• Journal of IKEEE
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• v.25 no.2
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• pp.261-266
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• 2021

This paper suggests design methodology for thermal infrared data correction algorithms considering environmental temperature variations. First, a thermal infrared measurement model is suggested by a parameter-dependent first-order input-output equation using the relationship between infrared measurement data and model environmental parameters. In order to compensate the influence of environmental temperatures on infrared data, a compensation function is identified. Through experiments, the proposed algorithm is shown to reduce the influence of environmental temperatures on the infrared data effectively.

• Proceedings of the IEEK Conference
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• 2004.08c
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• pp.872-875
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• 2004

In this paper, thermal response analysis of a temperature controlled three-axis accelerometer for high temperature environments with integrated micro-heaters and temperature sensors is investigated with finite element method (FEM) program, ANSYS and infrared thermal measurement systems. And availability to application fields from a viewpoint about short thermal response time is discussed. In this paper, the time of three-axis accelerometer for high temperatures becoming $300^{\circ}C$ by integrated micro-heaters and temperature sensors to reduce thermal drift characteristics was analyzed as a thermal response time of this device. The simulated thermal response time (time until SOI piezoresistors actually becomes $300^{\circ}C$) of three-axis accelerometer for high temperatures with ANSYS is about 0.6s, and measured result with infrared temperature measurement systems is about 0.64s. Experimental results using infrared thermal measurement systems agreed well with these theoretical results.

• Journal of the Korean Society of Industry Convergence
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• v.27 no.1
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• pp.57-62
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• 2024

This study conducted a measurement method of high temeprature conditions using infrared termography. All objects emit infrared light, and this emissivity has a significant impact on the temperature measurements of infrared thermal imaging (IR) cameras. In order to measure the temperature more accurately with the IR camera, correction equations were derived by measuring the emissivity according to the temperature change of combustible metals in a high-temperature environment. Two combustible metals, Mg and Al, were used to measure emissivity with changing temperature. Each metal was heated, the emissivity was measured by comparing the temperature with IR camera and thermocouples so that the correlation between temperature and emissivity could be anslyzed. As a result of the experiment, the emissivity of the metals increases as the temperature increased. This can be interpreted as a result of increased radiation emission as the thermal movement of internal metal molecules increased.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Journal of the Korean Society for Nondestructive Testing
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• v.36 no.2
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• pp.130-137
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• 2016

Non-destructive testing methods for composite materials (e.g., carbon fiber-reinforced and glass fiber-reinforced plastic) have been widely used to detect damage in the overall industry. This study detects defects using optical infrared thermography. The transient heat transport in a solid body is characterized by two dynamic quantities, namely, thermal diffusivity and thermal effusivity. The first quantity describes the speed with thermal energy diffuses through a material, whereas the second one represents a type of thermal inertia. The defect detection rate is increased by utilizing a lock-in method and performing a comparison of the defect detection rates. The comparison is conducted by dividing the irradiation method into reflection and transmission methods and the irradiation time into 50 mHz and 100 mHz. The experimental results show that detecting defects at 50 mHz is easy using the transmission method. This result implies that low-frequency thermal waves penetrate a material deeper than the high-frequency waves.

• Proceedings of the Korean Nuclear Society Conference
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• 1999.05a
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• pp.107-107
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• 1999

Direct-contact condensation experiments of atmospheric steam and steam/air mixture on subcooled water flowing co-currently in a rectangular channel are carried out uszng an infrared thermal camera system to develop a temperature measurement method. The inframetrics Model 760 Infrared Thermal Imaging Radiometer is used for the measurement of the temperature field of the water film for various flow conditions. The local heat transfer coefficient is calculated using the bulk temperature gradient along the (low direction. It is also found that the temperature profiles can be used to understand the interfacial condensation heat transfer characteristics according to the flow conditions such as noncondensable gas effects, inclination effect, and flow rates.

• Journal of Korean Tunnelling and Underground Space Association
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• v.14 no.3
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• pp.197-213
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• 2012

Disc cutter is a key cutting tool for rock excavation by TBMs. This study aimed to characterize the deformation of a cutter ring by strain measurement as well as infrared thermal camera measurement during a series of linear cutting tests for a hard rock. The strain measurement results indicated that the cutter ring clearly showed a linear elastic behavior. The data obtained from the infrared thermal camera measurement demonstrated that the maximum temperature increase in the cutter ring was below $14.4^{\circ}C$. The deformation and temperature increase of the cutter ring during rock cutting were insignificant in a given cutting test condition of this study.

• Current Optics and Photonics
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• v.1 no.5
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• pp.500-504
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• 2017

In this paper, we developed a temperature measurement system based on an infrared temperature imaging module for thermal safety verification of a plasma skin treatment device (PSTD). We tested a pilot product of the low-temperature PSTD using the system, and the temperature increase of each plasma torch was well-monitored in real-time. Additionally, through the approximation of the temperature increase of the plasma torches, a certain limitation of the plasma treatment time on skin was established with the International Electrotechnical Commission (IEC) guideline. We determined an appropriate plasma treatment time ($T_{Safe}$ < 24 minutes) using the configured temperature measurement system. We believe that the temperature measurement system has a potential to be employed for testing thermal safety and suitability of various medical devices and industrial instruments.

• Journal of Electrical Engineering and Technology
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• v.12 no.2
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• pp.904-910
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• 2017

This paper presents temperature measurement of solar photovoltaic modules using the custom-made system composed of an infrared temperature sensor and a microcontroller. The obtained measurement results are processed, displayed and stored on a PC using the custom-made virtual instrument. The proposed system overcomes some of the problems related to the contact sensor application, and at the same time offers accurate readings and better flexibility. The proposed system is especially suitable for applications where the cost is a limiting factor in the choice of measuring system. The conducted analysis and the obtained results have shown an excellent accuracy of the proposed system in comparison to a high quality thermal imaging camera used as the reference instrument.

• Journal of the Korean Society for Nondestructive Testing
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• v.34 no.4
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• pp.299-304
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• 2014

In this paper, a method is tested to measure temperatures in high-temperature welds. Protective glass was installed between an infrared thermal imaging camera and a heat source, and temperature compensation was applied to the measuring instruments. When the temperature of halogen lamps was taken in real-time and measured by the thermal camera, the temperature was found to be almost invariant with the distance between the camera and heat source. The temperature range could be predicted, through correlations with the thickness of the protective glass and the measured distance. This study suggests that the temperature measurement of welds obtained by using an infrared thermal imaging camera is valid, through experimental testing of heat sources.