• Proceedings of the Korean Institute of Building Construction Conference
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• 2018.11a
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• pp.48-49
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• 2018

Recently the old buildings have been increasing and increasing reconstruction. As a result, the frequency of use of architectural adhesives has increased. Adhesives are not only used for bonding but also for building materials used in various fields. However, since the adhesive is made of an organic material, it causes various skin diseases and sick house syndrome, and when a fire occurs, harmful substances are generated, and incomplete combustion may cause personal injury. Therefore, in this study, to solve the disadvantages of conventional adhesives, we tried to develop inorganic adhesives using inorganic materials.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2023.11a
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• pp.211-212
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• 2023

Polishing tiles among porcelain tiles are more durable and aesthetic than ceramic tiles, so their demand has recently increased. In particular, since polishing tiles have a very low absorption rate, organic adhesives with chemical bonds are mainly used. However, organic adhesives have low economic efficiency and some volatile organic compounds (TVOCs). Therefore purpose of this study was to evaluate the performance of polishing tile adhesion by developing organic-inorganic adhesives, which have chemical bonds and mechanical bonds. As a result, since the amorphous chain and chemical bonds of the polymer in the tile adhesives, both tensile and shear adhesion strength were satisfied with the KS L 1592, KS L 1593, and the rate of length change itself in the thermal cycling was lower than organic adhesives. So it is thought that it is possible to replace some organic adhesives.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2018.11a
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• pp.79-80
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• 2018

Recently, the interest in remodeling of new and old buildings is increasing worldwide. As a result, the frequency of use of architectural adhesives has increased. Currently, adhesives used in buildings are made of organic materials in most cases, and epoxy resin adhesives are most widely used. However, epoxy resin adhesives contain formaldehyde and VOCs in the room during construction, which can cause sick house syndrome. In case of building fire, it may cause damage due to carbon monoxide generated from organic materials. It is urgent to study the problem of epoxy fill adhesive made of such organic materials. Therefore, the purpose of this study is to investigate the effect of the adhesion of epoxy resin adhesive, which is a problem of epoxy resin adhesive, which is an existing organic adhesive by using inorganic materials such as magnesia and phosphate, And the inorganic adhesive which does not emit the release amount as an inorganic material.

• Journal of the Korea Institute of Building Construction
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• v.19 no.4
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• pp.289-297
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• 2019

Epoxy resin adhesives are currently used as adhesives in buildings. Epoxy resin adhesives, which are organic materials, generate harmful substances when producing adhesives, and toxic substances are high in the residential space after installation. In addition, a large amount of carbon monoxide generated from organic materials in the case of a building fire leads to personal injury. This study evaluates the feasibility of inorganic adhesives using pure inorganic materials such as magnesia, phosphate, and borax as inorganic adhesives to replace existing organic adhesives. As a result of the experiment on the selection of adequate phosphate and the characteristics of the addition rate of borax used as a retarder, the potassium phosphate monobasic was obtained as a suitable phosphate and the characteristics according to the borax addition rate were compared with the quality standard of KS F 4923 The hardening shrinkage and heat change rate satisfied the quality standards. The tensile strength was satisfactory when the borax addition rate was 4% or more, but the adhesive strength did not meet the quality standards. Further studies are needed to improve adhesion strength.

• Bulletin of the Korean Chemical Society
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• v.25 no.6
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• pp.859-864
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• 2004

The solid solutions of the $Sr_{1-x}Ba_xFeO_{3-y)$ system (x = 0.0, 0.1, 0.2 and 0.3) having a perovskite structure were prepared in air at 1423 K and then heat-treated in air (A), $O_2(O)\;and\;N_2(N)$ to examine possibility of controlling the nonstoichiometry and applicability as an additive for electrical conducting inorganic adhesives (ECIA). In the samples heated in $N_2$ stream, there existed almost no $Fe^{4+}$ ions, and at constant temperature their electrical conductivities were considerably lower than those of the samples heat-treated in air or $O_2.\; Sr_{0.8}Ba_{0.2}Fe^{3+}_{0.49}Fe^{4+}_{0.51}O_{2.76}$ (SB2-A) whose $Fe^{3+}/Fe^{4+}$ ratio was nearly 1 (0.96) and whose conductivity values (1.04 $ohm^{-1}cm^{-1}$ at 283 K and 1.88 $ohm^{-1}cm^{-1}$ at 673 K) were higher than any other samples, was found to be the best additive for ECIA.

• Elastomers and Composites
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• v.52 no.2
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• pp.136-142
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• 2017

Using various compositions of thermally conductive inorganic fillers with boron nitride (BN) and aluminum oxide ($Al_2O_3$), solventless UV-curable thermally conductive acrylic pressure sensitive adhesives (PSAs) were prepared. The base of the PSAs consists of 2-ethylhexyl acrylate, 2-hydroxyethyl acrylate, and isobornyl acrylate.The compositions of the thermally conductive inorganic fillers were 10, 15, 20, and 25 phr in case of BN, and 20:0, 15:5, 10:10, 5:15, and 0:20 phr in case of $BN/Al_2O_3$. The adhesion properties like peel strength, shear strength, and probe tack, and the thermal conductivity of the prepared PSAs were investigated with different thermally conductive inorganic filler contents. There were no significant changes in photo-polymerization behavior with increasing BN or $BN/Al_2O_3$ content. Meanwhile, the conversion rate and transmittance of the PSAs decreased and their thermal stabilities increased with increasing BN content. Their adhesion properties were also independent of the BN or $BN/Al_2O_3$ content. The dispersibility of BN in the acrylic PSAs was better than that of $Al_2O_3$ and it ranked the thermal conductivity in the following order: BN > $BN/Al_2O_3$ > $Al_2O_3$.

• 한국문화재보존과학회:학술대회논문집
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• 2005.03a
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• pp.1-11
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• 2005

No one can tell when, exactly, the conservation of potteries & ceramics began, however, according to the documents, it has a long history. Among the materials discovered up to the present, organic adhesives extracted from animals and plants such as bitumen were mainly used and resin, in 19th century, as well. As for inorganic adhesives, clay, lime and plaster were used as well as rivet, as one of mechanical methods. According to the conservation case studies in Korea, lacquer and gilding powdered gold were applied as treatment methods in some ceramics, but, in general, plaster and resins were used widely.

• Journal of Adhesion and Interface
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• v.14 no.1
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• pp.36-42
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• 2013

To improve hydrolytic stability of polyurethane (PU) adhesives, a silane coupling agent (SCA) was added. 3-Isocyanatopropyl triethoxy silane (ITS) as a SCA has two functional groups in the main chain and it is used to improve an interfacial interaction between polymer and inorganic material or metal. In this study, PU adhesives with different amounts of ITS from 0 to 1 wt% were synthesized. Pot time, modulus, thermal stablilty, and adhesive force of the obtained samples were measured. The results showed that the adhesives with ITS showed better properties than that of pure one.

• Journal of Conservation Science
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• v.26 no.1
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• pp.85-94
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• 2010

Color stable hydrogenated bisphenol-A (HBA) epoxy adhesives containing organic-inorganic hybrid nanocomposites were prepared and investigated the properties. Isophorone-diamine (IPDA) was used as a hardener and polyhedral organomeric silsesquioxanes (POSS; EP0408 and EP0409) having epoxy function groups were used to tailor adhesives in the nanoscale range. The dependence of the concentration of different nano materials were studied since the large surface area of the nanosized particles can cause significant changes in properties of adhesives. HBA-IPDA adhesives containing different amount of nanomaterials have been applied to the fresh Namsan granite and compared with those of commercial adhesives, which have problems of color change as well as a high viscosity. The mechanical properties of HBA-IPDA containing POSSs are consistent with those of commercial adhesives in addition to the low viscosity.

• Journal of the Korean Wood Science and Technology
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• v.31 no.3
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• pp.1-10
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• 2003

Shredded waste newspapers, waste acrylic raw fibers, and urea-formaldehyde (UF) adhesives, at 10% by weight on raw material, were used to produce recycled waste paper-waste acrylic raw fiber composite boards in laboratory scale experiments. The physical and mechanical properties of fire retardant treated recycled waste paper-waste acrylic raw fiber composite boards were examined to investigate the possibility of using the composites as internal finishing materials with specific gravities of 0.8 and 1.0, containing 5, 10, 20, and 30(wt.%) of waste acrylic raw fiber and 10, 15, 20, and 25(wt.%) of fire retardant (inorganic chemical, FR-7^®) using the fabricating method used by commercial fiberboard manufacturers. The bending modulus of rupture increased as board density increased, decreased as waste acrylic raw fiber content increased, and also decreased as the fire retardant content increased. Mechanical properties were a little inferior to medium density fiberboard (MDF) or hardboard (HB), but significantly superior to gypsum board (GB) and insulation board (IB). The incombustibility of the fire retardant treated composite board increased on increasing the fire retardant content. The study shows that there is a possibility that composites made of recycled waste paper and waste acrylic raw fiber can be use as fire retardant internal finishing materials.