• Title/Summary/Keyword: integrated driver

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Design and Characteristics of Modern Power MOSFETs for Integrated Circuits

  • Bang, Yeon-Seop
    • The Magazine of the IEIE
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    • v.37 no.8
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    • pp.50-59
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    • 2010
  • $0.18-{\mu}m$ high voltage technology 13.5V high voltage well-based symmetric EDMOS isolated by MTI was designed and fabricated. Using calibrated process and device model parameters, the characteristics of the symmetric and asymmetric EDMOS have been simulated. The asymmetric EDMOS has higher performance, better $R_{sp}$ / BVDSS figure-of-merit, short-channel immunity and smaller pitch size than the symmetric EDMOS. The asymmetric EDMOST is a good candidate for low-power and smaller source driver chips. The low voltage logic well-based EDMOS process has advantages over high voltage well-based EDMOS in process cost by eliminating the process steps of high-voltage well/drift implant, high-temperature long-time thermal steps, etc. The specific on-resistance of our well-designed logic well-based EDMOSTs is compatible with the smallest one published. TCAD simulation and measurement results show that the improved logic well-based nEDMOS has better electrical characteristics than those of the conventional one. The improved EDMOS proposed in this paper is an excellent candidate to be integrated with low voltage logic devices for high-performance low-power low-cost chips.

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Fabrication and Characterization of 32x32 Silicon Cantilever Array using MEMS Process (MEMS 공정을 이용한 32x32 실리콘 캔틸레버 어레이 제작 및 특성 평가)

  • Kim Young-Sik;Na Kee-Yeol;Shin Yoon-Soo;Park Keun-Hyung;Kim Yeong-Seuk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.10
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    • pp.894-900
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    • 2006
  • This paper reports the fabrication and characterization of $32{\times}32$ thermal cantilever array for nano-scaled memory device applications. The $32{\times}32$ thermal cantilever array with integrated tip heater has been fabricated with micro-electro-mechanical systems(MEMS) technology on silicon on insulator(SOI) wafer using 9 photo masking steps. All of single-level cantilevers(1,024 bits) have a p-n junction diode in order to eliminate any electrical cross-talk between adjacent cantilevers. Nonlinear electrical characteristic of fabricated thermal cantilever shows its own thermal heating mechanism. In addition, n-channel high-voltage MOSFET device is integrated on a wafer for embedding driver circuitry.

A Measuring Model of the Position of Moving Vehicle based on Integrated Vehicle Networks for Spatial Database Applications

  • Moon, Hye-Young;Kim, Jin-Deog
    • Journal of information and communication convergence engineering
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    • v.8 no.1
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    • pp.83-88
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    • 2010
  • Recently car navigation systems which have been widely spread and evolved. The systems use various information and techniques such as real time traffic information and augmented reality technique. In order to provide a shortest path with good flow, real-time traffic information provided by DMB is required. Augmented reality technique is also introduced to give a reality to driver by displaying real images captured by camera during driving. However, these operate well when the system receives GPS data normally. Exact information about the positions of vehicles is a base that supports the above function with realities. This paper proposes a model for acquiring exact position of vehicles. When the GPS does not operate normally, the proposed model uses various data which are generated by integrated vehicle networks.

The Intelligent Power Modules Assembly with Reverse Conduction IGBTs and SOI Driver for Low Power Motor Drives (저전력 모터 구동을 위한 SOI 드라이브 IC 와 RC-IGBT를 탑재한 지능형 반도체 모듈)

  • Cho, JeongSu;Park, SungBum;Lee, JunBae;Chung, DaeWoong
    • Proceedings of the KIPE Conference
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    • 2011.07a
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    • pp.287-289
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    • 2011
  • 본 논문은 인피니언 테크놀로지스의 RC-IGBT (Reverse Conducting Isolated Gate Bipolar Transistor)와 SOI 드라이브 IC(Integrated Circuit)를 사용한 DIL(Dual-In-Line) 구조의 저전력 모듈인 CIPOS TM (Control Integrated POwer System) 제품을 소개한다. 이 전력 모듈은 최적의 게이트 구동회로, 트렌치 필드스톱의 RC-IGBT를 사용하여 기존의 IGBT 와 Diode를 사용하는 구조에서 최소화 된 패키지 크기를 사용하여 높은 효율을 구현할 수 있다. 본 논문을 통하여 인버터의 어플리케이션에 적합하게 설계된 전력모듈에 대한 소개와 그 특징 및 시스템 구성을 위한 고려사항에 대하여 기술하였다.

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2.8 inch QVGA System On Panel LCD Employing Advanced CMOS LTPS Technology

  • Yoon, Ji-Mo;Yoo, Juhn-S.;Yu, J.S.;Kim, E.;Son, C.Y.;Park, J.K.;Yoo, Y.S.;Lim, K.M.;Kim, C.D.;Chung, I.J.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2005.07a
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    • pp.285-288
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    • 2005
  • A 2.8 inch fully integrated SOP employing a high performance LTPS CMOS TFT technology has been developed for mobile display applications. The LCD module is directly interfaced with 3V 6-bit RGB source via timing control circuitry. The integrated data driver comprises a 6-bit hybrid type DAC with low power analog buffer.

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Development of Constant Current Driving Module for High Power LED Lighting Using LLC DC-DC Transformer (LLC DC-DC 트랜스포머를 이용한 고출력 LED 조명용 정 전류 구동모듈 개발)

  • Kim, Hyung-Sik;Kim, Hee-Jun
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.61 no.8
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    • pp.1130-1139
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    • 2012
  • This paper proposes a LED lighting system using integrated power system composed of bridgeless PFC, LLC DC-DC transformer, and dimmable constant current LED driver module. The proposed LED lighting system features high efficiency, high power factor, and dimming capability. In order to verify the validity of the proposed system, the 2kW prototype system was built and tested. From the experimental results, it was confirmed that the maximun efficiency of 92.6% and maximum power factor of 99.7% can be achieved.

Distributed and Real-time Integrated Simulation System on Avionics

  • Zhou, Yaoming;Liu, Yaolong;Li, Shaowei;Jia, Yuhong
    • International Journal of Aeronautical and Space Sciences
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    • v.18 no.3
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    • pp.574-578
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    • 2017
  • In order to achieve iterative design in early R&D period, a Distributed and Real-time Integrated Simulation System for avionics based on a Model-Based Systems Engineering (MBSE) method is proposed. The proposed simulation system includes driver, simulation model, monitor, flight visual model and aircraft external model.The effect of this simulation system in iterative design and system verification is testified by several use cases. The result shows that the simulation system, which can play an important role in iterative design and system verification, can reduce project costs and shorten the entire R&D period.

The Design of an Integrated ECU and Navigation Information based IoT Head-Up Display System for Vehicles (ECU와 내비게이션 정보를 융합한 IoT Head Up Display(HUD) 시스템 설계)

  • Kook, Joongjin
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.3
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    • pp.172-177
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    • 2021
  • The HUD (Head-up Display) device for vehicles has gradually been advanced in connection with ADAS (Advanced Driver Assistant System) for the safety and the convenience of driving. In this paper, the major features (e.g. speed, RPM, etc.) of vehicles is received through the ECU and the route information is received through the navigating API, configurating the integrated GUI. And, the optical system is configured based on DLP (Digital Light Processing) to evaluate the visibility depending on the resolution change of the GUI. The IoT HUD system proposed in this paper has the scalability to flexibly add not only the ECU but also various cloud-based driving-related information.

The Design of the Integrated Module to Cope with Sudden Unintended Acceleration (자동차 급발진을 대비하기 위한 통합 모듈 설계)

  • Cha, Jea-Hui;Jang, Jong-Wook
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2016.10a
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    • pp.221-223
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    • 2016
  • Currently in the automobile market, models with many convenient functions combined with IT have been released. This change has a strength that there could be many convenient and useful functions related to driving while flaws of vehicles caused by malfunctions of these electronic equipments could trigger serious incidents. Among them, the sudden unintended acceleration considered as the most serious is a serious flaw that could threaten driver's life. However, the causes for sudden acceleration incidents have not been clearly investigated with no coping measures. As manufacturers shift the responsibility to drivers' carelessness, drivers' burden is continuously increasing. Thus, this paper designed the system to cope with sudden acceleration incidents by changing conditions of controlling parts like accelerator and brake, and internal image of the driver's seat into data through the integrated module.

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The New Smart Power Modules for up to 1kW Motor Drive Application

  • Kwon, Tae-Sung;Yong, Sung-Il
    • Journal of Power Electronics
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    • v.9 no.3
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    • pp.464-471
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    • 2009
  • This paper introduces a new Motion-$SPM^{TM}$ (Smart Power Modules) module in Single In-line Package (SIP), which is a fully optimized intelligent integrated IGBT inverter module for up to 1kW low power motor drive applications. This module offers a sophisticated, integrated solution and tremendous design flexibility. It also takes advantage of pliability for the arrangement of heat-sink due to two types of lead forms. It comes to be realized by employing non-punch-through (NPT) IGBT with a fast recovery diode and highly integrated building block, which features built-in HVICs and a gate driver that offers more simplicity and compactness leading to reduced costs and high reliability of the entire system. This module also provides technical advantages such as the optimized cost effective thermal performances through IMS (Insulated Metal Substrate), the high latch immunity. This paper provides an overall description of the Motion-$SPM^{TM}$ in SIP as well as actual application issues such as electrical characteristics, thermal performance, circuit configurations and power ratings.