• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.12
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• pp.1069-1077
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• 2011

In this paper, a design and fabrication of a miniaturized 2.5 GHz 8 W power amplifier using selectively anodized aluminum oxide(SAAO) substrate are presented. The process of SAAO substrate is recently proposed and patented by Wavenics Inc. which uses aluminum as wafer. The selected active device is a commercially available GaN HEMT chip of TriQuint company, which is recently released. The optimum impedances for power amplifier design were extracted using the custom tuning jig composed of tunable passive components. The class-F power amplifier are designed based on EM co-simulation of impedance matching circuit. The matching circuit is realized in SAAO substrate. For integration and matching in the small package module, spiral inductors and single layer capacitors are used. The fabricated power amplifier with $4.4{\times}4.4\;mm^2$ shows the efficiency above 40 % and harmonic suppression above 30 dBc for the second(2nd) and the third(3rd) harmonic at the output power of 8 W.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.41-47
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• 2007

Today lots of investigations on Embedded Passive Technology using materials and chip components have been carried out. We fabricated diplexers with 1005 sized-passives, which were made by burying chips in PCB substrate and surface mounting chip on PCB. 6 passive chips (inductors and capacitors) were used for the frequency divisions of $880\;MHz{\sim}960\;MHz(GSM)$ and $1.71\;GHz{\sim}1.88\;GHz(DCS)$. Two types of diplxer were characterized with Network analyzer. The chip buried diplexer showed extra 5db loss and a little deviation of 0.6GHz at aimed frequency areas, whereas the chip mounted diplexer showed man. 0.86dB loss within GSM field and max. 0.68dB within DCS field respectively. But few degradations were observed after $260^{\circ}C$ for 80min baking and $280^{\circ}C$ for 10sec solder floating.

• The Journal of the Acoustical Society of Korea
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• v.20 no.5
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• pp.69-75
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• 2001

In this paper, a fast and easy impedance matching method, which could give the impedance matching component for the general 1 or 2-port network was introduced. First, the entire network structure was defined which consists of the network part to be matched and the impedance matching part composed of inductors and capacitors. Next, the transmission matrix and input and output impedances of the entire network from the terminal impedance conditions were calculated, then the exact solutions for the matching components were obtained. To verify the efficiency of this method, this method was applied to the CDMA If band withdrawal weighted SAW transversal filter, and investigated the effects of the impedance matching before and after, through the simulation and experiment. As the result, the performance of a fractional bandwidth of 1.2%, insertion loss of 29 dB, and VSWR of 80 have improved to a factional bandwidth of 1.8％, insertion loss of 9 dB, VSWR of 3 at 85.38 MHz center frequency. The result shows that this impedance matching method could be used in the SAW devices and other types of 1 or 2-port network.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.31-38
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• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.47 no.10
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• pp.80-85
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• 2010

In this paper, a MIMO antenna is proposed for LTE/DCSl800/USPCSl900 handset applications. The proposed antenna is based on the IFA and its wide bandwidth is obtained by using a stagger tuning technique. To improve the isolation, a suspended line is connected to the shorting points in two antennas, and capacitors and inductors are added to the connected suspended line. Two identical antennas of which dimension is 2.8cc($40{\times}10{\times}7mm$) are mounted on the two end lines of the system ground plane($40{\times}60mm$). Analysis of the antenna performance and optimization is performed using CST Microwave Studio. The bandwidths are satisfied for LTE band class 13(746-787MHz), class 14(758-798MHz) and DCSl800/USPCSl900 band (1710-1990MHz). The isolations between two antennas are about -12dB for LTE band and -10dB for DCSl800/USPCSl900 band. And the radiation efficiency of each antenna is about for LTE band 33% and 45% for DCSl800/USPCSl900 band respectively.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.1
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• pp.79-84
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• 2007

In this paper, a fully-integrated low phase noise multi-band CMOS VCO using automatic level controller (ALC) and switched LC tank has been presented. The proposed VCO has been fabricated in a 0.13-um CMOS process. The switched LC tank has been designed with a pair of capacitors and two pairs of inductors switched using MOS switch. By using this structure, four band (2.986 ${\sim}$ 3.161, 3.488 ${\sim}$ 3.763, 4.736 ${\sim}$ 5.093, and 5.35 ${\sim}$ 5.887 GHz) operation is achieved in a single VCO. The VCO with 1.2 V power supply has phase noise of -118.105 dBc/Hz @ 1 MHz at 2.986 GHz and -113.777 dBc/Hz @ 1 MHz at 5.887 GHz, respectively. The reduced phase noise has been approximately -1 ${\sim}$ -3 dBc/Hz @ 1 MHz in the broadest tuning range, 2.986 ${\sim}$ 5.887 GHz. The VCO has consumed 4.2 ${\sim}$ 5.4 mW in the entire frequency band.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.7
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• pp.683-693
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• 2011

In this paper, a design of high current and broad-band microwave bias-tee was presented for a stable bias of a high power amplifier. An input impedance of bias-tee should be shown to 50 ohm with the wideband in order to be stably-biased the amplifier. For this design of the bias-tee, a capacitor of bias-tee for a DC block was designed with a high wide-band admittance by a parallel sum of capacitors, and a inductor for a RF choke and a DC feeding was designed with a high wide-band impedance by a series sum of inductors. As this inductor and capacitor for the sum has each SRF, band-limitation of lumped element was driven from SRF. This limitation was overcome by control of a resonance's quality factor with adding a resistor. 1608 SMD chips for design's element was mounted on the this pattern for the designed bias-tee. The fabricated bias-tee presented 10 dB of return loss and wide-band about 50 ohm input impedance at 10 MHz~10 GHz.