• Journal of Institute of Control, Robotics and Systems
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• v.15 no.3
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• pp.323-329
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• 2009

This paper presents an automatic LCD gamma control system using gamma curve optimization. It controls automatically gamma adjustment registers in mobile LCD driver IC to reduce gamma correction error and adjusting time. The proposed gamma system contains Module-Under-Test (MUT, LCD module), PC installed with program, multimedia display tester for measuring luminance, and control board for interface between PC and LCD module. Proposed algorithm and program are applicable for most of the LCD modules. It is realized to calibrate gamma values of 1.8, 2.0, 2.2 and 3.0. The control board is designed with DSP and FPGA, and it supports various interfaces such as RGB and CPU. Developed automatic gamma control system showed significantly reduced gamma adjusting time of 240 sec. and much less average gamma error of 11% than 42h and 27% with conventional manual method. We believe that the proposed system is very useful to provide high-quality LCD and to improve production process.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.3
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• pp.95-100
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• 2004

This paper reports a potential problem in the electrical performance of the silicide film to silicon contacts with respect to the scaling trend in integrated circuit (IC) devices. The effects of elastic strain on the agglomeration of the coherent silicide film embedded in an infinite matrix are studied employing continuum linear elasticity and finite-difference numerical method. The interface atomic diffusion is taken to be the dominant transport mechanism where both capillarity and elastic strain are considered for the driving forces. Under plane strain condition with elastically homogeneous and anisotropic system with cubic symmetry, the dilatational misfit and the tetragonal misfit in the direction parallel to the film thickness are considered. The numerical results on the shape evolution agree with the known trend that the equilibrium aspect ratio of the film increases with the elastic strain intensity. When the elastic strain intensity is taken to be only a function of the film size, the flat film morphology with a large aspect ratio becomes increasingly unstable since the equilibrium aspect ratio decreases, as the film scales. The shape evolution results in a large decrease in contact to silicon area, and may deteriorate the electrical performances.

• Journal of Electrical Engineering and Technology
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• v.9 no.6
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• pp.2114-2117
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• 2014

Joint pain is generally a common disorder not only for the old aged people but also for the immunocompromised patients. The present proposed study reveals the presence of inflammatory diseases in joint generally diagnosed by removing synovial fluid and changes in the volume and composition are examined for the presence of WBC and crystals. This study implement a non-invasive approach to identify the changes in joint fluid by measuring the changes in electrical property of the synovial tissue under the influence of electrical current signal with frequency range between 100 kHz to 300 kHz. The response of tissue for the current signal was measured in terms of potential drop across the tissue. The hardware system design consists of input and output sections. The input section which applies current signal to upper limb joint region is made of ICL8038 function generator IC with amplifier and voltage to current converter. The output section picks voltage variation using metal surface electrode, amplifier, ADC, PIC microcontroller and LCD interface. 100 patient inclusive of normal and disease affected patients where examined for upper limb synovial fluid variation and inflammatory diseases were identified.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.3
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• pp.199-204
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• 2009

The effect of temperature on ACF thermocompression bonding for FPD assembly was investigated, It was found that Au bumps on driver IC's were not bonded to the glass substrate when the bonding temperature was below $140^{\circ}C$ so bonds were made at temperatures of $163^{\circ}C$, $178^{\circ}C$ and $199^{\circ}C$ for further testing. The bonding time and pressure were constant to 3 sec and 3.038 MPa. To test bond reliability, FPD assemblies were subjected to thermal shock storage tests ($-30^{\circ}C$, $1\;Hr\;{\leftrightarrow}80^{\circ}C$, 1 Hr, 10 Cycles) and func! tionality was verified by driver testing. It was found all of FPDs were functional after the thermal cycling. Additionally, Au bumps were bonded using ACF's with higher conductive particle densities at bonding temperatures above $163^{\circ}C$. From the experimental results, when the bonding temperature was increased from $163^{\circ}C$ to $199^{\circ}C$, the curing time could be reduced and more conductive particles were retained at the bonding interface between the Au bump and glass substrate.

• Proceedings of the KIPE Conference
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• 1998.10a
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• pp.410-413
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• 1998

In this paper, we present the method that improve alarm security system using the electronic circuits added the emergency lamp by our proposed Algorithms. In conventional method the emergency lamp of warning & alarm system didn't work perfectly its performance because of battery with short life. For improving this problem we, using Peripheral Interface Controller IC, designed the circuit added the emergency lamp for an warning & alarm system and for prevention against stopping the electric current, and compared our proposed method with conventional method. By designing the circuit to stop up over charge we can extend life of battery, use for a stoppage of electric current in emergency and according to the lightness around. Therefore we are very convenient and profitable in our life. In the future we will study the method to lower the cost of architecture for practical utilization.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.496-502
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• 1999

Electroplating of Ag and Au on the functional area of lead frames are required for good bonding ability in IC packaging. As the patterns of the lead frame become finer, development of new deposition technology has been required for solving problems associated with process control for uniform thickness on selected area. Sputtering was employed to investigate the adhesion between substrate Alloy42 and Ag film as a new candidate process alternative to conventional electroplating. Coating thickness of Ag film was controlled to 3.5$\mu\textrm{m}$ at room temperature as a reference. The deposition of film was optimized to ensure the adhesion by process parameters of substrate heating temperature at $100~300^{\circ}C$, sputter etching time at -300V for 10~30min, bias voltage of -100~-500V, and existence of Cr interlayer film of $500\AA$. The critical $load L_{c}$ /, defined as the minimum load at which initial damage occurs, was the highest up to 29N at bias voltage of -500V by scratch test. AFM surface image and AES depth profile were investigated to analyze the interface. The effect of bias voltage in sputtering was to improve the surface roughness and remove the oxide on Alloy42.

• Nuclear Engineering and Technology
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• v.53 no.7
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• pp.2237-2250
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• 2021

The analog-based Ex-core Neutron Flux Monitoring System (ENFMS) in Korean Nuclear Power Plants (NPPs) has been performing its intended functions successfully for a long time. On the other hand, the primary concern with the extended use of analog systems is the aging effect, such as mechanical failures, environmental degradation, and obsolescence. The transition to a digital-based Man-Machine Interface Systems (MMIS) in Korea and other countries has been accelerating, but some systems are still analog-based IC systems, such as the ENFMS in APR1400 NPPs. Digitalized ENFMS can become a reality using computers and microprocessors owing to the progress in digital electronics and information technology. This paper presents the result of the first phase of the research on the digitalization of the ENFMS signal processing electronics for NPPs operated or produced in Korea. It has two main parts: (1) review engineering bases of ex-core neutron flux monitoring system, including nuclear engineering, instrumentation techniques, and analog and digital signal processing techniques, and (2) analysis of analog signal processing electronics of ENFMS for OPR1000 and APR1400 power plants. They are prerequisite to the second phase of the research which is the detailed implementation of the digitalization.

• KEPCO Journal on Electric Power and Energy
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• v.6 no.4
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• pp.405-411
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• 2020

In this paper, we designed the COS MEMS system for sensing the falling detection and explosive noise of fuse link in COS (Cut Out Switch) installing on the power distribution. This system analyzed the failure characteristics and an instantaneous breakdown of power distribution. Therefore, our system strengths the industrial competence and guaranties the stable power supply. In this paper, we applied BLE (Bluetooth Low Energy) technology which is suitable protocol for low data rate, low power consumption and low-cost sensor applications. We experimented with LSM6DSOX which is system-in-module featuring 3 axis digital accelerometer and gyroscope boosting in high-performance mode and enabling always-on low-power features for an optimal motion for the COS fuse holder. Also, we used the MP34DT05-A for gathering an ultra-compact, low power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The proposed COS MEMS system is developed based on nRF52 SoC (System on Chip), and contained a 3-axis digital accelerometer, a digital microphone, and a SD card. In this paper of experiment steps, we analyzed the performance of COS MEMS system with gathering the accelerometer raw data and the PDM (Pulse Data Modulation) data of MEMS microphone for broadcasting the failure of COS status.

• Journal of Korea Society of Digital Industry and Information Management
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• v.18 no.4
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• pp.47-54
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• 2022

In this paper, MEMS embedded system design implemented the sensor events via analyzing the characteristics that dynamically happened to an abnormal status in power IoT environments in order to guarantee a maintainable operation. We used three kinds of tools in this paper, at first Bluetooth Low Energy (BLE) technology which is a suitable protocol that provides a low data rate, low power consumption, and low-cost sensor applications. Secondly LSM6DSOX, a system-in-module containing a 3-axis digital accelerometer and gyroscope with low-power features for optimal motion. Thirdly BM1422AGMV Digital Magnetometer IC, a 3-axis magnetic sensor with an I2C interface and a magnetic measurable range of ±120 uT, which incorporates magneto-impedance elements to detect the magnetic field when the current flowed in the power devices. The proposed MEMS system was developed based on an nRF5340 System on Chip (SoC), previously compared to the standalone embedded system without bluetooth technology via mobile App. And also, MEMS embedded system with BLE 5.0 technology broadcasted the MEMS system status to Android mobile server. The experiment results enhanced the performance of MEMS system design by combination of sensors, BLE technology and mobile application.

• Corrosion Science and Technology
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• v.22 no.2
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• pp.115-122
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• 2023

This study aimed to elucidate causes of corrosion of heat transport pipes and air vents installed under a manhole of heat transport facilities and suggest effective anticorrosive measures by applying paints or adhesive tapes. It was found that air vent corrosion was attributed to corrosion under insulation caused by the inflow of water and the enrichment of chloride ions. The infiltrated water caused a hydrolysis of polyurethane foam (PUF) insulation by concentrating chloride ions at the interface between a pipe and the PUF. As insulator deteriorated, more chloride ions were eluted as confirmed by ion chromatograph (IC) analysis. As an effective method to prevent air vent corrosion, different types of paints and adhesive tapes with higher corrosion resistance on chloride ions were applied and environmental resistance tests were performed with those samples. Based on environmental test results of samples exposed to 10% HCl solution, it was revealed that a wax tape was the most adequate from a viewpoint of stability at operating condition, environmental resistance, surface treatment, and field applicability.