• Proceedings of the Korean Society of Medical Physics Conference
• /
• 2003.09a
• /
• pp.56-56
• /
• 2003

For the treatment of superficial tumors like squamous cell carcinoma of the head and neck, 6 MV photon beam is not appropriate and a spoiler is widely used to increase dose in the buildup region, while preserving the skin sparing effect. However, commercially available treatment planning systems assume a normal unspoiled beam, thereby cannot predict the buildup dose with spoiler accurately. We aimed to implement a Monte Carlo (MC) based planning system to apply it to the radiation treatment of head and neck. Lucite with thickness of 10-mm was used for the beam spoiler with Siemens Primus 6 MV photon beam. BEAM/DOSXYZ MC system was employed to model the linac and the spoiler. To verify the calculation accuracy of MC simulations, the percent depth doses (PDDs) and profiles with and without spoiler were measured using a parallel-plate chamber. For the MC based planning, we adopted a hybrid interface system between Pinnacle (Philips, USA) and BEAM/DOSXYZ to support treatment parameters of Siemens linac and the spoiler. The measurements of PDDs and profiles agreed with the corresponding MC simulations within 2% (lSD), which demonstrate the reliability of our MC simulations. The spoiler generated electrons make a contribution to the absorbed dose up to depth of 2cm, which shows that the dominant source of increased dose from spoiler system is the contaminating electrons created by the spoiler. The whole procedures necessary for MC based treatment planning were performed seamlessly between Pinnacle and BEAM/DOSXYZ system. This ability helps to increase the clinical efficiency of the spoiler technique. In conclusion, we implemented a MC based treatment planning system for a 6 MV photon beam with a spoiler. We demonstrate sophisticated MC technique makes it possible to predict dose distributions around buildup region accurately.

• Journal of Korean Tunnelling and Underground Space Association
• /
• v.14 no.1
• /
• pp.79-91
• /
• 2012

A curved fiber reinforced polymer (FRP) panel is produced with a certain width depending on allowances of manufacturing processes and facilities. An targeted arch-shaped structure could be built by sequential connection of series of the FRP panels. The connection manner between the FRP panels could be given by chemical treatment, mechanical treatment and hybrid method. Among those, the connection between the panels by chemical treatment is commonly adopted. Therefore, For an optimized design of the connected part between FRP pannels, a number of direct shear tests have been undertaken in terms of a number of parameters: surface treatment conditions, bonding materials, etc.. As results, surface grinding condition by sand paper or surface treatment by sand blasting appear properly acceptable methods, and epoxy and acryl resins are shown to be effective bonding materials for the purpose in this study.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.1
• /
• pp.9-17
• /
• 2010

In this study, von Mises stress and total strain energy density characteristics of lead pin in PGA (Pin Grid Array) packages have been calculated by using the FEM (Finite Element Method). FEM computation is carried out with various heat treatment conditions of lead pin material under $20^{\circ}$ bending and 50 mm tension condition. Results show that von Mises stress locally concentrated on lead pin corners and interface between lead pin head and solder. von Mises stress and total strain energy density decrease as heat treatment temperature of lead pin increases. Also, round shaped corner of lead pin decreases both von Mises stress and total strain energy density on interface between lead pin head and solder. This means that PGA package reliability can be improved by changing the mechanical property of lead pin through heat treatment. This has been known that solder fatigue life decreases as total strain energy density of solder increases. Therefore, it is recommended that both optimized lead pin shape and optimized material property with high lead pin heat treatment temperature determine better PGA package reliability.

• Journal of Adhesion and Interface
• /
• v.25 no.2
• /
• pp.63-68
• /
• 2024

In this study, the contamination of gold(Au) wire according to the types of rinse applied for surface treatment in the wire bonding process is investigated and confirmed. For the surface treatment, rinses containing silicon(Si) or those based on organic materials are mainly employed. To identify their effects, surface treatment is conducted on Au wire using two types of rinse at a 1.0 wt% concentration, referred to as Si-including and Oil-based rinse-coated Au wire. Subsequently, a simulation experiment is performed to verify the reactivity of dust containing Si components that could occur in the semiconductor process. Through optical microscopy (OM) and scanning electron microscopy(SEM) analysis, it is observed that a larger amount of dust is adsorbed on the surface of Si-including rinse-coated Au wire compared with the Oil-based rinse-coated Au wire. This is attributed that the rinse containing Si components is relatively polar, causing polar interactions with dust, which also has polarity. Therefore, it is expected that using a rinse without Si components can reduce contamination caused by dust, thereby decreasing the defect rate in the practical wire bonding process.

• Composites Research
• /
• v.28 no.1
• /
• pp.22-27
• /
• 2015

Although it is important to have high strength of each of fiber and matrix, interface between fiber and matrix is most important. If NaCl water penetrates the interface, that area will be weak. So experiment about increasing interfacial strength is in process. In this study, the change of properties by mechanical, interfacial and micromechanical tests was observed after NaCl and aging treatment. The changes in mechanical properties of glass fiber were investigated using single-fiber tensile test. Interfacial properties between glass fiber and epoxy resin were evaluated using nondestructive acoustic emission (AE) and micromechanical test applied to fatigue test. Through change of fatigue properties, relative interfacial properties were evaluate. In conclusion, glass fiber diameter decreased and the reduction of mechanical and interfacial was observed with NaCl solution and aging treatment.

• Journal of Adhesion and Interface
• /
• v.21 no.3
• /
• pp.86-92
• /
• 2020

We confirmed the effects on the device performances and the charge injection characteristics of organic field-effect transistor (OFET) by selectively differently controlling the surface energies on the contact region of the substrate where the source/drain electrodes are located and the channel region between the two electrodes. When the surface energies of the channel and contact regions were kept low and increased, respectively, the field-effect mobility of the OFET devices was 0.063 ㎠/V·s, the contact resistance was 132.2 kΩ·cm, and the subthreshold swing was 0.6 V/dec. They are the results of twice and 30 times improvements compared to the pristine FET device, respectively. As the results of analyzing the interfacial trap density according to the channel length, a major reason of the improved device performances could be anticipated that the pi-pi overlapping direction of polymer semiconductor molecules and the charge injection pathway from electrode is coincided by selective surface treatment in the contact region, which finally induces the decreases of the charge trap density in the polymer semiconducting film. The selective surface treatment method for the contact region between the electrode and the polymer semiconductor used in this study has the potential to maximize the electrical performances of organic electronics by being utilized with various existing processes to lower the interface resistance.

• Journal of Korean Dental Science
• /
• v.10 no.1
• /
• pp.10-21
• /
• 2017

Purpose: The purpose of this study was to investigate the electrochemical characteristics of nanotubular Ti-25Nb-xZr ternary alloys for dental implant materials. Materials and Methods: Ti-25Nb-xZr alloys with different Zr contents (0, 3, 7, and 15 wt.%) were manufactured using commercially pure titanium (CP-Ti), niobium (Nb), and zirconium (Zr) (99.95 wt.% purity). The alloys were prepared by arc melting in argon (Ar) atmosphere. The Ti-25Nb-xZr alloys were homogenized in Ar atmosphere at $1,000^{\circ}C$ for 12 hours followed by quenching into ice water. The microstructure of the Ti-25Nb-xZr alloys was examined by a field emission scanning electron microscope. The phases in the alloys were identified by an X-ray diffractometer. The chemical composition of the nanotube-formed surfaces was determined by energy-dispersive X-ray spectroscopy. Self-organized $TiO_2$ was prepared by electrochemical oxidation of the samples in a $1.0M\;H_3PO_4+0.8wt.%$ NaF electrolyte. The anodization potential was 30 V and time was 1 hour by DC supplier. Surface wettability was evaluated for both the metallographically polished and nanotube-formed surfaces using a contact-angle goniometer. The corrosion properties of the specimens were investigated using a 0.9 wt.% aqueous solution of NaCl at $36^{\circ}C{\pm}5^{\circ}C$ using a potentiodynamic polarization test. Result: Needle-like structure of Ti-25Nb-xZr alloys was transform to equiaxed structure as Zr content increased. Nanotube formed on Ti-25Nb-xZr alloys show two sizes of nanotube structure. The diameters of the large tubes decreased and small tubes increased as Zr content increased. The lower contact angles for nanotube formed Ti-25NbxZr alloys surfaces showed compare to non-nanotube formed surface. The corrosion resistance of alloy increased as Zr content increased, and nanotube formed surface showed longer the passive regions compared to non-treatment surface. Conclusion: It is confirmed that corrosion resistance of alloy increased as Zr content increased, and nanotube formed surface has longer passive region compared to without treatment surface.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.19 no.6
• /
• pp.646-651
• /
• 2018

This paper reports that the electronic properties at a $P3HT/TiO_2$ interface associated with exciton dissociation and transport can be tailored by the insertion of a graphene quantum dot (GQD) layer. For donor/acceptor interface modification in an $ITO/TiO_2/P3HT/Al$ photovoltaic (PV) device, a continuous GQD film was prepared by a sonication treatment in solution that simplifies the conventional processes, including laser fragmentation and hydrothermal treatment, which limits a variety of component layers and involves low cost processing. The high conductivity and favorable energy alignment for exciton dissociation of the GQD layer increased the fill factor and short circuit current. The origin of the improved parameters is discussed in terms of the broad light absorption and enhanced interfacial carrier transport.

• Journal of Adhesion and Interface
• /
• v.13 no.2
• /
• pp.58-63
• /
• 2012

CFRP chip is the byproduct from carbon fiber reinforced plastic (CFRP) processing. CFRP chip is not simply a waste mainly composed of fine carbon fiber and epoxy resin. CFRP chip keeps matrix to maximize their reinforcing effect. To obtain a uniform length of carbon fiber in CFRP chip, chip was chopped ina mortar. CFRP chip should be purified to get better interface adhesion. Epoxy resin on the carbon fiber was removed by $H_2O_2$ surface etching treatment. Optimal dispersion and fabrication conditions of CFRP chip embedded in phenolic resin were determined by thermal stability for fire retardant applications. CFRP chip-phenolic composite exhibits better mechanical and thermal properties than neat phenolic resin. Surface condition of CFRP chip-phenolic composite was evaluated by static contact angle measurement. Contact angle of CFRP chip-phenolic composite was greater than neat phenolic due to heterogeneous condition of fine carbon fibers. From the evaluation for fire retardant (ASTM D635-06) test, thermal stability of CFRP chip-phenolic composite was found to be improved with higher concentration of CFRP chip.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2009.10a
• /
• pp.464-466
• /
• 2009

This study tried to examine the suitability of strip casting process such as PFC (Planar Flow Casting) method for soldering Au-Sn strip. The effect of heat treatment on the tensile behavior and mechanical properties of an Au-Sn strip was investigated through tensile test, micro hardness test, X-ray diffraction (XRD), SEM, and TEM observations. It was apparent that 20-mm width Au-Sn strip could be well produced by using planar flow casting process. Tensile results showed that tensile strength increased from 338.3MPa to 310MPa and plastic strain improved from 0% to 1.5% with heat treatment ($170^{\circ}C$/70 hrs.). The microstructure of Au-Sn strip mainly consisted of two phases; $Au_5Sn(\zeta)$ and AuSn($\sigma$). It was also found that inhomogeneous amorphous local structure continuously changed to the homogeneous two phases microstructure with heat treatment. The fractographical observation after tensile test indicated the cleavage fracture mode of as-casted Au-Sn strip. On the other hand, the heat treated Au-Sn strip showed that fracture propagated along interface between brittle AuSn and ductile $Au_5Sn$ phases. The deformation behavior of strip casted Au-Sn alloy with microstructural evolution and the improve method for ductility of this alloy was also suggested.