• Journal of the Korea Institute of Information and Communication Engineering
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• v.10 no.11
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• pp.2032-2038
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• 2006

The recognition of human gestures in image sequences is an important and challenging problem that enables a host of human-computer interaction applications. This paper describes a gesture recognition algorithm based on the particle filters, namely CONDENSATION. The particle filter is more efficient than any other tracking algorithm because the tracking mechanism follows Bayesian estimation rule of conditional probability propagation. We used two models for the evaluation of particle Inter and apply the MATLAB for the preprocessing of the image sequence. But we implement the particle filter using the C++ to get the high speed processing. In the experimental results, it is demonstrated that the proposed algorithm prove to be robust in the cluttered environment.

• Journal of the Korean Magnetics Society
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• v.5 no.5
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• pp.815-818
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• 1995

Ac susceptibility of iron-nitride magnetic fluids with various particle number densities was measured. Therelaxation time increases rapidly as the temperature decreases or the inter-particle interaction increases. The analysis of the data suggests that the activation energy is proportional to ${(k_{B}T/J_{typ})}^{\alpha}$ with $\alpha$~-0.24 in the lower temperature range in which the thermal energy is comparable to the magnetic dipole interaction.

• Korea-Australia Rheology Journal
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• v.17 no.4
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• pp.171-180
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• 2005

We present numerical results for inertialess elliptic particle suspensions in a Newtonian fluid subject to simple shear flow, using the sliding bi-periodic frame concept of Hwang et al. (2004) such that a particulate system with a small number of particles could represent a suspension system containing a large number of particles. We report the motion and configurational change of elliptic particles in simple shear flow and discuss the inter-relationship with the bulk shear stress behaviors through several example problems of a single, two-interacting and ten particle problems in a sliding bi-periodic frame. The main objective is to check the feasibility of the direct simulation method for understanding the relationship between the microstructural evolution and the bulk material behaviors.

• Korean Journal of Environmental Agriculture
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• v.37 no.1
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• pp.1-8
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• 2018

BACKGROUND: Different physical and chemical properties of biochar, which is made out of a variety of biomass materials, can impact water movement through amended soil. The objective of this research was to develop a decision support tool evaluating the impact of the shape and the size distribution of biochar on soil saturated hydraulic conductivity ($K_{sat}$). METHODS AND RESULTS: Plastic beads of different size and morphology were compared with biochar to assess impacts on soil $K_{sat}$. Bead and biochar were added at the rate of 5% (v/w) to coarse sand. The particle size of bead and biochar had an effect on the $K_{sat}$, with larger and smaller particle sizes than the original sand grain (0.5 mm) decreasing the $K_{sat}$ value. The equivalent size bead or biochar to the sand grains had no impact on $K_{sat}$. The amendment shape also influenced soil hydraulic properties, but only when the particle size was between 3-6 mm. Intra-particle porosity had no significant influence on the $K_{sat}$ due to its small pore size and increased tortuosity compared to the inter-particle spaces (macro-porosity). CONCLUSION: The results supported the conclusion that both particle size and shape of the amended biochar impacted the $K_{sat}$ value.

• Polymer(Korea)
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• v.31 no.6
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• pp.543-549
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• 2007

We synthesized various polyurethanes(PU) haying different hard segments with different molecular weights of the soft segment to explore the effect of structure on the dispersion of silver particle in the phase of synthesized polyurethanes matrix. The thermal stability was increased by increasing the number of aromatic compound, while the degree of dispersion for silver particle was decreased. Silver particles showed better dispersion in the PU matrix having aromatic compounds when the soft segments were held constant. On the contrary, when the hard segment was held constant, silver particles on the PU matrix haying low $M_w$ of soft segment showed better dispersion than high $M_w$ of soft segment because poor chain mobility of low $M_w$ of soft segment restricted re-aggregation of silver particle. A sheet resistance of composite materials showed different aspects. In this case, the inter connection between silver particles was more important than its dispersion. In this study, the NDI-PEG 900/silver particle composite film showed the best thermal stability and electro conductivity.

• Transactions of Materials Processing
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• v.15 no.6 s.87
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• pp.421-427
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• 2006

Drawing process of Al-1%Si bonding wire considering fine Si particle is analyzed in this study using FE-simulation. Al-1%Si boding wire requires electric conductivity because Al-1%Si bonding wire is used for interconnection in semiconductor device. About 1% of Si is added to Al wire for dispersion-strengthening. Distribution and shape of fine Si particle have strongly influence on the wire drawing process. In this study, therefore, the finite-element model based on the observation of wire by continuous casting is used to analyze the effect of various parameters, such as the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle on wire drawing processes. The effect of each parameter on the wire drawing process is investigated from the aspect of ductility and defects of wire. From the results of the analysis, it is possible to obtain the important basic data which can be guaranteed in the fracture prevention of Al-1 %Si wire.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.707-713
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• 2001

As the integrated circuit device shrinks to smaller dimensions, chemical mechanical polishing (CMP) process was requirdfo the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gest thinner, micro-scratches are becoming as major defects. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. To prevent agglomerated slurry particle from inflow, we installed 0.5${\mu}{\textrm}{m}$ point of use (POU) filter, which is depth-type filter and has 80% filtering efficiency for the 1.0${\mu}{\textrm}{m}$ size particle. In this paper, we studied the relationship between defect generation and polished wafer counts to understand the exact efficiency fo the slurry filteration, and to find out the appropriate pad usage. Our experimental results showed that it sis impossible to prevent defect-causing particles perfectly through the depth-type filter. Thus, we suggest that it is necessary to optimize the slurry flow rate, and to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of depth type filter.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05b
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• pp.30-33
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• 2001

Chemical mechanical polishing(CMP) process has been widely used to planarize dielectrics, which can apply to employed in integrated circuits for sub-micron technology. Despite the increased use of CMP process, it is difficult to accomplish the global planarization of free-defects in inter-level dielectrics (ILD). Especially, defects like micro-scratch lead to severe circuit failure, and affects yield. CMP slurries can contain particles exceeding $1{\mu}m$ size, which could cause micro-scratch on the wafer surface. The large particles in these slurries may be caused by particle agglomeration in slurry supply line. To reduce these defects, slurry filtration method has been recommended in oxide CMP. In this work, we have studied the effects of filtration and the defect trend as a function of polished wafer count using various filters in inter-metal dielectric(IMD)-CMP. The filter installation in CMP polisher could reduce defect after IMD-CMP. As a result of micro-scratches formation, it shows that slurry filter plays an important role in determining consumable pad lifetime.

• Journal of Korean Society for Atmospheric Environment
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• v.19 no.4
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• pp.397-414
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• 2003

The performance of one-particle stochastic Lagrangian models for passive tracer dispersion are evaluated against measurements in horizontally-homogeneous neutrally-stratified atmospheric surface layer. State-of-the-technology models as well as classical Langevin models, all in class of well mixed models are numerically implemented for inter-model comparison study. Model results (far-downstream asymptotic behavior and vertical profiles of the time averaged concentrations, concentration fluxes, and concentration fluctuations) are compared with the reported measurements. The results are: 1) the far-downstream asymptotic trends of all models except Reynolds model agree well with Garger and Zhukov's measurements. 2) profiles of the average concentrations and vertical concentration fluxes by all models except Reynolds model show good agreement with Raupach and Legg's experimental data. Reynolds model produces horizontal concentration flux profiles most close to measurements, yet all other models fail severely. 3) With temporally correlated emissions, one-particle models seems to simulate fairly the concentration fluctuations induced by plume meandering, when the statistical random noises are removed from the calculated concentration fluctuations. Analytical expression for the statistical random noise of one-particle model is presented. This study finds no indication that recent models of most delicate theoretical background are superior to the simple Langevin model in accuracy and numerical performance at well.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.05a
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• pp.393-396
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• 2005

This paper is concerned with the drawing process of $Al-1\%Si$ bonding wire. In this study, the finite-element model established in previous work was used to analyze the effect of various forming parameters, which included the reduction in area, the semi-die angle, the aspect ratio, the inter-particle spacing and orientation angle of the fine Si particle in drawing processes. The finite-element results gave the consolidation condition. From the results of analysis, the effects of each forming parameter were determined. It is possible to obtain the Important basic data which can be guaranteed in the fracture prevention of $Al-1\%Si$ wire by using FE-Simulation.