• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2018.06a
• /
• pp.75-75
• /
• 2018

Commercially pure titanium (CP-Ti) and Ti-6Al-4V alloys have been widely used in implant materials such as dental and orthopedic implants due to their corrosion resistance, biocompatibility, and good mechanical properties. However, surface modification of titanium and titanium alloys is necessary to improve osseointegration between implant surface and bone. Especially, when titanium oxide nanotubes are formed on the surface of titanium alloy, cell adhesion is greatly improved. In addition, plasma electrolytic oxide (PEO) coatings have a good safety for osseointegration and can easily and quickly form coatings of uniform thickness with various pore sizes. Recently, the effects of bone element such as magnesium, zinc, strontium, silicon, and manganese for bone regeneration are researching in dental implant field. The purpose of this study was researched on the surface morphology of PEO-treated Ti-6Al-4V alloy after anodic titanium oxide treatmentusing various instruments. Ti-6Al-4V ELI disks were used as specimens for nanotube formation and PEO-treatment. The solution for the nanotube formation experiment was 1 M $H_3PO_4$ + 0.8 wt. % NaF electrolyte was used. The applied potential was 30V for 1 hours. The PEO treatment was performed after removing the nanotubes by ultrasonics for 10 minutes. The PEO treatment after removal of the nanotubes was carried out in the $Ca(CH_3)_2{\cdot}H_2O+(CH_3COO)_2Mg{\cdot}4H_2O+Mn(CH_3COO)_2{\cdot}4H_2O+Zn(CH_3CO_2)_2Zn{\cdot}2H_2O+Sr(CH_2COO)_2{\cdot}0.5H_2O+C_3H_7CaO_6P$ and $Na_2SiO_3{\cdot}9H_2O$ electrolytes. And the PEO-treatment time and potential were 3 minutes at 280V. The morphology changes of the coatings on Ti-6Al-4V alloy surface were observed using FE-SEM, EDS, XRD, AFM, and scratch tester. The morphology of PEO-treated surface in 5 ion coating solution after nanotube removal showed formation or nano-sized mesh and micro-sized pores.

• Restorative Dentistry and Endodontics
• /
• v.27 no.3
• /
• pp.299-309
• /
• 2002

The purposes of this study were to evaluate the microtensile bond strength of one-step adhesives accord ing to various dentin surface treatments and to observe the interface between resin(Z-100$^{TM}$) and dentin under SEM. In this study forty-five non-caries extracted human molars and three adhesive systems were used ; AlI-Bond 2(AB), One-Up Bond F(OU), AQ-Bond(AQ). ; In Group 1, 2, 3, AB was used and tooth surfaces were treated by smearing(S), ultrasonic cleansing(US), etching(E) respectively. In Group 4. 5, 6, One-Up Bond F was used and tooth surfaces were also treated as the same way above. In Groups 7, 8, 9, AQ Bond was used and tooth surfaces wet$.$e treated as the same way. Each specimen was prepared for microtensile bond testing, and were stored for 24hrs in 37$^{\circ}C$ distilled water. After that, microtensile bond strength for each specimen was measured. Specimens were fabricated to examine the failure patterns of interface between resin and dentin and observed under the SEM. The results were as follows ; 1. The results(mean$\pm$SD) of microtensile test were group 1, 25.69$\pm$4.31MPa; group 2, 40.93$\pm$10.94MPa; group 3, 47.65$\pm$8.85MPa； group 4, 35.98$\pm$9.14MPa； group 5, 39.66$\pm$8.45MPa; group 6, 43.26$\pm$13.01MPa; group 7, 25.07$\pm$4.2MPa；group 8, 30.4$\pm$4.74MPa；group 9, 33.61$\pm$7.88MPa. 2. One-Up Bond F was showed the highest value of 36.98$\pm$9.14MPa in dentin surface treatment with smearing, and there were significant differences to the other groups (p<0.05). 3. All-Bond 2 was showed the highest value of 40.93$\pm$10.94MPa in dentin surface treatment with ultra-sonic cleansing, but was no significant difference to One-Up Bond F(p>0.05) 4. All-Bond 2 was showed the highest value of 47.65$\pm$8.85MPa in dentin surface treatment with etch ing(10%phosphoric acid), and there were significant differences to the other groups(p<0.05). 5. All-Bond 2 was showed the highest value of 47.65$\pm$8.85MPa in dentin surface treatment according to manufacture's directions. but was no significant difference to One-Up Bond F(p>0.05). 6. AQ Bond was skewed the lowest microtensile bond strength with various dentin surface treatment, and the were significant differences to the other groups(p<0.05).

• The Journal of Advanced Prosthodontics
• /
• v.8 no.2
• /
• pp.75-84
• /
• 2016

PURPOSE. To evaluate the effect of various surface treatments on the surface structure and shear bond strength (SBS) of different ceramics. MATERIALS AND METHODS. 288 specimens (lithium-disilicate, leucite-reinforced, and glass infiltrated zirconia) were first divided into two groups according to the resin cement used, and were later divided into four groups according to the given surface treatments: G1 (hydrofluoric acid (HF)+silane), G2 (silane alone-no heat-treatment), G3 (silane alone-then dried with $60^{\circ}C$ heat-treatment), and G4 (silane alonethen dried with $100^{\circ}C$ heat-treatment). Two different adhesive luting systems were applied onto the ceramic discs in all groups. SBS (in MPa) was calculated from the failure load per bonded area (in $N/mm^2$). Subsequently, one specimen from each group was prepared for SEM evaluation of the separated-resin-ceramic interface. RESULTS. SBS values of G1 were significantly higher than those of the other groups in the lithium disilicate ceramic and leucite reinforced ceramic, and the SBS values of G4 and G1 were significantly higher than those of G2 and G3 in glass infiltrated zirconia. The three-way ANOVA revealed that the SBS values were significantly affected by the type of resin cement (P<.001). FIN ceramics had the highest rate of cohesive failure on the ceramic surfaces than other ceramic groups. AFM images showed that the surface treatment groups exhibited similar topographies, except the group treated with HF. CONCLUSION. The heat treatment was not sufficient to achieve high SBS values as compared with HF acid etching. The surface topography of ceramics was affected by surface treatments.

• Journal of Surface Science and Engineering
• /
• v.29 no.4
• /
• pp.278-285
• /
• 1996

The structure of coating layer formed by hot dip Al-Cu alloy coating on Monel 1400 metal was studied. The coating layer consists of alloyed layer adjacent to the Monel 400 substrate and Al-Cu alloy. It was found that the hardness of coating increased with dipping time and heat treatment associated with the diffusion and the formation of intermetallic compound at the interface. However the thickness of coating layer was decreased at high dipping temperature due to tile higher viscosity of liquid coating alloy. Diffusion heat treatment at $600^{\circ}C$ after coating resulted in the disappearence of adhered Al(Cu) and $CuAl_2$ phases, and then they transformed into the new phases of CuAl and Al7Cu4Ni at coating layer.

• Electronics and Telecommunications Trends
• /
• v.35 no.3
• /
• pp.98-110
• /
• 2020

Precise detection and modulation of electrical signal patterns passing through peripheral nerves connecting organs and brainstems, referred to as electroceuticals or bioelectronic medicines, have emerged as a new type of treatments for neural disorders and chronic diseases. With the rapid advancements in neural interface technologies, electroceuticals are the focus of treatments for these disorders or diseases. In this paper, we introduced electroceuticals as an extension of neuromodulation for the treatment of chronic diseases, such as diabetes, rheumatoid arthritis, obesity, and bladder dysfunction, without side effects that are unavoidably elicited when conventional drugs are taken. Further, this paper reviewed the anatomy of the peripheral nervous system, treatment examples for chronic diseases, technological demands for peripheral nerve interfacing, global R&D programs and market trends for electroceuticals, and prospects on electroceuticals.

• Journal of the Korean Vacuum Society
• /
• v.6 no.S1
• /
• pp.16-22
• /
• 1997

ion beam processing of materials for medical application has gained increasing interest in the last decade and the implantation of nitrogen into TI-6AI-4V to improve corrosive-wear performance is currently used for processing of total hip and knee joints. Oxides and nitrides of Ti, Zr, Al, Cr were deposited on TI-6AI-4V substrates by DC magnetron sputtering dual ion beam sputtering and ion beam assisted deposition. The cytotoxicity of these films were investigated by MTT method and showed comparable to untreated TI-6AI-4V Plasm-sprayed hydroxyapatite(HAp) coatings showed excellent cytotoxicity regardless of heat treatment. intermediate layer coatings of nitrides and oxides increased the bond strength of HAp to substrate by intrdducing chemical bond at interface. Heat treatment of HAp coatings also improved the chemical bond at interfaces and increased the bond strength of untreated TI-6AI-4V to 16.4 kg/$\textrm{cm}^2$ but still lower than 33.1 kg./$\textrm{cm}^2$ of ir oxide as a imtermediate layer caoting.

• International Journal of Automotive Technology
• /
• v.1 no.2
• /
• pp.71-77
• /
• 2000

High temperature materials in service are subjected to mechanical damage due to operating load and metallurgical damage due to operating temperature. Therefore, when designing or assessing life of high temperature components, both factors must be considered. In this paper, the effect of tensile hold time on high temperature fatigue crack growth and long term prior thermal aging heat treatment on creep rupture behavior were investigated using STS 316L and STS 316 austenitic stainless steels, which are widely used for high temperature components like in automotive exhaust and piping systems. In high temperature fatigue crack growth tests using STS 316L, as tensile hold time increased, crack growth rate decreased in relatively short tensile hold time region. In long term aged specimens, cavity type microcracks have been observed at the interface of grain boundary and coarsened carbide.

• Journal of the Korean Society for Heat Treatment
• /
• v.16 no.6
• /
• pp.335-340
• /
• 2003

To improve properties of wear resistance and anti-corrosion of the trivalent chromium platings, oxinitrocarbunsing and steam oxidation were conducted. Armophous trivalent Cr platings could be transformed to chromium carbides of high hardness, that showed low friction and wear rate. Even though micro-cracks were within as platings, superior anti-corrosion property was obtained by these treatments due to healing of cracks at the interface between the trivalent chromium platings and substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2001.07a
• /
• pp.447-450
• /
• 2001

Abstract-Si direct bonding(SDB) technology is very attractive for both Si-on-insulator(SOI) electric devices and MEMS applications because of its stress free structure and stability. This paper presents on pre-bonding according to HF pre-treatment conditions in Si wafer direct bonding. The characteristics of bonded sample were measured under different bonding conditions of HF concentration, and applied pressure. The bonding strength was evaluated by tensile strength method. The bonded interface and the void were analyzed by using SEM and IR camera, respectively. Components existed in the interlayer were analysed by using FT-lR. The bond strength depends on the HF pre-treatment condition before pre-bonding (Min : 2.4kgf/cm$^2$∼Max : 14.9kgf/cm$^2$).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.5
• /
• pp.399-402
• /
• 2007

The effects of heat treatment on the electrical properties of strained-Si/SiGe-on-insulator (SGOI) devices were examined. We proposed the optimized heat treatment processes for improving the back interfacial electrical properties in SGOI-MOSFET. By applying the additional pre-RTA (rapid thermal annealing) before gate oxidation step and the post-RTA after source/drain dopant activation step, the electrical properties of strained-Si channel on $Si_{1-x}Ge_x$ layer were greatly improved, which resulting the improvement of the driving current, transconductance, and leakage current of SGOI-MOSFET.