• 한국응용과학기술학회지
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• 제28권2호
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• pp.240-246
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• 2011

UV-Curable hybrid coatings were synthesized to improve the surface properties of plastic film. Organic-inorganic coating solutions were prepared by the sol-gel method using urethane-acrylate oligomer, acrylate monomer, photo initiator and tetraethoxysilane (TEOS). Methacryloyloxypropyltrimethoxysilane(MPTMS) was used as a silane coupling agent to improve chemical interaction between inorganic phases and UV curable acrylate. In this study, the surface hardness and adhesive properties were improved with the use of inorganic component. The experimental results showed that UV-Curable hybrid films containing aliphatic urethane oligomer, hexanedioldiacrylate, trimethylolpropanetriacrylate, hydroxy dimethyl acetophenone exhibited good surface properties. Also, the optimum curing conditions were investigated.

• 접착 및 계면
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• 제6권3호
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• pp.26-36
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• 2005

• International Journal of Precision Engineering and Manufacturing
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• 제8권2호
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• pp.75-79
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• 2007

This paper describes the self-alignment and bonding of microparts using adhesive surface tension to assemble microsystems in air. The alignment and bonding were tested experimentally using adhesive droplets, and the resulting performance was evaluated. The adhesive, which was inorganic and water-soluble before hardening, was diluted with water to a ratio of 10:1 so that its surface tension generated a sufficient restoring force for self-alignment. The experimental results showed that the average of the alignment errors obtained using the adhesive on $1.0\times1.0\times0.15-mm$ microparts was less than $2{\mu}m$ in the X and Y directions and 0.2 degrees in the e direction. These alignment errors were almost the same as those obtained using water. The use of a suitable adhesive had no negative effects on the alignment accuracy. The average tensile strength of the adhesive bond after self-alignment was $0.61N/mm^2$.

• 한국염색가공학회지
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• 제28권1호
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• pp.48-56
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• 2016

Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.

• 한국수소및신에너지학회논문집
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• 제6권2호
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• pp.85-90
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• 1995

Activation behavior, hydriding rate and disintegration were tested for hydrogen storage alloy particles fixed in an adhesive after treating with inorganic solution. Commertial adhesive as a binder was used. Chemical-treated particles showed the best characteristics for activation and a little effect of prevention the break down of the powders themselves after several repeated operations. Furthermore activation characteristics were found to show a similar trend to chemical-treated powders even in the fixed one with an adhesive, except for a slight decrease in reaction velocity.

• 폴리머
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• 제37권2호
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• pp.184-195
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• 2013

아크릴 점착테이프는 자동차, 전기전자 및 디스플레이 모듈 접합에 사용된다. 본 연구는 이러한 모듈 접합에 사용되는 고강도 준구조형 점착테이프 제조를 위해 2-ethylhexylacrylate(2-EHA)와 acrylic acid(AAC)를 사용하여 UV 조사에 의한 광중합 및 점착테이프 제조를 위해 광경화를 진행하였고, AAC의 함량 및 무기물 충전제 $SiO_2$ 함량에 따라 아크릴 점착테이프의 물성에 미치는 영향을 고찰하였다. 공단량체로 사용된 AAC의 함량이 많을수록 아크릴고분자 사슬의 강직성이 증가하여 초기 점착력이 낮았고, 시간경과에 따라 점착력이 증가하였으며 테이프의 젖음성, 접촉각 및 SEM 이미지를 통해 확인할 수 있었다. 충전제를 첨가하지 않은 점착테이프의 박리강도와 전단접착강도는 반비례 관계였으나 충전제를 첨가하면 함량 증가에 따라 박리강도 증가와 함께 전단접착강도가 증가하는 비례관계를 보였다. 이러한 상관관계로부터 고강도 준구조형 접착물성을 필요로 하는 용도에 최적화된 아크릴 점착테이프를 제시할 수 있었다.

• Restorative Dentistry and Endodontics
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• 제47권3호
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• pp.32.1-32.11
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• 2022

Objectives: This study aimed to evaluate the influence of inorganic composition and filler particle morphology on the mechanical properties of different self-adhesive resin cements (SARCs). Materials and Methods: Three SARCs including RelyX Unicem-2 (RUN), Maxcem Elite (MAX), and Calibra Universal (CAL) were tested. Rectangular bar-shaped specimens were prepared for flexural strength (FS) and flexural modulus (FM) and determined by a 3-point bending test. The Knoop microhardness (KHN) and top/bottom microhardness ratio (%KHN) were conducted on the top and bottom faces of disc-shaped samples. Sorption (Wsp) and solubility (Wsl) were evaluated after 24 hours of water immersion. Filler morphology was analyzed by scanning electron microscopy and X-ray energy dispersive spectroscopy (EDS). FS, FM, %KHN, Wsp, Wsl, and EDS results were submitted to 1-way analysis of variance and Tukey's post-hoc test, and KHN also to paired t-test (α = 0.05). Results: SARC-CAL presented the highest FS value, and SARC-RUN presented the highest FM. SARC-MAX and RUN showed the lowest Wsp and Wsl values. KHN values decreased from top to bottom and the SARCs did not differ statistically. Also, all resin cements presented carbon, aluminum, and silica in their composition. SARC-MAX and RUN showed irregular and splintered particles while CAL presented small and regular size particles. Conclusions: A higher mechanical strength can be achieved by a reduced spread in grit size and the filler morphology can influence the KHN, as well as photoinitiators in the composition. Wsp and Wsl can be correlated with ions diffusion of inorganic particles.

• 한국콘크리트학회:학술대회논문집
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• 한국콘크리트학회 2002년도 봄 학술발표회 논문집
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• pp.373-378
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• 2002

The waterproofing system's performance is known to show a determining by complex interaction of material factors, design details, and the qualify of construction, and the waterproofing integrity of waterproofing membranes is determined by the bond to the deck and the amount of damage to the waterproofing membrane. In this research, the basic properties of waterproofing membranes on market and the tensile adhesive characteristics of waterproofing systems of concrete bridge deck have also been investigated in the view of the damages frequently reported from job site. As a results of tensile adhesive strength of waterproofing system, tensile strength is decrease with surface moisture contents except for inorganic-elastomeric liquid waterproofing membrane, and increase with strength of deck slab. Also tensile adhesive strength is generally increase in case of moisture curing of specimen because of pore structure and surface leveling. The after asphalt concrete paving tends to increase more than before those. The results of the liquid waterproofing membranes are upside-down, and the more concrete has strength, the more strength of tensile adhesive increase. The ambient temperature and the rolling temperature of asphalt concrete when application of the waterproofing membrane has considerable influence on the performance of waterproofing system.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2001년도 학술논문발표회
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• pp.8-13
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• 2001

In recently, polishing tile(porcelain homogeneous polished tile) was used in the construction field as a finishing material. But, there happened some problems such as tile exfoliation by construction condition in early ages. Also, in the dry wall system which used to lightweight wall, for use of polishing tile on dry wall, the examination of adhesive stability of polishing tile is needed. In this Paper, adhesive strength of Polishing tile was investigated by tile bond types on gypsum board and non asbestos board coated by tar-urethane and polymer modified cementitious waterproofing membrane(Series I). Then, the effect of heat stress and vibration was estimated on gypsum and non asbestos board(Series II).

• The Korean Journal of Ceramics
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• 제4권3호
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• pp.222-226
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• 1998

$Cu_3N$ film deposited on silicon oxide substrate by r.f. reactive sputtering technique. Synthesis and properties of copper nitride film were investigated for its possible application to Cu metallization as adhesive interlayer between copper and $SiO_2. Cu_3N$ film was synthesized at the substrate temperature ranging from $100^{\circ}C$ to $200^{\circ}C$ and at nitrogen gas ratio above $X_{N2}=0.4. Cu_3N, CuN_x$, and FGM-structured $Cu/CuN_x$ films prepared in this work passed Scotch-tape test and showed improved adhesion property to silicon oxide substrate compared with Cu film. Electrical resistivity of copper nitride film had a dependency on its lattice constant and was ranged from 10-7 to 10-1 $\Omega$cm. Copper nitride film was, however, unstable when it was annealed at the temperature above $400^{\circ}C$.