• Proceedings of the IEEK Conference
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• 2009.05a
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• pp.213-215
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• 2009

Using the object recognition processing on the captured images, we can inspect whether a packaging process is performed correctly in real time. So we realized the functions that acquire an image of each state of the packaging process using a camera, extract each object in the image, and inspect the packaging process using the extracted object data. In case an object shape is solid, for object search, a shape-based matching algorithm was used which searches the object utilizing the informations on the shape. In case an object shape is not solid, and Is flexible, gray-level difference of the pixels in the limited image region including the object was used to recognize the object.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.269-272
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• 1997

It is need to inspect a injected E.V.A midsole automatically in shoe manufacture. We applied image processing technology to inspect a injected E.V.A midsole. Captured image by CCD camera was processed with smoothing and edge detection. We compensated error of length from processed image of gauge block and error by bending strain with the measurement method of interval length for midsole image.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.04a
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• pp.245-250
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• 2003

Today, automobile world market is highly competitive. In order to strengthen the competitiveness, quality of automobile is recognized as important and efforts are being made to improve the quality of manufactured components. The directional ability of automobile has influenced on driver directly and hence it must be solved on the preferential basis. In the present research an automated vision system has been developed th inspect the front chassis module. To interpret the inspection data obtained for front chassis module, new interpreting algorithm have been developed. Previously the control of tolerance front chassis module was done manually. With the help of the new algorithm developed, the dimension is calculated automatically to check whether the front chassis module is within the tolerance limit or not.

• Journal of Korean Society for Quality Management
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• v.20 no.2
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• pp.1-10
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• 1992

In this paper, we study a joint lot sizing and inspection policy under an EPQ(Economic Production Quantity) model where a random proportion of units are defectives. Those units can be discovered only through costly inspection. The problem is thus bivariate : both lot size and fraction to inspect are to be chosen. We first analyze a model in which the only penalty for uninspected defectives is financial, and then consider a model where defectives units cannot be used and thus must be replaced by non-defective ones. As a result it can be proved that this inspection policy costs economically and is to be decided effectively for the Economic Production Quantity constraining the fraction to inspect.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.11a
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• pp.103-107
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• 2006

Decapsulation of EMC(Epoxy Molding Compound) in package device is a method used to inspect inside of device by removing plastic molding. So far, chemical etching and mechanical grinding methods have been used widely. Recently, several works using laser have been carried out. This method has advantages with fast process time and precision than conventional methods because of noncontact process. Also, laser process is a clean process because of removing EMC directly without using toxic chemicals. The wavelength of laser used in this study is 355nm. Key parameters of removing EMC are laser power, scan speed, and number of scans of laser. It if confirmed that laser decapsulation is a useful process to inspect inside a device with a small thermal damage to chip surface.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.424-428
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• 2005

This paper shows a non-contact optical method to inspect micron scale parts which will be manufactured in micro-factory system. This inspection system should have some characteristics like a small size, flexibility, and high measuring speed. In the viewpoint of measuring capabilities, it also has resolution under micron scale with measuring range over millimeter scale. Two methods will be presented in this paper, one is Moire and the other is white-light scanning interferometry. Also some experimental results will be presented to show the possibilities of the proposed inspection system.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.11 no.3
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• pp.577-583
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• 2007

The character strings on chips and components are so tiny and numerous that it is a very difficult work for people to perform. In this paper, we propose a mark automatic checking system, which will determine whether chip is wrong-mark or not by recognizing characters on chips. Lots of faulty detection conditions and template matching methods are used to inspect the faulty mark items. The faulty detection classifies conditions as five kinds-darkness, matching, area, broken and branch. A series of experimentation show that the method proposed here can offer an effective way to determine wrong-mark on chips.

• International Journal of Internet, Broadcasting and Communication
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• v.15 no.2
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• pp.168-174
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• 2023

In the current world, with the massive scale of SOC construction, it is difficult to diagnose and check all of a bridge's abnormal states with even the experts' eyes for maintenance. It is because we should spend huge costs and time on maintenance. Still, there are not many alternative ways to inspect bridges remotely regarding accuracy or reality. Therefore, we remark on the advantages and disadvantages of previous methods through practices in SOC maintenance. To inspect the abnormal state of the Bridge, we suggest inspecting bridges with an Augmented Reality (AR) mechanism to reduce cost, human resource consumption, and the risk of work. Through the proposed approach, we expect that it provides ways to solve massive construction problems with software-based technologies.

• Smart Structures and Systems
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• v.26 no.5
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• pp.657-666
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• 2020

A rotational pulse-echo ultrasonic propagation imager that can inspect cylindrical specimens for material nondestructive evaluations is proposed herein. In this system, a laser-generated ultrasonic bulk wave is used for inspection, which enables a clear visualization of subsurface defects with a precise reproduction of the damage shape and size. The ultrasonic waves are generated by a Q-switched laser that impinges on the outer surface of the specimen walls. The generated waves travel through the walls and their echo is detected by a Laser Doppler Vibrometer (LDV) at the same point. To obtain the optimal Signal-to-Noise Ratio (SNR) of the measured signal, the LDV requires the sensed surface to be at a right angle to the laser beam and at a predefined constant standoff distance from the laser head. For flat specimens, these constraints can be easily satisfied by performing a raster scan using a dual-axis linear stage. However, this arrangement cannot be used for cylindrical specimens owing to their curved nature. To inspect the cylindrical specimens, a circular scan technology is newly proposed for pulse-echo laser ultrasound. A rotational stage is coupled with a single-axis linear stage to inspect the desired area of the specimen. This system arrangement ensures that the standoff distance and beam incidence angle are maintained while the cylindrical specimen is being inspected. This enables the inspection of a curved specimen while maintaining the optimal SNR. The measurement result is displayed in parallel with the on-going inspection. The inspection data used in scanning are mapped from rotational coordinates to linear coordinates for visualization and post-processing of results. A graphical user interface software is implemented in C++ using a QT framework and controls all the individual blocks of the system and implements the necessary image processing, scan calculations, data acquisition, signal processing and result visualization.

• Proceedings of the IEEK Conference
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• 2003.11a
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• pp.351-354
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• 2003

To inspect point-defect in LCD pannel, calculate period and eliminated pattern. And then find point-defect to compare block image with each period. First processing, Founded over point defects. To reduce wrong point defect. Next, label point-defects and eliminated not surpass fixed limit-size.