• 제목/요약/키워드: interfacial bonding

검색결과 332건 처리시간 0.025초

Modeling of CNTs and CNT-Matrix Interfaces in Continuum-Based Simulations for Composite Design

  • Lee, Sang-Hun;Shin, Kee-Sam;Lee, Woong
    • 한국재료학회지
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    • 제20권9호
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    • pp.478-482
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    • 2010
  • A series of molecular dynamic (MD), finite element (FE) and ab initio simulations are carried out to establish suitable modeling schemes for the continuum-based analysis of aluminum matrix nanocomposites reinforced with carbon nanotubes (CNTs). From a comparison of the MD with FE models and inferences based on bond structures and electron distributions, we propose that the effective thickness of a CNT wall for its continuum representation should be related to the graphitic inter-planar spacing of 3.4${\AA}$. We also show that shell element representation of a CNT structure in the FE models properly simulated the carbon-carbon covalent bonding and long-range interactions in terms of the load-displacement behaviors. Estimation of the effective interfacial elastic properties by ab initio simulations showed that the in-plane interfacial bond strength is negligibly weaker than the normal counterpart due to the nature of the weak secondary bonding at the CNT-Al interface. Therefore, we suggest that a third-phase solid element representation of the CNT-Al interface in nanocomposites is not physically meaningful and that spring or bar element representation of the weak interfacial bonding would be more appropriate as in the cases of polymer matrix counterparts. The possibility of treating the interface as a simply contacted phase boundary is also discussed.

Effect of high energy ball milling on the structure of iron - multiwall carbon nanotubes (MWCNT) composite

  • Kumar, Akshay;Pandel, U.;Banerjee, M.K.
    • Advances in materials Research
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    • 제6권3호
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    • pp.245-255
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    • 2017
  • High energy ball milling is employed to produce iron matrix- multiwall carbon nanotube (MWCNT) reinforced composite. The damage caused to MWCNT due to harsh ball milling condition and its influence on interfacial bonding is studied. Different amount of MWCNT is used to find the optimal percentage of MWCNT for avoidance of the formation of chemical reaction product at the matrix - reinforcement interface. Effect of process control agent is assessed by the use of different materials for the purpose. It is observed that ethanol as a process control agent (PCA) causes degradation of MWCNT reinforcements after milling for two hours whereas solid stearic acid used as process control agent, allows satisfactory conservation of MWCNT structure. It is further noted that at a high MWCNT content (~ 2wt.%), high energy ball milling leads to reaction of iron and carbon and forms iron carbide (cementite) at the iron-MWCNT interface. At low percentage of MWCNT, dissolution of carbon in iron takes place and the amount of reinforcement in iron matrix composite becomes negligibly small. However, under the present ball milling condition (ball to metal ratio~ 6:1 and 200 rpm vial speed) iron-1wt.% MWCNT composite of good interfacial bonding can retain the tubular structure of reinforcing MWCNT.

ZrO2-Ti합금의 활성금속 브레이징 (Active Metal Brazing Applied to Joining of ZrO2-Ti Alloy)

  • 기세호;박상윤;정재필;김원중
    • Journal of Welding and Joining
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    • 제30권3호
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    • pp.38-43
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    • 2012
  • In this study, active metal brazing methods for $ZrO_2$ and Ti alloy were discussed. To get a successful metal-ceramic bonding, various factors (melting temperature, corrosion, sag resistance, thermal expansion coefficient etc. of base materilas and filler metal) should be considered. Moreover, in order to clarify bonding between the metal and ceramic, the mechanism of the interfacial structure of the joints should be identified. The driving force for the formation of metal and ceramic interfaces is the reduction of the free energy which occurs when their contact becomes complete. Interfacial bonding depends on the material combinations and the bonding processes. This study describes the bonding between ceramic and metal in an active metal brazing.

티타늄의 표면처리방법에 따른 티타늄-세라믹 보철시편의 결합강도와 계면특성 (Effect of Surface Treatments of Titanium on Bond Strength and Interfacial Characterization in Titanium-Ceramic Prosthesis)

  • 정인성;김치영
    • 한국콘텐츠학회논문지
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    • 제10권10호
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    • pp.219-225
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    • 2010
  • 티타늄 표면처리방법 중 gold 코팅, TiN 코팅, 그리고 전용결합재를 복합적으로 사용하여 티타늄과 세라믹의 결합강도에 미치는 영향을 분석하고자 하였다. 티타늄과 세라믹의 3점 굽힘 결합강도를 측정한 결과, TiN 코팅과 전용결합재로 처리한 SPTB군이 $72.20({\pm}5.25)MPa$로 가장 높게 나타났으며, 전용결합재로 처리한 SPB군($67.66({\pm}12.10)MPa$), gold 코팅과 전용결합재로 처리한 SPGB군($46.95({\pm}12.48)MPa$), 코팅과 전용결합재로 처리하지 않은 SP군$(43.80({\pm}5.12)MPa)$ 순으로 나타났다. 시편들의 결합강도를 통계 분석한 결과, 전용 결합재로 처리한 SPB군과 TiN코팅과 전용결합재로 처리한 SPTB군이 결합력이 유사하게 나타났으며, 전용결합재로 처리한 군(SPB)이 처리하기 않은 군(SP)에 비하여 결합력이 높게 나타났으며, TiN 코팅한 군(SPTB)이 gold 코팅한 군(SPGB)에 비하여 결합력이 높게 나타난 것으로 관찰되었다.

Characterization of SOI Wafers Fabricated by a Modified Direct Bonding Technology

  • Kim, E.D.;Kim, S.C.;Park, J.M.;Kim, N.K.;Kostina, L.S.
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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    • pp.47-51
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    • 2000
  • A modified direct bonding technique employing a wet chemical deposition of $SiO_2$ film on a wafer surface to be bonded is proposed for the fabrication of Si-$SiO_2$-Si structures. Structural and electrical quality of the bonded wafers is studied. Satisfied insulating properties of interfacial $SiO_2$ layers are demonstrated. Elastic strain caused by surface morphology is investigated. The diminution of strain in the grooved structures is semi-quantitatively interpreted by a model considering the virtual defects distributed over the interfacial region.

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표면 개질화된 탄소나노튜브 강화 고분자 복합재료의 마모 특성 (Tribological Property of Surface Modified Carbon Nanotube Reinforced Polymer Matrix Composites)

  • 박주혁;아부바카술롱
    • Tribology and Lubricants
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    • 제21권6호
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    • pp.302-305
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    • 2005
  • Various carbon nanotubes (CNTs) are added into the epoxy matrix as reinforcements to investigate the effect on the wear behavior. Effects to the tribological properties of different loading concentrations and types of surface modification are investigated by using a linear reciprocal wear tester. As increasing the concentration of CNTs shows the reduction of the wear loss. Moreover, surface modified CNTs give better tribological property than as produced CNTs. It is due that the functional groups on the surface of CNTs increase the interfacial bonding between CNTs and epoxy matrix through chemical bonding. Changes in worn surface morphology are observed by optical microscope and SEM to investigate the wear behavior. CNTs in the epoxy matrix near the surface are exposed and it becomes the lubricating working film on the worn surface. It reduces the friction and results in the lower surface roughness morphology in the epoxy matrix as increasing the contents of the CNTs.

상아질과 접착제 간의 계면양상 (INTERFACIAL MORPHOLOGY BETWEEN DENTIN AND ADHESIVES)

  • 강지영;허복
    • Restorative Dentistry and Endodontics
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    • 제20권1호
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    • pp.183-192
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    • 1995
  • The purpose of this study was to evaluate the effect of smear layer management on the interfacial morphology between dentin bonding system and dentin. Clearfil New Bond, Scotchbond Multipurpose, Prisma Universal Bond 3 and X-R Bond were used on the cervical dentinal surfaces of bovine incisor teeth. All of the dentin bonding systems were labeled with fluorescene in primer and rhodamine B in adhesive. Specimens of 2~3mm thichness were prepared by longitudinal and labiolingual sectioning. The interface between dentin bonding system and dentin was observed by flouresence imaging with a confocal laser scanning microscope. Following results were obtained. 1. In the specimen of Clearfil New Bond, dentinal tubules were widened by destruction of peritubular dentin in the course of treatment with phosphoric acid of high concentration. 2. Hybrid layer was observed in the specimen of Scotchbond Multipurpose and X-R Bond. 3. In the specimen of Prisma Universal Bond 3, the penetraton of adhesive was not observed clearly.

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$ZrO_2/NiTi$ 접합부 반응조직에 따른 꺽임강도 및 파괴거동 변화 (The Variation of Fracture Strength and Modes in $ZrO_2/NiTi$ Bond by Changing Reaction Layer)

  • 김영정
    • 한국세라믹학회지
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    • 제31권10호
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    • pp.1197-1201
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    • 1994
  • The fracture strength and fracture modes were studied in 3Y-TZP/NiNi bonding which change their interfacial structure with bonding condition. Average 4-point bending strength of 200 MPa to 400 MPa were achieved. The formation of Ti-oxide phase at the interface critically influenced the bonding strength and fracture mode. The fracture surface of Ti-oxide free interface contained multiphase in some case including ZrO2. From the result it was confirmed that in order to maximize the bonding strength crack deflection from interface to ceramic was required.

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Flexible PCB용 무전해 도금 Ni 박막/Polyimide 계면파괴에너지 평가 (Interfacial fracture Energy between Electroless Plated Ni film and Polyimide for Flexible PCB Applications)

  • 민경진;박성철;이지정;이규환;이건환;박영배
    • 마이크로전자및패키징학회지
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    • 제14권1호
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    • pp.39-47
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    • 2007
  • 폴리이미드 표면에 대한 습식 개질 전처리 조건에 따른 폴리이미드와 무전해 도금 Ni 박막사이의 계면파괴에너지를 $180^{\circ}$ 필 테스트를 통해 정량적으로 구하였다. KOH 처리시간이 1분인 경우 계면파괴에너지는 24.5 g/mm에서 5분 처리 시 33.3g/mm로 증가하였고, EDA처리 시간이 1분인 경우 31.6 g/mm에서, 5분 처리 시 22.3g/mm로 저하되었다. 이러한 습식 개질전처리 조건에 따른 폴리이미드 표면 거칠기 변화는 매우 작아서, 기계적 고착 효과는 계면파괴에너지 변화에 기여하지 못했음을 알 수 있다. KOH는 carboxyl기, EDA는 amine기를 폴리이미드 표면에 형성시켜 Ni과 강한 화학적 결합을 이루어, 폴리이미드 내부의 cohesive 박리거동을 보였다. 습식 개질전처리 조건에 따른 계면파괴에너지의 거동은 파면 부근에 형성된 O=C-O 결합과 매우 밀접한 연관성이 있는 것으로 판단된다.

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Cu-Cu 열압착 웨이퍼 접합부의 계면접합강도에 미치는 $N_2+H_2$ 분위기 열처리의 영향 (Effect of $N_2+H_2$ Forming Gas Annealing on the Interfacial Bonding Strength of Cu-Cu thermo-compression Bonded Interfaces)

  • 장은정;김재원;;;현승민;이학주;박영배
    • 마이크로전자및패키징학회지
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    • 제16권3호
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    • pp.31-37
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    • 2009
  • 3차원 소자 집적을 위한 저온접합 공정 개발을 위해 Cu-Cu 열 압착 접합을 $300^{\circ}C$에서 30분간 실시하고 $N_2+H_2$, $N_2$분위기에서 전 후속 열처리 효과에 따른 정량적인 계면접착에너지를 4점굽힘시험법을 통해 평가하였다. 전 열처리는 100, $200^{\circ}C$$N_2+H_2$ 가스 분위기에서 각각 15분간 처리하였고, 계면접착에너지는 2.58, 2.41, 2.79 $J/m^2$로 전 열처리 전 후에 따른 변화가 없었다. 하지만 250, $300^{\circ}C$$N_2$ 분위기에서 1시간씩 후속 열처리 결과 2.79, 8.87, 12.17 $J/m^2$으로 Cu 접합부의 계면접착에너지가 3배 이상 향상된 결과를 얻을 수 있었다.

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