• Title/Summary/Keyword: interface treatment

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Adhesive Properties of Epoxy Composite According to the Surface Treatment of Cu Substrate and Adhesion Promoter Content (구리기판의 표면처리 및 접착증진제 함량에 따른 에폭시 컴포지트의 접착특성)

  • Eun-jin Kim;Jung Soo Kim;Young-Wook Chang;Dong Hyun Kim
    • Journal of Adhesion and Interface
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    • v.23 no.4
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    • pp.108-115
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    • 2022
  • In this study, we synthesized poly(itaconic acid-co-acrylamide) (IAcAAM) used as a novel polymer adhesion promoter to improve the adhesion strength of surface-treated Cu lead frames and epoxy composites. IAcAAM comprising itaconic acid, acrylamide was prepared through radical aqueous polymerization. The chemical structure and properties of IAcAAM was analyzed by FT-IR, 1H-NMR, GPC, and DSC. The surface of the copper lead frame was treated with high temperature, alkali, and UV ozone to reduce the water contact angle and increase the surface energy. The adhesive strength of Cu lead frame and epoxy composite increased with the decrease of contact angle. The adhesive strength of Cu lead frame/epoxy composite increased with the addition of IAcAAM in epoxy composite. As silica content increased, the adhesive strength of Cu lead frame and epoxy composite tended to slightly decrease.

Recent Trends in Low-Temperature Solution-Based Flexible Organic Synaptic Transistors Fabrication Processing (저온 용액 기반 유연 유기 시냅스 트랜지스터 제작 공정의 최근 연구 동향)

  • Kwanghoon Kim;Eunho Lee;Daesuk Bang
    • Journal of Adhesion and Interface
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    • v.25 no.2
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    • pp.43-49
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    • 2024
  • In recent years, the flexible organic synaptic transistor (FOST) has garnered attention for its flexibility, biocompatibility, ease of processability, and reduced complexity, which arise from using organic semiconductors as channel layers. These transistors can emulate the plasticity of the human brain with a simpler structure and lower fabrication costs compared to conventional inorganic synaptic devices. This makes them suitable for applications in next-generation wearable devices and soft robotics technologies. In FOST, the organic substrate is sensitive to the device preparation temperature; high-temperature treatment processes can cause thermal deformation of the organic substrate. Therefore, low-temperature solution-based processing techniques are essential for fabricating high-performance devices. This review summarizes the current research status of low-temperature solution-based FOST devices and presents the problems and challenges that need to be addressed.

Effects of Heat Treatment Conditions on the Interfacial Reactions and Crack Propagation Behaviors in Electroless Ni/electroplated Cr Coatings (열처리 조건에 따른 무전해 Ni/전해 Cr 이중도금의 계면반응 및 균열성장거동 분석)

  • Son, Kirak;Choi, Myung-Hee;Lee, Kyu Hawn;Byon, Eungsun;Rhee, Byong-Ho;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.69-75
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    • 2016
  • This study investigated the effect of heat treatment conditions not only on the Cr surface crack propagation behaviors but also on the Ni/Cr interfacial reaction characteristics in electroless Ni/electroplated Cr double coating layers on Cu substrate. Clear band layer of Ni-Cr solid solutions were developed at Ni/Cr interface after heat treatment at $750^{\circ}C$ for 6 h. Channeling cracks formed in Cr layer after 1 step heat treatment, that is, heat treatment after Ni/Cr plating, while little channeling cracks formed after 2 step heat treatment, that is, same heat treatments after Ni and Cr plating, respectively, due to residual stress relaxation due to crystallization of Ni layer before Cr plating.

Effect of De-graphitization Heat Treatment on Interfacial Bonding Properties of Flake Graphite Cast Iron-Aluminum Dissimilar Materials Produced by High Pressure Die Casting (고압 다이캐스팅법으로 제조한 편상흑연주철 -알루미늄 이종소재의 계면접합특성에 미치는 탈흑연 열처리의 영향)

  • Yang, Ji-Ba-Reum;Kim, TaeHyeong;Jeong, JaeHeon;Kim, SangWoo;Kim, YoonJun;Kim, DongEung;Shin, JeSik
    • Journal of Korea Foundry Society
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    • v.41 no.6
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    • pp.535-542
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    • 2021
  • In this study, to improve the interfacial bond strength of cast iron-aluminum dissimilar materials, graphite was removed to a certain depth from the cast iron surface through de-graphitization heat treatment. As the heat treatment time increased, the depth at which graphite was removed increased, showing a linear relationship between the heat treatment time and depth. Aluminum was filled to a certain depth on the de-graphitized cast iron surface through die-casting method, and no intermetallic compounds were formed on the cast iron-aluminum interface. The interfacial bonding strength showed a value of 90 MPa regardless of the heat treatment time, which is very high compared to the 12MPa bonding strength of the material without de-graphitization heat treatment. This result is thought to be due to the mechanical bonding of the undercut structure as the liquid aluminum, penetrated by the high pressure die-casting process, solidified in the de-graphitized region of the cast iron.

THE EFFECTS OF SURFACE TREATMENT OF DENIAL NICKEL-CHROMIUM ALLOY ON TENSILE BOND STRENGTH (치과용 니켈-크롬합금에 대한 표면 처리가 인장접착강도에 미치는 영향)

  • Lee, Eun-Suk;Kwon, Oh-Won
    • The korean journal of orthodontics
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    • v.27 no.3 s.62
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    • pp.493-502
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    • 1997
  • This study was conducted to evaluate the tensile bond strength by bonding the dental bracket with Super-bond after treating the surface of dental Nickel-Chromium alloy with sandblasting, sandblasting & tin-plating, respectively, and tin-plating. 10 pieces of Nickel-Chromium alloys with brackets bonded with Super-bond without their surface treatment were sampled as a control group, 20 pieces of Nickel-Chromium alloy brackets bonded with Super-bond after treating them with sandblasting as group I, 20 pieces of Nickel-Chromium alloys tin-plated and bonded with Super-bond after sandblasting as group II, and then 20 pieces of alloys with brackets bonded with Super-bond after tin-plating as group III. The result of those examination and comparison is summarized as follows: 1. Group I showed the mean tensile bond strength of $14.41{\pm}2.24MPa$ which was highest among 4 groups, followed by group III($13.59{\pm}.51MPa$), group II($12.27{\pm}.45MPa$), and control group($10.50{\pm}1.57MPa$), respectively. However, it was shown that there was no statistically significant difference between group I and III, group III and II, and group II and control group(p>0.05). 2. The main failure pattern of those brackets showed that $70\%$ of the control group had an adhesive failure at the bracket-Superbond interface, and $30\%$ at the Nickel-Chromium alloy-Superbond interface, while other groups did the adhesive failure at the bracket-Superbond interface. 3. When examined under SEM, it was shown that adhesives were mostly attached to the surface of the Nickel-Chromium alloy for all groups while a considerable quantity of adhesives were attached to the bracket base. Then, those samples treated only with sandblasting showed the most even and remarkable roughness of their surface.

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A study on the improvement of TiN diffusion barrier properties using Cu(Mg) alloy (Cu(Mg) alloy 금속배선에 의한 TiN 확산방지막의 특성개선)

  • 박상기;조범석;조흥렬;양희정;이원희;이재갑
    • Journal of the Korean Vacuum Society
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    • v.10 no.2
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    • pp.234-240
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    • 2001
  • The diffusion barrier properties of TiN by using Cu(Mg) alloy film have been investigated. Cu(Mg) alloy film was deposited on air-exposed TiN film. Upon annealing, interfacial MgO of 100 $\AA$ has been formed due to the reaction of Mg with oxygen existed on the surface of TiN. Combined MgO/TiN structure prevented the interdiffusion of Cu and Si up to $800^{\circ}C$. To improve the adhesion of Cu(Mg) alloy film to the TiN, TiN layer was treated by $O_2$ plasma, followed by vacuum annealing at $300^{\circ}C$. It was found that increased oxygen on the surface of TiN film by plasma treatment enhanced segregation of Mg toward the interface, resulting in the formation of dense MgO layer. Improved adhesion characteristics have been formed through this treatment. However, increased power of $O_2$ plasma led to the formation of TiO$_2$ and decreased the Mg content to be segregated to the interface, resulting in the decrease in adhesion property. In addition, the deposition of 50 ${\AA}$ Si on the TiN enhanced the adhesion of Cu(Mg) alloy to TiN without deteriorating the TiN diffusion barrier characteristics.

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Estimation of Bond Performance Improvement by Surface Treatment Equipments and Polymer Content by Boned Concrete Overlays (접착식 콘크리트 덧씌우기 경계면 처리 방식 및 폴리머 혼입률에 따른 부착성능 평가)

  • Jung, Won Kyong;Kim, Hyun Seok;Kwon, Oh Seon;Kim, Hyung Bae
    • KSCE Journal of Civil and Environmental Engineering Research
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    • v.36 no.1
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    • pp.39-47
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    • 2016
  • Repair methods of aging concrete pavement are generally used composite structure pavements, such a composite structure is subjected to a large impact on the mechanical behavior and ensure long-term commonality integrated under vehicle loads, environmental loads of the public in accordance with the bond strength between old and new concrete. A common of bonded concrete overlays that are currently available is Interface arrangements using a variety of equipment to ensure the excellent bond strength between old and new concrete than standard concrete, mixed with a material such as a polymer in order to improve the adhesion with the material itself. However, these method of constructions are being applied, depending on the developer site presents no special specifications apply when a specific application criteria objectively, this is due to the situation of each individual method, which is based on the difficulty in quality control of the site manager. In this study by performing a field test for polymer content via the variables that contribute most significantly to ensure bond strength and the field element core of the interface processing method and materials to ensure bond strength between the old and the new concrete, it was to derive the construction site construction method that can improve the performance of the bond strength through a review of the construction around the correlations and the bond strength according to the effective performance analysis of the conventional surface treatment process and variation of polymer volume fraction.

Interfacial and Mechanical Properties of Glass Fiber Reinforced Epoxy Composites with Different Crosslinking Density after Saline Water Aging (기지재의 가교밀도에 따른 유리섬유 복합재료의 염수노화 후 계면 및 기계적 물성)

  • Shin, Pyeong-Su;Kim, Jong-Hyun;Baek, Yeong-Min;Park, Ha-Seung;Kwon, Dong-Jun;Park, Joung-Man
    • Composites Research
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    • v.31 no.5
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    • pp.186-191
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    • 2018
  • Condition and properties of composites with different chemical structure of epoxy matrix were observed after saline solution treatment. Epoxy was used as matrix and the flexibility was controlled by using 2 typed-epoxies and 3 types hardeners (amine, acid anhydride and amide). Saline water treatment was conducted with 6 wt% NaCl solution at $60^{\circ}C$ for 0, 15, and 30 days. Cross section was observed and interfacial and mechanical and properties was evaluated. Amine type exhibited the highest crosslinking density and mechanical and interfacial properties whereas water absorbance was lowest. It is because that the water molecules can be hardly penetrate into the epoxy matrix or the interface between epoxy and glass fiber and it leads to saline water resistance of composites.

Electrochemical properties of heat-treated multi-walled carbon nanotubes (열처리된 탄소나노튜브 상대전극의 전기화학적 특성 연구)

  • Lee, S.K.;Moon, J.H.;Hwang, S.H.;Kim, G.C.;Lee, D.Y.;Kim, D.H.;Jeon, M.H.
    • Journal of the Korean Vacuum Society
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    • v.17 no.1
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    • pp.67-72
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    • 2008
  • We have studied the effect of heat treatment of multi-walled carbon nanotubes (MWNTs) as a counter electrode on the electro-chemical properties of dye-snsitized solar cells. MWNTs on the p-type Si substrate were synthesized by thermal chemical vapor deposition (CVD) using Fe catalysts. We prepared the two types of MWNTs samples with the different diameters. The rapid thermal annealing (RTA) treatment for the MWNTs was carried out at the growth temperature ($900^{\circ}C$) for 1 minute with $N_2$ gas atmosphere. The structural, electrical and electrochemical properties of MWNTs were investigated by field-emission scanning electron microscopy (FE-SEM), Raman spectroscopy, 2-point probe station and electrochemical impedance spectroscopy (EIS). The I(D)/I(G) ratio of heat-treated MWNTs in Raman spectra was considerably decreased. It was also found that the heat-treated MWNTs showed better redox reaction of iodide at the interface between MWNTs surface and electrolyte than that of as-grown MWNTs. The redox resistance value of heat-treated electrodes was measured to be much lower than that of as-grown electrode at the interface. As a result, the counter electrode using the heat-treated MWNTs showed better electrochemical properties.

Interfacial and Mechanical properties of Different Heat Treated Wood and Evaluation of Bonding Property between Stone and Wood for Rock Bed (열처리 조건에 따른 목재의 계면과 기계적 물성 및 돌침대용 석재/목재간 접착제에 따른 접착력 평가)

  • Kwon, Dong-Jun;Shin, Pyeong-Su;Choi, Jin-Yeong;Moon, Sun-Ok;Park, Joung-Man
    • Journal of Adhesion and Interface
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    • v.16 no.2
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    • pp.69-75
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    • 2015
  • Stone board for the rock bed was needed to reduce weight using thin thickness and reinforced materials. In this work, stone/wood board for rock bed was studied. Stone and wood were attached to reduce total weight of stone for rock bed. For reinforcing wood heat treatment method was used to change surface and mechanical properties. Mechanical strength of heat treated wood increased more than neat condition. The optimum heat treatment condition was set on $100^{\circ}C$ under tensile, flexural loads whereas surface energy was also obtained by contact angle measurement. Optimum adhesive condition was to get the maximum adhesion between stone and wood. Lap shear test was performed for stone/wood board with different adhesives such as amine type epoxy, polyurethane, chloro-rubber and vinyl chloride acetate type. Fracture surface of lap shear test was shown at wood fracture part on stone using amine type epoxy adhesive. It was found that for high adhesion between stone and wood the optimum adhesive was epoxy type for the rock bed.