirty five heat-pressed Lithia-based ceramic core bars (IPS Empress 2), $20mm{\times}3mm{\times}2mm$ were made following the five different surface divesting conditions. G1 was no dissolution or sandblasting of the interaction layer. G2 and G3 were dissolved layer with 0.2% HF in an ultrasonic unit for 15min and 30 min. G4 and G5 were dissolved layer for 15min and 30min and then same sandblasting for 60s each. We veneered bilayered ceramic bars, $20mm{\times}2.8mm{\times}3.8mm$(2mm core and 1.8mm veneer), according to the manufacturer's instruction. After polishing the specimens through $1{\mu}m$ alumina, we induced five cracks for each of five groups within the veneer close to interface under an applied indenter load of 19.6N with a Vickers microhardness indenter. Results. The results from Vickers hardness were the percentage of delamination G1:55%, G2:50%, G3:35%, G4:0% and G5:0%. SEM examination showed that the mean thickness of the reaction layer were G1 $93.5{\pm}20.6{\mu}m$, G2 $69.9{\pm}14.3{\mu}m$, G3 $59.2{\pm}20.2{\mu}m$, G4 $0.61{\pm}1.44{\mu}m$ G5 $0{\pm}0{\mu}m$. The mean interfacial delamination crack lengths were G1 $131{\pm}54.5{\mu}m$, G2 $85.2{\pm}51.3{\mu}m$, and G3 $94.9{\pm}81.8{\mu}m$. One-way ANOVA showed that there was no statistically significant difference in interfacial crack length among G1, G2 and G3(p> 0.05). Conclusion. The investment reaction layer played important role at the interfacial toughness of body ceramic bonded to Lithia-based ceramic.

Suppression of interfacial crack for foam core sandwich panel with crack arrester

  • Hirose, Y.;Hojo, M.;Fujiyoshi, A.;Matsubara, G.
    • Advanced Composite Materials
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    • 제16권1호
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    • pp.11-30
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    • 2007
  • Since delamination often propagates at the interfacial layer between a surface skin and a foam core, a crack arrester is proposed for the suppression of the delamination. The arrester has a semi-cylindrical shape and is arranged in the foam core and is attached to the surface skin. Here, energy release rates and complex stress intensity factors are calculated using finite element analysis. Effects of the arrester size and its elastic moduli on the crack suppressing capability are investigated. Considerable reductions of the energy release rates at the crack tip are achieved as the crack tip approached the leading edge of the crack arrester. Thus, this new concept of a crack arrester may become a promising device to suppress crack initiation and propagation of the foam core sandwich panels.

유한요소 해석을 통해 온도와 상대습도에 따른 수분 흡습 및 탈습을 반영한 반도체 패키지 구조의 박리 예측 (Delamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative Humidity)

  • 엄희진;황연택;김학성
    • 마이크로전자및패키징학회지
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    • 제29권3호
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    • pp.37-42
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    • 2022
  • 최근 반도체 패키지 구조는 점점 더 얇아지고 복잡해지고 있다. 두께가 얇아짐에 이종 계면에서 물성차이에 의한 박리는 심화될 수 있으며 따라서 계면의 신뢰성이 패키징 설계에 중요한 요소라 할 수 있다. 특히, 반도체 패키징에 많이 사용되는 폴리머는 온도와 수분에 영향을 크게 받기 때문에 환경에 따른 물성 변화 고려가 필수적이다. 따라서, 본 연구에서는 다양한 온도조건에서 수분의 흡습과 탈습을 모두 고려한 패키지 구조의 계면 박리 예측을 유한 요소 해석을 통해 수행하였다. 확산계수와 포화 수분 함량과 같은 재료의 물성은 흡습 실험을 통해 확보하였으며, 흡습 이후 TMA 와 TGA 를 통하여 각 재료의 수분 팽창 계수를 확보하였다. 각 계면의 접합 강도 평가를 위해 수분의 영향을 고려하여 다양한 온도 조건에서 마이크로 전단 실험을 수행하였다. 이러한 물성을 바탕으로 온도와 수분에 의해 발생하는 변형을 모두 고려한 패키지 박리 예측 해석을 수행하였으며, 결과적으로 리플로우 공정 동안의 실시간 수분 탈습 거동을 고려한 계면 박리 예측을 성공적으로 수행하였다.

Detection of edge delamination in surface adhered active fiber composites

  • Wang, Dwo-Wen;Yin, Ching-Chung
    • Smart Structures and Systems
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    • 제5권6호
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    • pp.633-644
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    • 2009
  • A simple method has been developed to detect the bonding condition of active fiber composites (AFC) adhered to the surface of a host structure. Large deformation actuating capability is one of important features of AFC. Edge delamination in adhesive layer due to large interfacial shear stress at the free edge is typically resulted from axial strain mismatch between bonded materials. AFC patch possesses very good flexibility and toughness. When an AFC patch is partially delaminated from host structure, there remains sensing capability in the debonded part. The debonding size can be determined through axial resonance measured by the interdigitated electrodes symmetrically aligned on opposite surfaces of the patch. The electrical impedance and modal response of the AFC patch in part adhered to an aluminum plate were investigated in a broad frequency range. Debonding ratio of the AFC patch is in inverse proportion to the resonant frequency of the fundamental mode. Feasibility of in-situ detecting the progressive delamination between AFC patch and host plate is demonstrated.

CFRP 사교적층판의 충격손상에 관한 연구 (A Study on the Impact-Induced Damage in CFRP Angle-ply Laminates)

  • 배태성;입야영;양동률
    • 대한기계학회논문집
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    • 제17권2호
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    • pp.237-247
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    • 1993
  • 본 연구에서는 CFRP 적층재를 구조재료로 사용할 경우 우수한 인장강도를 갖 지만, 충격하중에 취약한 특성을 갖기 때문에 구조안정성에 관한 큰 문제의 하나로 충 격손상을 받은 적층판의 잔류 압축강도가 현저히 저하되는 것이 문제점으로 지적되어 왔다.특히, 충격손상에 의한 압축강도의 저하는 인장강도보다 압축강도에 중점을 두는 항공기의 강도설계에서 중요한 문제가 되므로, 저속충격에 의한 복합재료 구조체 의 충격파괴의 문제를 잘 이해하는 것이 요구된다. 지금까지의 연구에 의하면 CFRP 복합적층재의 손상은 주로 층간박리현상과 손상역의 크기변화를 실험적으로 고찰하였 다.

반도체패키지에서의 층간박리 및 패키지균열에 대한 파괴역학적 연구 (1) -층간박리- (A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging(l) -Delamination-)

  • 박상선;반용운;엄윤용
    • 대한기계학회논문집
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    • 제18권8호
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    • pp.2139-2157
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    • 1994
  • In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

표면실장용 IC 패키지 솔더접합부의 열피로 수명 예측 (A prediction of the thermal fatigue life of solder joint in IC package for surface mount)

  • 윤준호;신영의
    • Journal of Welding and Joining
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    • 제16권4호
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    • pp.92-97
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    • 1998
  • Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

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단계적 파괴 모델에 의한 적층 복합재료의 충격거동 해석 (Impact Behavior of Laminated Composite using Progressive Failure Model)

  • 강문수;이경우;강태진
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2000년도 추계학술발표대회 논문집
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    • pp.102-105
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    • 2000
  • Recently, applications of integrated large composite structures have been attempted to many structures of vehicles. To improve the cost performance and reliability of the integrated composite structures, it is necessary to judge structural integrity of the composite structures. For the judgement, we need fracture simulation techniques for composite structures. Many researches oil the fracture simulation method using FEM have been reported by now. Most of the researches carried out simulations considering only matrix cracking and fiber breaking as fracture modes, and did not consider delamination. Several papers have reported the delamination simulation, but all these reports require three-dimensional elements or quasi three- dimensional elements for FEM analysis. Among fracture mechanisms of composite laminates, delamination is the most important factor because it causes stiffness degradation in composite structures. It is known that onset and propagation of delamination are dominated by the strain energy release rate and interfacial moment. In this study, laminated composite has been described by using 3 dimensional finite elements. Then impact behavior of the laminated composite is simulated using FEM(ABAQUS/Explicit) with progressive failure mechanism. These results are compared with experimental results.

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