• Title/Summary/Keyword: interface edge crack

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Stress intensity factors for an interface crack between an epoxy and aluminium composite plate

  • Itou, S.
    • Structural Engineering and Mechanics
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    • v.26 no.1
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    • pp.99-109
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    • 2007
  • A cracked composite specimen, comprised of an epoxy and an aluminium plate, was fractured under a tensile load. In this paper, two crack configurations were investigated. The first was an artificial center crack positioned in the epoxy plate parallel to the material interface. The other was for two edge cracks in the epoxy plate, again, parallel to the interface. A tensile test was carried out by gradually increasing the applied load and it was verified that the cracks always moved suddenly in an outward direction from the interface. The d/a ratio was gradually reduced to zero, and it was confirmed that the maximum stress intensity factor value for the artificial center crack, $K_{{\theta}{\theta}}^{max}$, approached that of an artificial interface crack,$K_{{\theta}{\theta}}^{ifc\;max}$ (where: 2a is the crack length and d is the offset between the crack and interface). The same phenomenon was also verified for the edge cracks. Specifically, when the offset, d, was reduced to zero, the maximum stress intensity factor value, $K_{{\theta}{\theta}}^{max}$, approached that of an artificial interface edge crack.

Analysis on the Bonded Single Lap-Joint Containing the Interface Edge Crack (에지계면균열을 갖는 단순겹치기 접착이음의 강도평가)

  • Yoo, Young-Chul;Park, Jung-Hwan;Lee, Won
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.6
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    • pp.159-166
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    • 1998
  • The problem of interface crack in the bonded structures has received a great deal of attention in recent years. In this paper the aluminum bonded single lap-joint containing the interface edge crack is investigated. The tensile load and the average shear stress of the adhesive joints which have different crack length are obtained from the static tensile tests. The critical value of crack length to provoke the interface fracture is determined to a/L=0.4, where a is the interface crack length and L is the adhesive lap-length. The fracture mechanical parameters are introduced to confirm the existence of the critical crack length. The compliance and the stress intensity factors are calculated using the displacement and the stress near the interface crack tip by the boundary element method. These numerical results support the experimental results that the critical value of a/L is 0.4. It is known that the compliance and the stress intensity factors are the efficient parameters to estimate the bonded single lap-joint containing the interface edge crack.

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Establishment of Fracture Criteria for Mixed Mode in Bonded Dissimilar Materials with an Crack Emanating from an Edge Semicircular Hole (이종 접합체의 원공에서 파생하는 균열에 대한 혼합모드 파괴기준의 설정)

  • Jeong, Nam-Yong;Song, Chun-Ho
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.25 no.6
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    • pp.907-915
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    • 2001
  • Application of bonded dissimilar materials in many industries are increasing. When these materials are to be used in structures, it needs to evaluate the failure strength applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared, experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/Epoxy bonded dissimilar materials were proposed.

Analysis on the Interface Edge Crack in Aluminum Bonded Single Lap-joint (알루미늄 단순겹치기 접착이음의 에지계면균열에 대한 연구)

  • Yu, Y.C.;Park, J.H.;Jeong, E.S.;Yi, W.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1997.04a
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    • pp.655-659
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    • 1997
  • The analysis of cracks at the interface between dissimilar materilar has received a great deal of attention in recent years. In this paper we conducted the static tensile test for the aluminum bonded single lap-joint with the interface edge crack. Comparing this results, that is ultimate load and strain value of aluminum adherend by strain gauge with the fracture mechanics parameters, compliance and stress intensity factors acquied from the boundary element analysis, we concluded that there are critical value of crack length to provoke the interface fracture.

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Influence of Circular Hole for Fracture Criteria of Interface Crack in Bonded Dissimilar Materials (이종접합 계면균열의 파괴기준에 대한 원공의 영향)

  • 정남용
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1999.10a
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    • pp.301-306
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    • 1999
  • Application of bonded dissimilar materials in various industries are increasing. When these materials are used in structures, it needs to investigate strength evaluation applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared for the static tests so that experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criteria of mixed mode crack were analyzed. From the results, the fracture criteria and the method of strength evaluation by the fracture toughness in Al/ Epoxy bonded dissimilar materials were proposed.

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Anaysis of the Interfacial Stress Intensity Factors and Fatigue Crack Growth Behaviour for the Edge Interface Crack in the Dissimilar Materials (이종재료 접합재의 편측접합계면균열의 응력확대계수 해석 및 피로균열성장 해석)

  • 이갑래;최용식
    • Journal of the Korean Society of Safety
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    • v.6 no.2
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    • pp.5-13
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    • 1991
  • In this paper, the interfacial stress intensity factors( $K_{i}$$K_1$+i $K_2$) for the edge interface crack in the dissimilar materials(isotropic-isotropic materials, isotropic-composite materials) were analysed by BEM(Boundary Element Method). The fatigue crack growth behaviour was investigated by load constant fatigue test. From the experimental results, the relationship between da/dN and interfacial stress intensity facto, ( $K_{i}$ or $K_1$) can be expressed by Paris'law for homogeneous materials.s.s.

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Viscoelastic Analysis of Stress Intensity Factor for Interface Edge Crack in a Unidirectional Liminate (단일방향 복합재료의 공유면에 존재하는 계면 모서리균열의 점탄성 해석)

  • 이상순;김범식
    • Computational Structural Engineering
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    • v.10 no.1
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    • pp.129-134
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    • 1997
  • Interfacial stress singularity in a unidirectional two-dimensional laminate model consisting of an elastic fiber and a viscoelastic matrix has been investigated using the time-domain boundary element method. First, the interfacial singular stresses between the fiber and the matrix of a unidirectional laminate subjected to a uniform transverse tensile strain have been investigated near the free surface, but without any defect or any edge crack. Such a stress singularity might lead to fiber-matrix debonding or interfacial edge cracks. Then, the overall stress intensity factor for the case of a small interfacial edge crack of length a has been computed.

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Establishment of fracture Criterion for Mixed Mode in Bonded Dissimilar Materials (이종 접합체에 대한 혼합모드 파기기준의 설정)

  • 정남용
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1998.10a
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    • pp.254-260
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    • 1998
  • Application of bonded dissimilar materials in various industries are increasing. When these materials are used in structures, it needs to investigate strength evolution applying fracture mechanics. Al/Epoxy bonded dissimilar materials with an interface crack and an interface crack emanating from an edge semicircular hole were prepared for the static tests so that experiment of fracture toughness were carried out. Stress intensity factors of interface cracks in bonded dissimilar materials were computed with boundary element method(BEM) and the fracture criterion of mixed mode crack were analyzed. From the results, the fracture criterion and the method of strength evolution by the fracture toughness in Al/Epoxy bonded dissimilar materials were proposed.

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Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.14 no.3
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    • pp.309-315
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    • 2001
  • The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

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Boundary Element Analysis for Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착계면의 모서리 균열에 대한 경계요소 해석)

  • 이상순
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.3
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    • pp.25-30
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    • 2001
  • The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

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