• Korean Journal of Materials Research
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• v.10 no.3
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• pp.212-217
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• 2000

Dielectric thin films for TFT(thin film transistor)s, such as silicon nitride$(Si_3N_4)$ and silicon oxide$(SiO_2)$, are usually deposited at $200~300^{\circ}C$. In this study, authors have tried to form dielectric films not by deposition but by oxidation with ECR(Electron Cyclotron Resonance) oxygen plasma, to improve the interface properties was not intensionally heated during oxidation. THe oxidation was performed consecutively without breaking vacuum after the deposition of a-Si: H films on the substrate to prevent the introduction of impurities. In this study, especially pulse mode of microwave power has been firstly tried during FCR oxygen plasma formation. Compared with the case of the continuous wave mode, the oxidation with the pulsed ECR results in higher quality silicon oxide$SiO_X$ films in terms of stoichiometry of bonding, dielectric constants and surface roughness. Especially the surface roughness of the pulsed ECR oxide films dramatically decreased to one-third of that of the continuous wave mode cases.

• Journal of Adhesion and Interface
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• v.16 no.3
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• pp.116-121
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• 2015

In this study, octadecyltrichlorosilane (OTS) has been used to replace fluoro-silanes which are much more expensive than OTS. In order to improve the mechanical and adhesive properties of coating layers, inorganic binders were separately synthesized based on sol-gel reaction in acidic condition. Since the synthesized silica nanoparticles gave only nano-scaled roughness, superhydrophobicity is not well obtained. Here, we present a new simple approach by intentionally inducing particle aggregation in the solution which is controlled by adjusting solvent amount. With selecting suitable sizes of silica nanoparticles, superhydrophobic surfaces were obtained with increasing the amount of organic solvents after surface hydrophobization using OTS, and an extremely water-repellent behavior was observed with zero sliding angle. This superhydrophobicity was achived only for the dielectric constant lower than 25, regardless of the composition of solvent, meaning that the dielectric constant could be an excellent indicator for fabricating superhydrobic surfaces induced by particle aggregation in the solution.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.6
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• pp.479-485
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• 2002

We have investigated the effects of various wafers cleaning on glass/Si bonding using 4 inch Pyrex glass wafers and 4 inch silicon wafers. The various wafer cleaning methods were examined; SPM(sulfuric-peroxide mixture, $H_2SO_4:H_2O_2$ = 4 : 1, $120^{\circ}C$), RCA(company name, $NH_4OH:H_2O_2:H_2O$ = 1 : 1 : 5, $80^{\circ}C$), and combinations of those. The best room temperature bonding result was achieved when wafers were cleaned by SPM followed by RCA cleaning. The minimum increase in surface roughness measured by AFM(atomic force microscope) confirmed such results. During successive heat treatments, the bonding strength was improved with increased annealing temperatures up to $400^{\circ}C$, but debonding was observed at $450^{\circ}C$. The difference in thermal expansion coefficients between glass and Si wafer led debonding. When annealed at fixed temperatures(300 and $400^{\circ}C$), bonding strength was enhanced until 28 hours, but then decreased for further anneal. To find the cause of decrease in bonding strength in excessively long annealing time, the ion distribution at Si surface was investigated using SIMS(secondary ion mass spectrometry). tons such as sodium, which had been existed only in glass before annealing, were found at Si surface for long annealed samples. Decrease in bonding strength can be caused by the diffused sodium ions to pass the glass/si interface. Therefore, maximum bonding strength can be achieved when the cleaning procedure and the ion concentrations at interface are optimized in glass/Si wafer direct bonding.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.47-51
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• 2013

Chemical mechanical polishing (CMP) has become one of the key processes in wafer level stacking technology for 3D stacked IC. In this study, two-step CMP process was proposed to polish $Cu/SiO_2$ hybrid bonding surface, that is, Cu CMP was followed by $SiO_2$ CMP to minimize Cu dishing. As a result, Cu dishing was reduced down to $100{\sim}200{\AA}$ after $SiO_2$ CMP and surface roughness was also improved. The bonding interface showed no noticeable dishing or interface line, implying high bonding strength.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.1
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• pp.1-6
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• 2004

The requirements for harsh environment electronic controllers in automotive applications have been steadily becoming more and more stringent. Electronic substrate technologists have been responding to this challenge effectively in an effort to meet the performance, reliability and cost requirements. An effect of the plasma cleaning at the ECM(Engine Control Module) alumina substrate and the intermetallic compound layer between Sn-37wt%Pb solder and pad joints after reflow soldering has been studied. Organic residual carbon layer was removed by the substrate plasma cleaning. So the interfacial adhesive strength was enhanced. As a result of AFM measurement, conductor pad roughness were increased from 304 nm to 330 nm. $Cu_6/Sn_5$ formed during initial reflow process at the interface between TiWN/Cu pad and solder grew by the succeeding reflow process, so the grains became coarse. A cellular-shaped $Ag_3Sn$ was observed at the interface between Ag-Pd conductor pad and solder. The diameters of the $Ag_3Sn$ grains ranged from about 0.1∼0.6 $\mu\textrm{m}$. And a needle-shaped was also observed at the inside of the solder.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.39-47
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• 2003

Cr thin films were deposited on photosensitive polyimide substrates by RF bias sputtering and DC sputtering and the interfaces between Cr thin film and polyimide were observed using TEM. When the polyimide surface was in-situ RF plasma cleaned at the RF power density of 0.13-2.12 $W/cm^2$, increasing of RF power density changed the morphology of polyimide surfaces from round dig to sharp shape, and surface roughness increased by anisotropic etching. The intermixed layer-like interfaces between Cr and polyimide were observed in the RF bias sputtered specimens. This interface seems to be formed due to the RF cleaning effect; the polyimide surface was RF plasma cleaned while RF power was increased to the setting point before Cr deposition.

• Asian Journal of Atmospheric Environment
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• v.8 no.2
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• pp.81-88
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• 2014

Noise-barriers on both sides of the roadway (hereafter referred to as double noise-barriers), are a common feature along roads in Korea, and these are expected to have important effects on the near-road air pollution dispersion of vehicle emissions. This study evaluated the double noise-barrier impact on near-road air pollution dispersion, using a FLUENT computational fluid dynamics (CFD) model. The realizable k-${\varepsilon}$ model in FLUENT CFD code was used to simulate vehicle air pollutant dispersion, in around 11 cases of double noise-barriers. The simulated concentration profiles and surface concentrations under no barrier cases were compared with the experimental results. The results of the simulated flows show the following three regimes in this study: isolated roughness (H/W=0.05), wake interface (H/W=0.1), and skimming flow (H/W>0.15). The results also show that the normalized average concentrations at surface (z=1 m) between the barriers increase with increasing double noise-barrier height; however, normalized average concentrations at the top position between the barriers decrease with increasing barrier height. It was found that the double noise-barrier decreases normalized average concentrations of leeward positions, ranging from 0.8 (H/W=0.1, wake interface) to 0.1 (H/W=0.5, skimming flow) times lower than that of the no barrier case, at 10 x/h downwind position; and ranging from 1.0 (H/W=0.1) to 0.4 (H/W=0.5) times lower than that of the no barrier case, at 60 x/h downwind position.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.4
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• pp.400-413
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• 2016

The horizontal shear capacity when the flange of a steel girder is replaced with 80 MPa concrete is important for its structural safety. In this study, 6 specimens with different interface conditions were designed and fabricated based on the Limit State Design Code on Korean Highway Bridges and static tests were performed to measure the horizontal shear capacity. Not only the resistance factors of the stud shear connector, concrete and reinforcement, but also the surface conditions of the casing concrete and spacing of the horizontal shear reinforcements were used as the experimental variables. The experiments showed that the interfaces between the steel girder and the concrete flange have stronger joint performance than those between the concrete flange and deck slab. To ensure the composite action in the plastic zone, the conservative horizontal shear reinforcement is more important than the roughness in the concrete face.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.23-23
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• 2018

In this study, new titanium alloys were prepared by adding elements such as tantalum (Ta), zirconium (Zr) and the like to complement the biological, chemical and mechanical properties of titanium alloys. The Ti-40Ta-xZr ternary alloy was formed on the basis of Ti-40Ta alloy with the contents of Zr in the contents of 0, 3, 7 and 15 wt. %. Plasma electrolytic oxidation (PEO), which combines high-voltage sparks and electrochemical oxidation, is a novel method to form ceramic coatings on light metals such as Ti and its alloys. These oxide film produced by the electrochemical surface treatment is a thick and uniform porous form. It is also composed of hydroxyapatite and calcium phosphate-based phases, so it has the characteristics of bone inorganic, non-toxic and very high bioactivity and biocompatibility. Ti-40Ta-xZr alloys were homogenized in an Ar atmosphere at $1050^{\circ}C$ for 1 hour and then quenched in ice water. The electrochemical oxide film was applied by using a power supply of 280 V for 3 minutes in 0.15 M calcium acetate monohydrate ($Ca(CH_3COO)_2{\cdot}H_2O$) and 0.02 M calcium glycerophosphate ($C_3H_7CaO_6P$) electrolyte. A small amount of 0.0075M zinc acetate and magnesium acetate were added to the electrolyte to enhance the bioactivity. The mechanical properties of the coated surface of Ti-40Ta-xZr alloys were evaluated by Vickers hardness, roughness test, and elastic modulus using nano-indentation, and the surface wettability was evaluated by measuring the contact angle of the coated surface. In addition, cell activation and differentiation were examined by cell culture of HEK 293 (Human embryonic kidney 293) cell proliferation. Surface properties of the alloys were analyzed by scanning electron microscopy(FE-SEM), EDS, and X-ray diffraction analysis (XRD).

• Journal of Adhesion and Interface
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• v.5 no.3
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• pp.1-9
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• 2004

Using the methods which described in ISO 4588, ASTM D2651 and the selected literature, we investigated the best conditions of acid treatment for stainless steel and carbon steel. The acid treatments were conducted with four different acid solutions which were prepared for stainless steel and carbon steel specimen. We observed the contact angle and morphology and roughness of the metal surface and the thickness change at various treatment conditions as treatment temperature and time. Also, we investigated the characteristics of the surface aging according to air exposure after surface treatment. As a result, the optimal temperature of the acid treatment for stainless steel and carbon steel were each obtained at $83^{\circ}C$ and $63^{\circ}C$. Also, it was confirmed that the acid treatments for the metal surface were accompanied with the decrease of thickness and the change of surface morphology due to significant erosion that depend on treatment methods. And also, it was characterized that the aspect of surface aging by air exposure was highly depended on the method of acid treatment.