• Korean Journal of Materials Research
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• v.11 no.8
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• pp.671-678
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• 2001

All solid-state thin film micro supercapacitor, which consists of $RuO_2$/LiPON/$RuO_2$ multi layer structure, was fabricated on Pt/Ti/Si substrate using a $RuO_2$ electrode. Bottom $RuO_2$ electrode was grown by dc reactive sputtering system with increasing $O_2/[Ar+O_2]$ ratio at room temperature, and a LiPON electrolyte film was subsequently deposited on the bottom $RuO_2$ electrode at pure nitrogen ambient by rf reactive sputtering system. Room temperature charge-discharge measurements based on a symmetric $RuO_2$/LiPON/$RuO_2$ structure clearly demonstrates the cyclibility dependence on the microstructure of the $RuO_2$ electrode. Using both glancing angle x-ray diffraction (GXRD) and transmission electron microscopy (TEM) analysis, it was found that the microstructure of the $RuO_2$ electrode was dependent on the oxygen flow ratio. In addition, x- ray photoelectron spectroscopy(XPS) examination shows that the Ru-O binding energy is affected by increasing oxygen flow ratio. Furthermore, TEM and AES depth profile analysis after cycling demonstrates that the interface layer formed by interfacial reaction between LiPON and $RuO_2$ act as a main factor in the degradation of the cyclibility of the thin film micro-supercapacitor.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.2
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• pp.85-92
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• 2010

$SF_6$ gas has been widely used in many industrial fields as insulating, cleaning and covering gases due to its outstanding arc-extinguishing and insulating properties. However, global warming potential of $SF_6$ gas is 23,900 times more than that of $CO_2$ and it remains in the air during 3,200 years. For these reason, technological and economical effects could be expected for the separation of $SF_6$ from gas mixtures by hydrate forming process. In this study, we carried out morphological studies for the $SF_6$ hydrate crystal to understand its formation and growth mechanisms. $SF_6$ hydrate film was initially formed at the interfacial boundary between gas and liquid regions, and then subsequent dendrite crystals growth was observed. The dendrite crystals grew to the direction of gas region probably due to the guest gas concentration gradient. The detailed growth characteristics of $SF_6$ hydrate crystals such as nucleation, migration, growth and interference were discussed in this study.

• Journal of the Korean Magnetics Society
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• v.23 no.6
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• pp.184-187
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• 2013

The influence of insertion of an ultra-thin Cu-Phthalocyanine (CuPc) between MgO barrier and ferromagnetic layer in magnetic tunnel juctions (MTJs) was investigated. In order to understand the relation between the electronic and structural properties of Fe${\backslash}$MgO${\backslash}$CuPc, the surface (or interface) analysis was carried out systematically by using spin polarized metastable He de-excited spectroscopy for the CuPc films grown on the Si(001)${\backslash}$5 nm MgO(001)${\backslash}$7 nm Fe(001)${\backslash}$1.6 nm MgO(001) multilayer structure as the thickness of CuPc increases from 0 to 5 nm. In particular, for the 1.6 nm CuPc surface, a rather strong spin asymmetry between up- and down-spin band appears while it becomes weaker or disappears for the CuPc films thinner or thicker than ~1.6 nm. Our results emphasize the importance of the interfacial electronic properties of organic layers in the spin transport of the hybrid MTJs.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.41-46
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• 2005

A systematic investigation of shear testing was conducted to find a relationship between Ni-Sn intermetallic spatting and the brittle fracture observed in electroless Ni(P)/solder interconnection. Brittle fracture was found in the solder joints made of Sn-3.5Ag, while only ductile fracture was observed in a Cu-containing solder (Sn-3.0Ag-0.5Cu). For Sn-3.0Ag-0.5Cu joints, $(Ni,Cu)_3Sn_4$ and/or $(Cu,Ni)_6Sn_5$ compound were formed at the interface without spatting from the Ni(P) film. For Sn-3.5Ag, $Ni_3Sn_4$ compound was formed and brittle fracture occurred in solder pads where $Ni_3Sn_4$ had spalled. From the analysis of fractured surfaces, it was found that the brittle fracture occurs through the $Ni_3SnP$ layer formed between $Ni_3Sn_4$ intermetallic layer and the Ni(P) film. Since the $Ni_3SnP$ layer is getting thicker during/ after $Ni_3Sn_4$ spatting, suppression of $Ni_3Sn_4$ spatting is crucial to ensure the reliability of Ni(P)/solder system.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.65-74
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• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.

• Applied Chemistry for Engineering
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• v.8 no.3
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• pp.454-462
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• 1997

Thermotropic block copolyester(TLCP-b-PBN) based on poly(tetramethylene 2,6-(naphthaloyldioxy)dibenzoates)(TLCP) and poly(butylene 2,6-naphthalate)(PBN) was synthesized by solution polycondensation and melt-blended with poly(ethylene 2,6-naphthalate)(PEN) for in-situ composites. The TLCP domains showed nematic behavior in melt. The composition of block copolymer was determined from $^1H-NMR$ spectroscopy. The DSC thermogram of block copolymer revealed the presence of two major melting transitions, corresponding to the separete melting of PBN and TLCP domains. The glass transition temperature(Tg) of the PEN in the blends decreased with increasing the content of TLCP-b-PBN and the TLCP-b-PBN acted as a nucleating agent for the matrix polymers. In the 20% TLCP-b-PBN blend, well oriented TLCP fibriles were observed at temperature above the melting point of the PEN by optical microscopy. By scanning electron micrographs of cryogenically fractured surfaces of extruded blends, the TLCp domains were found to be finely and uniformely dispersed in 0.15 to $0.2{\mu}m$ size. Interfacial adhesion between the TLCP and matrix polymer was seemed to be good. Under certain condition TLCP formed a fiver structure in the PEN matrix, with thin oriented TLCP fibril in the skin region and spherical TLCP domains in the core.

• Proceedings of the Korea Concrete Institute Conference
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• 2008.11a
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• pp.465-468
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• 2008

SHCCs (Strain Hardening Cement Composites) show the high energy tolerance capacity due to the interfacial bonding of the fibers to the cement matrix. For effective material design and application of SHCCs, it is needed to investigate the compression, four-point bending, direct tensile response of SHCCs with different types of fibers and water-cement ratio. For these purposes, three kinds of fibers were used: PP(polypropylene, 2.0%), PVA(Polyvinyl alcohol, 2.0%), PE (Polyethylene, 1.0%). Also, effects of water-cement ratio(0.45, 0.60) on the SHCCs were evaluated in this paper. As the result of test, SHCCs with PVA and PE fiber were showed better overall behavior than specimens with PP fibers on bending and direct tensile test. Also, for the same type of fiber, SHCCs with water-cement ratio of 0.45 exhibited higher ultimate strength than specimen with water-cement ratio of 0.60 on compression strength, and showed the multiple cracking on bending and direct tensile test. Therefore, to improve of workability and dispersibility of SHCCs on water-cement ratio of 0.60, continual studies were needed.

• Korean Chemical Engineering Research
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• v.50 no.6
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• pp.1021-1026
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• 2012

The transient mass transfer in a single droplet system consisting of 1-octanol (continuous phase)/aqueous succinic acid solution (dispersed phase) was investigated in the presence of chemical reaction, which is acid/anion exchange reaction of succinic acid and tri-n-octylamine (TOA). This succinic acid extraction by TOA can be considered to occur at the interface between organic and aqueous phase, that is, heterogeneous reaction system. The basic properties of the system such as viscosity, density, distribution coefficient, terminal velocity of droplet, and diffusion coefficient were measured experimentally or calculated theoretically, and used for theoretical calculation of characteristic parameters of mass transfer later. The effects of succinic acid concentration on the terminal velocity was negligible in the existence of TOA, although the terminal velocity increases with succinic acid concentration in the absence of TOA. On the contrary, the terminal velocity decreases with TOA concentration. While droplets falls through organic phase, the trajectory of droplets is observed to oscillate around its vertical path. A mass trnasfer cell was prepared to monitor the mass transfer behavior in a single droplet and used to measure the mean concentration of succinic acid inside droplet. The results are expressed with dimensionless parameters. Under 50 g/L succinic acid condition, the system with 0.1 mol/kg TOA showed that the molar flux decreases in proportion to the decrease of concentration gradient, while in the case of 0.5 mol/kg TOA Sh increases rapidly with time indicating the molar flux of succinic acid decreases relatively slowly compared to the decrease in concentration gradient.

• The Journal of Korean Academy of Prosthodontics
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• v.37 no.5
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• pp.620-639
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• 1999

Indirect composite resins are used as an popular effective esthetic material in prosthetic dentistry, often with metallic substructure that provides support for restorations. Recently, new indirect composite resins as a substitute of ceramic have been developed. These resins provide good esthetics, with a wide range of hue and chroma. And the flexural strength of those is in the range of 120-150MPa, Which is higher than that of feldspathic Ceramic, and similar th that of Dicor. Although it has many merits, one of the major clinical problems of composite resins is the bond failure between metal and resin due to insufficient interfacial bond strength. The purpose of this study was to evaluate shear bond strength of the reinforced indirect composite resin to dental alloys. Three different composite resin systems($Artglass^{(R)},\;Sculpture^{(R)},\;Targis^{(R)}$) as test groups and ceramic($VMK\;68^{(R)}$) as control group were bonded to Ni-Cr-Be alloy($Rexillium\;III^{(R)}$) and gold alloy(Deva 4). All specimens were stored at $^37{\circ}C$ distilled water for 24 hours and the half of specimens were thermocycled 2000 times at temperature from $5^{\circ}C\;to\;60^{\circ}C$. The shear bond strengths of reinforced indirect composite resins to dental alloys were measured by using the universal testing machine, and modes of debonding were observed by stereoscope and scanning electron microscope. The results were as follows: 1 The shear bond strengths of reinforced indirect composite resins to dental alloys were approximately half those of ceramic to dental alloys(P<0.01). 2. There was no significant difference between the shear bond strength of several reinforced indirect composite resins to metal. 3. Alloy type did not affect on the shear bond strengths of resin to metal, but the shear bond strengths of ceramic to gold alloys were higher than those of ceramic to Ni-Cr alloys(P<0.05). 4. The shear bond strengths of Artglass and Targil to gold alloys were significantly decreased after thermocycling treatment(P<0.01). 5. Sculpture showed cohesive, adhesive, and mixed failure modes, but Artglass and Targis showed adhesive or mixed failures. And ceramic showed cohesive and mixed failures.

• Journal of the Korea Concrete Institute
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• v.19 no.4
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• pp.467-474
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• 2007

In this paper, a total of 13 beams with bonding, anchorage system, amount of prestressing and span length as variables of experiment were tested in flexural test and analyzed in finite element analysis; one control beam, two simplified FRP-boned beams, four prestressed FRP-unbonded beams and four prestressed FRP-bonded beams. Also, a nonlinear finite element analysis of beams in the flexural test is performed by DIANA program considered material nonlinear of concrete, reinforcement and the interfacial bond-slip model between concrete and CFRP plates. The failure mode of prestressed CFRP plated-beams is not debonding but FRP rupture. RC members strengthened with external bonded prestressed CFRP plates occurred 1st and 2nd debonding of the composite material. After the debonding of CFRP plates occurs in bonded system, behavior of bonded CFRP-plated beams change into that of unbonded CFRP-plated beams due to fix of the anchorage system. Also, It was compared flexural test results and analytical results of RC members strengthened with CFRF plates. The ductility of beams strengthened by CFRP plates with the anchorage system is considered high with the ductility index of above 3. Analysis results showed a good agreement with experiment results in the debonding load, yield load and ultimate load.