• Title/Summary/Keyword: interfacial delamination

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An Experimental Study on Flexural Repair of Reinforced Concrete Beams with the CFRP Sheet (탄소섬유시트를 사용한 철근콘크리트 구조물의 휨 보강에 관한 실험적 연구)

  • 박정원;박상렬;민창식
    • Proceedings of the Korea Concrete Institute Conference
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    • 2000.04a
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    • pp.781-786
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    • 2000
  • This paper presents the behavior and strenghening effect of reinforced concrete rectangular beams strengthened sing CFRP sheets with different strengthening level. In general, normally strengthened beams are failed by interfacial shear failure (delamination) within concrete, instead of by tensile failure of the CFRP sheets. The delamination occurred suddenly and the concrete cover cracked vertically by flexure was spalled off due to the release energy. The ultimate load considerably increased with an increase of strengthening level, while the ultimate deflection significantly decreased. The tensile force of CFRP sheets and average shear stress of concrete at delamination failure were curvilinearly proportional to the strengthening level. Therefore, the increment of ultimate load obtained by strengthening was curvilinearly proportional to th strengthening level.

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Strengthening Effect of R/C Beams with different Strengthening Level

  • Park, Sang-Yeol;Park, Jeong-Won;Min, Chang-Shik
    • KCI Concrete Journal
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    • v.12 no.1
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    • pp.113-120
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    • 2000
  • This paper presents the behavior and strengthening effect of reinforced concrete rectangular beams strengthened using CFRP sheets with different strengthening level. In general, normally strengthened beams are failed by interfacial shear failure (delamination) within concrete, instead of by tensile failure of the CFRP sheets. The delamination occurred suddenly and the concrete cover cracked vertically by flexure was spalled off due to the release energy. The strengthened beams were stiffer than the control beam before and after reinforcement yielding. The ultimate load considerably increased with an increase of strengthening level, while the ultimate deflection significantly decreased. The tensile force of CFRP sheets and average shear stress of concrete at delamination failure were curvilinearly proportional to the strengthening level. Therefore, the increment of ultimate load obtained by strengthening was curvilinearly proportional to the strengthening level. The averaged horizontal shear stress of concrete at the interface ranges between (equation omitted) and (equation omitted) (in kg/$\textrm{cm}^2$) depending on strengthening level.

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INFLUENCE OF INVESTMENT/CERAMIC INTERACTION LAYER ON INTERFACIAL TOUGHNESS OF BODY CERAMIC BONDED TO LITHIA-BASED CERAMIC

  • Park, Ju-Mi
    • The Journal of Korean Academy of Prosthodontics
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    • v.44 no.6
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    • pp.683-689
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    • 2006
  • Statement of problem. Interfacial toughness is important in the mechanical property of layered dental ceramics such as core-veneered all-ceramic dental materials. The interfaces between adjacent layers must be strongly bonded to prevent delamination, however the weak interface makes delamination by the growth of lateral cracks along the interface. Purpose. The purpose of this study was to determine the effect of the reaction layer on the interfacial fracture toughness of the core/veneer structure according to the five different divesting. Materials and methods. Thirty five heat-pressed Lithia-based ceramic core bars (IPS Empress 2), $20mm{\times}3mm{\times}2mm$ were made following the five different surface divesting conditions. G1 was no dissolution or sandblasting of the interaction layer. G2 and G3 were dissolved layer with 0.2% HF in an ultrasonic unit for 15min and 30 min. G4 and G5 were dissolved layer for 15min and 30min and then same sandblasting for 60s each. We veneered bilayered ceramic bars, $20mm{\times}2.8mm{\times}3.8mm$(2mm core and 1.8mm veneer), according to the manufacturer's instruction. After polishing the specimens through $1{\mu}m$ alumina, we induced five cracks for each of five groups within the veneer close to interface under an applied indenter load of 19.6N with a Vickers microhardness indenter. Results. The results from Vickers hardness were the percentage of delamination G1:55%, G2:50%, G3:35%, G4:0% and G5:0%. SEM examination showed that the mean thickness of the reaction layer were G1 $93.5{\pm}20.6{\mu}m$, G2 $69.9{\pm}14.3{\mu}m$, G3 $59.2{\pm}20.2{\mu}m$, G4 $0.61{\pm}1.44{\mu}m$ G5 $0{\pm}0{\mu}m$. The mean interfacial delamination crack lengths were G1 $131{\pm}54.5{\mu}m$, G2 $85.2{\pm}51.3{\mu}m$, and G3 $94.9{\pm}81.8{\mu}m$. One-way ANOVA showed that there was no statistically significant difference in interfacial crack length among G1, G2 and G3(p> 0.05). Conclusion. The investment reaction layer played important role at the interfacial toughness of body ceramic bonded to Lithia-based ceramic.

Suppression of interfacial crack for foam core sandwich panel with crack arrester

  • Hirose, Y.;Hojo, M.;Fujiyoshi, A.;Matsubara, G.
    • Advanced Composite Materials
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    • v.16 no.1
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    • pp.11-30
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    • 2007
  • Since delamination often propagates at the interfacial layer between a surface skin and a foam core, a crack arrester is proposed for the suppression of the delamination. The arrester has a semi-cylindrical shape and is arranged in the foam core and is attached to the surface skin. Here, energy release rates and complex stress intensity factors are calculated using finite element analysis. Effects of the arrester size and its elastic moduli on the crack suppressing capability are investigated. Considerable reductions of the energy release rates at the crack tip are achieved as the crack tip approached the leading edge of the crack arrester. Thus, this new concept of a crack arrester may become a promising device to suppress crack initiation and propagation of the foam core sandwich panels.

Delamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative Humidity (유한요소 해석을 통해 온도와 상대습도에 따른 수분 흡습 및 탈습을 반영한 반도체 패키지 구조의 박리 예측)

  • Um, Hui-Jin;Hwang, Yeon-Taek;Kim, Hak-sung
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.3
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    • pp.37-42
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    • 2022
  • Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

Detection of edge delamination in surface adhered active fiber composites

  • Wang, Dwo-Wen;Yin, Ching-Chung
    • Smart Structures and Systems
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    • v.5 no.6
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    • pp.633-644
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    • 2009
  • A simple method has been developed to detect the bonding condition of active fiber composites (AFC) adhered to the surface of a host structure. Large deformation actuating capability is one of important features of AFC. Edge delamination in adhesive layer due to large interfacial shear stress at the free edge is typically resulted from axial strain mismatch between bonded materials. AFC patch possesses very good flexibility and toughness. When an AFC patch is partially delaminated from host structure, there remains sensing capability in the debonded part. The debonding size can be determined through axial resonance measured by the interdigitated electrodes symmetrically aligned on opposite surfaces of the patch. The electrical impedance and modal response of the AFC patch in part adhered to an aluminum plate were investigated in a broad frequency range. Debonding ratio of the AFC patch is in inverse proportion to the resonant frequency of the fundamental mode. Feasibility of in-situ detecting the progressive delamination between AFC patch and host plate is demonstrated.

A Study on the Impact-Induced Damage in CFRP Angle-ply Laminates (CFRP 사교적층판의 충격손상에 관한 연구)

  • 배태성;입야영;양동률
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.17 no.2
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    • pp.237-247
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    • 1993
  • Carbon fiber reinforced plastics(CFRP) have gained increased application in aerospace structures because of their specific strength and stiffness, but are sensitive to impact-induced damage. An experimental investigation was carried out to evaluate the impact resistance of CFRP according to the ply angle. The specimens of angle ply laminate composites were employed with [0.deg. $_{6}$/ .deg.$_{10}$/0.deg.$_{6}$], in which 6 kinds of ply angle such as .deg.=15.deg., 30.deg., 45.deg., 60.deg., 75.deg. and 90.deg. were selected. The impact tests were conducted using the air gun type impact testing machine by steel balls of diameter of 5 mm and 10 mm, and impact-induced damages were evaluated under same impact speed of V=60m/s. The impact damaged zones were observed through a scanning acoustic microscope (SAM). The obtained results were summarized as follows: (1) Delaminations on the interfacial boundaries showed th directional characteristics to the fiber directions. The delamination area on the impact side (interface A) was considerably smaller compared to that of the opposite side (interface B). (2) Cracks corresponding to other delaminations than those mentioned in SAM photographs were also seen on the impact damaged zone. (3) The delamination patterns were affected by the ply-angle, the dimensions of the specimen, and the boundary conditions. (4) The impact damaged zone showed zone showed the delamination on the interfacial boundaries, transverse shear cracks of the surface layer, and bending cracks of the bottom layer.r.r.r.

A Fracture Mechanics Approach on Delamination and Package Crack in Electronic Packaging(l) -Delamination- (반도체패키지에서의 층간박리 및 패키지균열에 대한 파괴역학적 연구 (1) -층간박리-)

  • 박상선;반용운;엄윤용
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.18 no.8
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    • pp.2139-2157
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    • 1994
  • In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

A prediction of the thermal fatigue life of solder joint in IC package for surface mount (표면실장용 IC 패키지 솔더접합부의 열피로 수명 예측)

  • 윤준호;신영의
    • Journal of Welding and Joining
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    • v.16 no.4
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    • pp.92-97
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    • 1998
  • Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

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Impact Behavior of Laminated Composite using Progressive Failure Model (단계적 파괴 모델에 의한 적층 복합재료의 충격거동 해석)

  • 강문수;이경우;강태진
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2000.11a
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    • pp.102-105
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    • 2000
  • Recently, applications of integrated large composite structures have been attempted to many structures of vehicles. To improve the cost performance and reliability of the integrated composite structures, it is necessary to judge structural integrity of the composite structures. For the judgement, we need fracture simulation techniques for composite structures. Many researches oil the fracture simulation method using FEM have been reported by now. Most of the researches carried out simulations considering only matrix cracking and fiber breaking as fracture modes, and did not consider delamination. Several papers have reported the delamination simulation, but all these reports require three-dimensional elements or quasi three- dimensional elements for FEM analysis. Among fracture mechanisms of composite laminates, delamination is the most important factor because it causes stiffness degradation in composite structures. It is known that onset and propagation of delamination are dominated by the strain energy release rate and interfacial moment. In this study, laminated composite has been described by using 3 dimensional finite elements. Then impact behavior of the laminated composite is simulated using FEM(ABAQUS/Explicit) with progressive failure mechanism. These results are compared with experimental results.

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