• Proceedings of the Korean Society of Rheology Conference
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• 2002.05a
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• pp.25-27
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• 2002

In this study we investigated the reaction kinetics by a convenient but useful method-rheology to characterize the interface between two immiscible blends with a Reactive compatibilizer. Also, we made an attempt to correlate changes of interface roughness with rheological properties. The blend systems employed in this study was mono-carboxylated polystyrene (PS-mCOOH) and an poly(methyl methacrylate-ran-glycidylmethacrylate) (PMMA-GMA). PS-mCOOH was synthesized by an anionic polymerization and PMMA-GMA by a free radical polymerization. We prepared two plates of each polymer using compression molding with a smooth surface molder, then put one upon another. As soon as these two plates welds together inside a rheometer under nitrogen environment, the torque and moduli were obtained with reaction time at different temperatures. Through the analysis of this modulus change with reaction time, we estimated interfacial reaction and roughening. The increment of modulus in initial state can be correlated to the extent of reaction. We obtained the reaction kinetic constant by fitting appropriate kinetic equation into experimental data. We also showed that increment of modulus in later state was due to by roughened interface.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.301-313
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• 1996

The texture of vapor deposits(PVD and CVD) changes from the orientation that places the lowest energy lattice plane parallel to the substrate under the condition of low atom or ion concentration adjacent to the deposit, to the orientation that places the higher energy crystal planes parallel to the substrate as the atom or ion concentration adjacent to the deposit increases. However, in the early stage of deposition, the deposit-substrate interface energy and the surface energy constitute the most important energies of the system. Therefore, if the lattice match is established between the substrate and the deposit without generating much strain energy, the epitaxial growth takes place to reduce the interfacial energy. When the epitaxial growth does not take place, the surface energy is dominant in the early stage of deposition and the lowest energy crystal plane tends to be placed parallel to the substrate up to a critial thickness. The thickness depends on the deposition condition. If the deposition condition does not favor placing the lowest energy crystal plane parallel to the substrate, the initial texture will change to that compatible with the deposition condition as the film thickness increases, and the texture turnover thickness will be short. The microstructure and surface topography of deposits are related to their texture.

• Journal of the Korean institute of surface engineering
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• v.49 no.3
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• pp.252-259
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• 2016

In order to form an aluminum-doped zinc oxide (AZO) transparent electrode film on a polyethylene terephthalate (PET) substrate used for a flexible display substrate, the AZO transparent electrode was produced at low temperature without substrate heating. Even though the produced electrode showed characteristic optical transmittance of 90 % (at 550 nm) and sheet resistance within $100{\Omega}/sq$, cracks occurred 10 minutes after loading applied 2 mm radius of curvature, and the sheet resistance increased linearly. An insertion layer of ZrCu was formed between the AZO film and the PET substrate to suppress the generation of cracks on the AZO film. It was verified that the crack was not generated 30 minutes after the loading of 2 mm radius of curvature, and no increase in sheet resistance was recorded. There was also not cracks in the dynamic bending test of 4 mm radius, but surface resistance was slightly increased. As a result, the ZrCu insertion film improved the interfacial adhesion between the substrate and AZO film layer without increasing sheet resistance and decreasing transmittance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.352-353
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• 2007

The spectrum for $0_{\circ}$, $90_{\circ}$-polarized light coincides with the spectrum for non-polarized light and also with the spectrum was observed in the LB film deposited using a fresh solution. And, the formation and dissociation of J-aggregates, anisotropic behavior was no longer observed in the heat treated merocyanine dyes LB films. But, in the optical absorption spectra of same LB films by UV irradiation at room temperature, their were observed only dissociation of J-aggregates, that is decrease of absorbance peak without change spectral shape. On the other hand, in the case of optical absorption spectra of the LB films by the heat treatment at $70^{\circ}C$ in the air, both of the shifted absorption bands decay and a monomer absorption peak of about 530 nm appears instead.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.348-351
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• 2007

Recently, Nanotechnology becomes a major issue in most part of industries. Nanotechnology is expected to develop various application products due to nano material mired composites is improved physical and electrical properties compared to conventional composites materials. Dielectric and insulation materials need to develop and improve like other field about nanotechnology. In this paper, we reported dielectric dispersion by size(no filler, $1.2{\mu}m$, 500 nm, 10 nm), frequencies(60, 120, 1 kHz), and temperatures($30{\sim}170^{\circ}C$). Dielectric constant of composites materials with filler shows higher than composites materials without filler and increased depending on rising temperatures in low frequency region. It was the effect that nano-filler and impurities in composites contributed to electrical conductivity. And dielectric properties depending on temperatures shows to change in low frequency region dramatically We analyzed interfacial polarization in low frequency region($10^{-2}$ Hz) and oriented polarization in high frequency region($10^{-5{\sim}6}$ Hz) on composites materials.

• Journal of Power System Engineering
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• v.18 no.6
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• pp.166-173
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• 2014

In this study, a laminated composite material with dispersing aluminum oxide powder between the CFRP laminate plies, and also CFRP composites without aluminium oxide powder were fabricated for Mode I experiments using the DCB specimen and a tensile test. The behavior of the crack and the change of the interfacial fracture toughness were evaluated. Also in order to evaluate the damage mechanism for the crack extension, the AE sensor on the surface of the DCB test specimen was attached. AE amplitude was estimated for CFRP-alumina and CFRP composite. And the fracture toughness was evaluated by the stress intensity factor and energy release rate. The results showed that an unstable crack was propagated rapidly in CFRP composite specimen along with the interface, but crack propagation in CFRP-alumina specimen was relatively stable. From results, we show that aluminium oxide powder spreaded uniformly in the interface of the CFRP laminate carried out the role for preventing the sudden crack growth.

• Korean Journal of Materials Research
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• v.9 no.6
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• pp.569-576
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• 1999

In this study, the effect of the microstructural evolution on the electrical of Cu-Ag microcomposite was investigated. The nature of interfaces between silver filaments and Cu matrix may have pronounced effects on the physical properties of Cu-Ag filamentary microcomposites, little is known about these interfaces. In heavily drawn Cu-Ag filamentary microcomposities, the microstructure is too fine and the interfacial area is too large to maintsin a stable internal dislocation structure because of closely spaced filaments. Rather, most dislocations are thought to be gradually absorbed at the interfaces as the draw ratio increases. The mechanical and electrical properties of Cu-Ag filamentary microcomposites wires were also examined and correlated with the microstructural change caused by thermomechanical treatments. The study on the electrical conductivity combined to resistivity in Cu-Ag filamentary microcomposites and the rapid increase of the electrical conductivity at high annealing temperatures is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities is mainly caused by the dissolution and coarsening of silver filaments. The relatively low ratio of the resistivities at 295K($\rho$\ulcorner/$\rho$\ulcorner) in as-drawn Cu-Ag microcomposites can also be explained by the contribution of the interface scattering.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.351-355
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• 1999

BN films with a high content of cubic phase has been deposited by a variety of techniques. It is well known that c-BN films grow with a unique microstructure consisting of $sp^2$ and $sp^{3-}$ bonded layers. Because of existence of the initially grown $sp^{2-}$ /bonded layer, BN films are not adhesive to the substrates. In this study, post-N$^{+ }$ / implantation was applied to improve the adhesion of the films. A Monte Carlo program TAMIX was used to simulate this modification process. The simulation showed nitrogen concentration profile at $1200\AA$ in depth in case of 50keV -implantation energy. FTIR spectra of the $N^{+}$ implanted specimens demonstrated a strong change of absorption band at 1380 cm$^{ -1 }$The films were also investigated by HRTEM. From these results, it is concluded that the post ion implantation could be an effective technique which improves the adhesion between BN film and substrate.

• Journal of the Korean institute of surface engineering
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• v.56 no.3
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• pp.180-184
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• 2023

Scholars have proposed wafer-level bonding and three-dimensional (3D) stacked integrated circuit (IC) and have investigated Cu-Cu bonding to overcome the limitation of Moore's law. However, information about quantitative Cu-Cu direct-bonding conditions, such as temperature, pressure, and interfacial adhesion energy, is scant. This study determines the optimal temperature and pressure for Cu-Cu bonding by varying the bonding temperature to 100, 150, 200, 250, and 350 ℃ and pressure to 2,303 and 3,087 N/cm². Various conditions and methods for surface treatment were performed to prevent oxidation of the surface of the sample and remove organic compounds in Cu direct bonding as variables of temperature and pressure. EDX experiments were conducted to confirm chemical information on the bonding characteristics between the substrate and Cu to confirm the bonding mechanism between the substrate and Cu. In addition, after the combination with the change of temperature and pressure variables, UTM measurement was performed to investigate the bond force between the substrate and Cu, and it was confirmed that the bond force increased proportionally as the temperature and pressure increased.

• Polymer(Korea)
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• v.27 no.4
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• pp.313-322
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• 2003

The morphology of poly(ethylene terephthalate) (PET)/poly(m-xylene adipamide) (MXD-6) blends, which was prepared by adding compatibilizer and interchange reaction agent, was investigated. The morphological change in the stretched blend films was also studied. The stretched film showed a dispersed MXD-6 fibril. This fibril became finer with increasing draw ratio (DR). The addition of compatibilizer and interchange reaction agent had no effect on the improvement of interfacial adhesion but caused a defect between the continuous phase and the dispersed phase, leading to the formation of irregular fibril. The change in the superstructure of blends with composition and draw ratio was examined with light scattering (LS). The H$\sub$v/ LS patterns showed a double-cross type pattern consisting of a broad rod-like pattern and a sharp cross streak. On the basis of the model calculation of the H$\sub$v/ pattern, it was found that the appearance of the double-cross type pattern was attributed to the stacking of crystals oriented along the draw direction. The crystals were gradually oriented to the stretching direction with draw ratio. As a result, the high level of orientation was obtained fur the sample of draw ratio is 6.0.