• Journal of Korea Multimedia Society
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• v.17 no.11
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• pp.1263-1269
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• 2014

As rapid development of new hardware control interface technology, new concepts have been being proposed and emerged. In this paper, a new approach based on leap motion system is proposed. While we employ a position information from sensor, the hand gesture recognition is suggested with the pre-defined patterns. To do this, we design a recognition algorithm with hand gesture and finger patterns. We apply the proposed scheme to 3-dimensional avatar controling and editing software tool for making animation in the cyber space as a representative application. This proposed algorithm can be used to control computer systems in medical treatment, game, education and other various areas.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.137-137
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• 2015

The purposed of this work was to observe hydroxyapatite precipitation phenomena on micro-pore formed Ti-Nb alloy by PEO technique. The Ti-30Nb and Ti-30Ta alloys were remelted at least ten times in order to avoid inhomogeneity, and then cylindrical specimens (diameter 10 mm, thickness 4 mm) were cut by using laser from cast ingots of the Ti alloys. Heat treatment was carried out at $1050^{\circ}C$ for 2 h for homogenization in argon atmosphere. The morphologic change of the alloys were examined by X-ray diffractometer (XRD) and field emission scanning electron microscopy (FE-SEM).

• Journal of Surface Science and Engineering
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• v.32 no.4
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• pp.503-512
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• 1999

The crystal structure and the microstructure of the intermetallic compounds formed in the interface between In solder and Au/Ni/Ti thin films have been investigated by XRD, SEM, and TEM. Indium solder was deposited on the Au/Ni/Ti thin films/Si substrate by evaporation. The heat treatments simulated the flip chip solder joining were performed in RTA system or in furnace. $Auln_2$ phase is formed in all specimens.$ In_{27}$ $Ni_{10}$ and/or $In_{X}$ $Ni_{Y}$ phase are formed in the interface between $Auln_2$ and Ni depending the heat treatment conditions.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.293-293
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• 2014

The applicability of graphene has been demonstrated in the electronic fields. But, high performance of graphene is limited by the contact resistance (Rc) at the metal-graphene interface. Recently, Rc was found to be improved by forming edge-contacted graphene via theoretical simulation. Based on the differences between the surface and edge contacts at the M-G interface, we demonstrate "edge-contacted" graphene through the use of a controlled plasma processing technique that generates the edge structure of the bond and significantly reduces the contact resistance. The contact resistance attained by using pre-plasma processing was of $270{\Omega}{\cdot}{\mu}m$. Mechanisms of pre-plasma process leading to low Rc was revealed by SEM and Raman spectroscopy. In the end, controlled pre-plasma processing enabled to fabricate CVD-graphene field effect transistors with an enhanced adhesion and improved carrier mobility.

• Korean Membrane Journal
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• v.1 no.1
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• pp.100-105
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• 1999

A novel system to thicken the concentrated colloidal solution from membrane water treat-ment processes was developed. A hollow-fiber microfilter(hydrophilic polyethylene nominal pore size 0.1 ${\mu}$m total surface area 0.42 m2) was installed in an acrylic housing that has an aeration port 5 cm below the membrane and a clarifier in the bottom. The concentrate was uniformly supplied from the top of the housing. Bacuum filtration caused downward flow of concentrate and as a result thickening interface. The addition of poly-aluminum chloride (PAC) resulted in rapid increase of trans-membrane pressure (TMP) and in no improvement of the filtered water turbidity and thickening process. Two types of con-centrate and concentrate turbidity had little effect on the increase of TMP and concentrate thickening. It was observed that for the same height of membrane housing membrane surface area to housing volume (A/V) ratio had significant effect on the increase of TMP. When the housing volume was increased ten times the increasing rate of TMP was three times faster as compared to the original housing. A hydraulic model successfully simulated the formation and sedimentation of thickening interface.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1307-1308
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• 2006

The purpose of this study was to examine the interfacial reaction between diamond grits and Ni-based, Ag-based, brazing filler metal, respectively. The morphology of the interface between diamond grits and Ni-based, filler metal exhibited a very good condition after this heat treatment. Cr-carbide and Ni-rich compounds were detected by XRD analysis in the vicinity of the interface between diamond grits and Ni-based, filler metal after vacuum induction brazing. Chromium carbide is considered to play an important role in the high bonding strength achieved between diamonds grits and the brazing alloy.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.194-194
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• 2013

In order to investigate nanotube morphology change of Ti-6Al-4V alloys by heat treatments, the Ti-6Al-4V alloys were used in this study. In non-treated Ti-6Al-4V alloy case, nanotubes only exhibited at ${\alpha}$ phase region with dissolved V-oxide area of ${\beta}$ phase. However, in Ti-6Al-4V alloy at $800^{\circ}C$ WQ case, nanotubes exhibited at both ${\alpha}$ and ${\beta}$ phase region. Electrochemical corrosion studies showed that the nanotubular alloy at $800^{\circ}C$WQ possesses slightly higher corrosion resistance than non-treated nanotubular alloy.

• Carbon letters
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• v.5 no.2
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• pp.62-67
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• 2004

Performance of carbon-carbon composites is known to be influenced by the fibre matrix interactions. The present investigation was undertaken to ascertain the development of microstructure in such composites when carbon fibres possessing different surface energies (T-300, HM-35, P120 and Dialed 1370) and pitch matrices with different characteristics (Coal tar pitch $SP110^{\circ}C$ and mesophase pitch $SP285^{\circ}C$) are used as precursor materials. These composites were subjected to two different heat treatment temperatures of $1000^{\circ}C$ and $2600^{\circ}C$. Quite interesting changes in the crystalline parameters as well as the matrix microstructure are observed and attempt has been made to correlate these observations with the fibre matrix interactions.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1978-1980
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• 2000

Because the interfaces between two different materials are the weak-link in the underground power transmission systems, they affects the stability of insulation systems. In this paper, Epoxy/EPDM interface is selected and investigated the optimum condition by variation of interfacial conditions such as roughness of surface, spreading of oils, interfacial pressure and temperature. The breakdown times under the constant voltage below the breakdown voltage were also gamed. The breakdown voltage at the after laying time equivalent to is calculated by the V-t characteristic and the inverse power law. When this is done. the characteristic life exponent n is used and the long time breakdown voltage can be evaluated.

• Journal of the Korean Ceramic Society
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• v.36 no.8
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• pp.863-870
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• 1999

SOI(silicon on insulafor) was fabricated through the direct bonding using (100) Si wafer and 4$^{\circ}$off (100) Si wafer to investigate the stacking faults in silicon at the Si/SiO2 oxidized and bonded interface. The treatment time of wafer surface using MSC-1 solution was varied in order to observe the effect of cleaning on bonding characteristics. As the MSC-1 treating time increased surface hydrophilicity was saturated and surface microroughness increased. A comparison of surface hydrophilicity and microroughness with MSC-1 treating time indicates that optimum surface modified condition for time was immersed in MSC-1 for 2 min. The SOI structure directly bonded using (100) Si wafer and 4$^{\circ}$off (100) Si wafer at the room temperature were annealed at 110$0^{\circ}C$ for 30 min. Then the stacking faults at the bonding and oxidation interface were examined after the debonding. The results show that there were anomalies in the gettering of the stacking faults at the bonded region.