• Proceedings of the KIEE Conference
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• 2002.11d
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• pp.36-38
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• 2002

Low voltage circuit breakers which interrupt rapidly and raise the reliability of power supply are widly used in power distribution systems. In the paper, it was investigated how much Interrupting capability was improved by correcting the shape of the contact system in molded case circuit breaker(below MCCB), Prior to the interrupting testing, it was necessary for the optimum design to analyze magnetic forces on the contact system, generated by current and flux density. This paper presents both our compuational analysis and test results contact system in MCCB.

• Journal of the Korea Society of Computer and Information
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• v.23 no.8
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• pp.1-7
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• 2018

Previous test equipment was bulky, took a long time to check, and was somewhat less economical. Since most of the checks were about analog signals, we preferred to check them using reference equipments. In this paper, a digital circuit design based on AITS is used to implement signals that can not utilize commercial measurement resources, and also designed and manufactured equipment that can inspect SRU. These test equipments were tested and evaluated by development, operation, and field evaluation, and they were installed to the Korean Field Force. This contributed to the improvement of operability by shortening the inspection time from 83.2 minutes to 7.8 minutes on average In addition, it did not utilize the reference equipment, so it could play a big role in lowering the mass production cost.

• Proceedings of the IEEK Conference
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• 2000.07a
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• pp.359-362
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• 2000

In this paper, we propose a test pattern generation algorithm on the basis of the identification of undetectable faults for Speed-Independent(SI) asynchronous control circuits. The proposed methodology generates tests from the specification of a target circuit, which describes the behavior of the circuit in the form of Signal Transition Graph (STG). The proposed identification method uses only topological information of a target circuit and reachability information of a fault-free circuit, which is generated in the form of Binary Decision Diagram(BDD) during pre-processing. Experimental results show that high fault coverage over single input stuck-at fault model is obtained for several synthesized SI circuits and the use of the identification process as a preprocessing decreases execution time of the proposed test generation with negligible costs.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.11
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• pp.97-106
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• 1992

In integrated circuits, protection circuits are required to protect the internal nodes from the harmful ESD(Electrostatic discharge). This paper discusses the characteristics of the circuit components in ESD protection circuitry in order to analyze the ESD phenomina, and the design methodalogy of ESD protection circuits, using test pattern with a variation of the number of diode and transistor. The test devices are fabricated using a 0.8$\mu$m CMOS process. SPICE simulation was also carried out to relate output node voltage and measured ESD voltage. With increasing number of diodes and transistors in protection circuit, the ESD voltage also increases. The ESD voltage of the bi-directional circuit for both input and output was 100-300[V], which in higher than that of only output(uni-directional) circuit. In addition, the ESD protection circuit with the diode under the pad region was useful for the reduction of chip size and parasitic resistance. In this case, ESD voltage was improved to a value about 400[V].

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.12A
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• pp.2008-2014
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• 1999

IDDQ testing is an effective testing method to detect various physical defects occurred in CMOS circuits. In this paper, we consider intra-gate shorts within circuit under test and implement IDDQ test pattern generator to find test patterns which detect considered defects. In order to generate test patterns, gate test vectors which detect all intra-gate shorts have to be found by type of gates. Random test sets of 10,000 patterns are applied to circuit under test. If an applied pattern generates a required test vector of any gate, the pattern is saved as an available test pattern. When applied patterns generate all test vectors of all gats or 10,000 patterns are applied to circuit under test, procedure of test pattern generation is terminated. Experimental results for ISCAS'85 bench mark circuits show that its efficiency is more enhanced than that obtained by previously proposed methods.

• Journal of Applied Reliability
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• v.16 no.4
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• pp.331-337
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• 2016

Purpose: The purpose of this study is the analysis of the failure mechanisms effect of circuit design characteristics of the ballast for LED Lamp Methods: Recently, electronic circuit of ballasts for LED lamp are being occurred on various failure mechanisms (whiskers, ion migration, heat dissipation problem, switching element damage) because electronic ballast circuit design characteristics are becoming more and more diverse. Results: we analysis failure mechanisms that occurs in accordance with the circuit design characteristics The ballast for LED lamp were divided into three different types (Type A, Type B, Type C) considering circuit design characteristics (thermal design, PCB patten spacing, element material) and it was experimented in the acceleration test conditions ($85^{\circ}C$, 85% R.H). Conclusion: We confirmed that failure mechanism of the ballast for LED Lamp had occurred differently in accordance with the circuit design characteristics.

• The Transactions of the Korean Institute of Power Electronics
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• v.17 no.3
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• pp.191-197
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• 2012

This paper proposes a new synthetic test circuit (STC) to confirm the switching operation of thyristor valve in HVDC converter. The proposed STC uses a 6-pulse thyristor converter with 2-phase chopper as a high-current source to provide turn-on current to the test valve. The operation of proposed STC was verified through theoretical analysis and computer simulations. Based on computer simulations, a hardware scaled model was built and tested to confirm the feasibility of implementing a real-size test facility. The proposed system has an advantage of simple structure and operation over the existing system.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.8
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• pp.1705-1712
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• 2004

This paper presents a new low-cost RF Built-In Self-Test (BIST) circuit for measuring transducer voltage gain, noise figure and input impedance of 5.25GHz low noise amplifier (LNA). The BIST circuit is designed using 0.18${\mu}{\textrm}{m}$ SiGe technology. The test technique utilizes input impedance matching and output transient voltage measurements. The technique is simple and inexpensive. Total chip size has additional area of about 18% for BIST circuit.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.11
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• pp.140-148
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• 1993

High Integration ratio of CMOS circuits incredily increases the test cost during the design and fabrication processes because of the FET fault(Stuck-on faults and Stuck-off faults) which are due to the operational characteristics of CMOS circuits. This paper proposes a test generation algorithm for an arbitrarily large CMOS circuit, which can unify the test steps during the design and fabrication procedure and be applied to both static and dynaic circuits. This algorithm uses the logic equations set for the subroutines resulted from arbitrarily dividing the full circuit hierarchically or horizontally. Also it involves a driving procedure from output stage to input stage, in which to drive a test set corresponding to a subcircuit, only the subcircuits connected to that to be driven are used as the driving resource. With this algorithm the test cost for the large circuit such as VLSI can be reduced very much.

• The Transactions of the Korea Information Processing Society
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• v.5 no.3
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• pp.862-872
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• 1998

In this paper, we developed a delay test architecture and test procedure for clocked sequential circuit. In addition, we analyze the problems of conventional and previous method on delay test for clocked sequential circuit in IEEE 1149.1. This paper discusses several problems of Delay test on IEEE 1149.1 for clocked sequential circuit. Previous method has some problems of improper capture timing, of same pattern insertion, of increase of test time. We suggest a method called ARCH-S, is based on a clock counting technique to generate continuous clocks for clocked input of CUT. A 4-bit counter is selected for the circuit under test. The simulation results ascertain the aecurate operation and effectiveness of the proposed architecture.