• Title/Summary/Keyword: in-circuit test

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The Effect of Task Oriented Circuit Exercise in Upper Extremity Function and Self-Efficacy in Stroke Patients (뇌졸중 환자의 순환식 과제지향 운동이 상지기능 및 자기효능감에 미치는 영향)

  • Lee, Gue-Dong;Choi, Won Ho
    • 재활복지
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    • v.22 no.2
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    • pp.161-174
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    • 2018
  • The purpose of this study was to investigate the effect of a task oriented circuit exercise in upper extremity function and self-efficacy in stroke patients. An experimental group of 14 patients was assigned to conduct a task oriented circuit exercise and the general task oriented exercise a control group of 14 patients was randomly assigned to exercise for 30 minutes 5 times every week during 4 weeks. Fugl-Meyer Assessment and Self-Efficacy Scale were evaluated to compare the upper extremity function and self-efficacy before and after the exercise. The result of this study were as follows : First, after the Task oriented circuit exercise, the upper extremity function and Self-Efficacy showed statistical significant difference between pre and post test. Second, after the general task oriented exercise, the upper extremity function showed statistical significant difference between pre and post test. But not much in Self-Efficacy. The comparison result between experimental group and control group in presented statistically significant differences where the upper extremity function. But, presented not statistically significant differences where Self-Efficacy Scale.

Development of 460[V]/225[A]/50[kA] Contact System in Current Limiting MCCB using an estimation and analysis method for the interrupting capability (차단성능 평가해석기법을 적용한 강자계 구동방식의 460[V]/225[A]/50[kA]급 한류형 MCCB 소호부 개발)

  • 최영길;박찬교
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.18 no.1
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    • pp.78-84
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    • 2004
  • Low voltage circuit breakers which interrupt rapidly and raise the reliability of power supply are widely used in power distribution systems. In the paper, it has been investigated how much interrupting capability is improved by correcting the shape of the contact system in molded case circuit breaker(below MCCB), especially contacts and arc runner. Prior to the interrupting testing, it is necessary for the optimum design tc analyze electromagnetic forces on the contact system generated by current and flux density. This paper presents both our computational analysis and test results on contact system in MCCB

A Study on the Program Analyzing the Arc Phenomena in Gas Circuit Breaker (가스차단기의 아크현상 해석프로그램에 대한 연구)

  • Choi, Young-Kil;Choi, Sang-Tae;Lee, Kwang-Sik
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.25 no.12
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    • pp.74-81
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    • 2011
  • A computational approach was developed to understand about the arc quenching process in a gas circuit breaker(GCB). This approach is a program to analyze the gas flow in the breaker. The arc is processed at the same time. The program was used the so-called FLIC method for gas analysis techniques. It was referenced that the arc is interpreted the 'a Simplified Enthalpy Flow Arc Model'. In order to validate about the results of the program, a Auto Puffer GCB was chosen as the test subject. Because, the breaker is the one that arc current is interrupted by using the arc heating. And also, the current interrupting capability can be obtained only owing to the positive utilization(auto puffer) of the clogging phenomenon, without other puffer actions. In this paper, it has been realized that the entire arc quenching process is computerized, which is based on the self-flow current interruption by the auto puffer action. This program, which was verified through experiments, produced good results.

Experimental Study on the Thermal Performance of a Printed Circuit Heat Exchanger in a Cryogenic Environment (극저온 환경의 인쇄기판형 열교환기 열적성능에 대한 실험적 연구)

  • Kim, Dong Ho;Na, Sang Jun;Kim, Young;Choi, Jun Seok;Yoon, Seok Ho
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.27 no.8
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    • pp.426-431
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    • 2015
  • The advantages of a printed circuit heat exchanger (PCHE) are the compactness and efficiency derived from its heat-transfer characteristics; furthermore, a PCHE for which a diffusion bonding method was used during production can be applied to extreme environments such as a cryogenic condition. In this study, a micro-channel PCHE fabricated by diffusion bonding was investigated in a cryogenic environment regarding its thermal performance and the pressure drop. The test rig consists of an LN2 storage tank, vaporizers, heaters, and a cold box, whereby the vaporized cryogenic nitrogen flows in hot and cold streams. The overall heat-transfer coefficients were evaluated and compared with traditional correlations. Lastly, we suggested the modified heat-transfer correlations for a PCHE in a cryogenic condition.

Time-division Multiplexing Scheme for Analog Response Analysis (시분할 멀티플렉싱 기법을 이용한 아날로그 회로응답 분석)

  • 노정진
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.2
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    • pp.126-136
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    • 2003
  • We propose a new technique to improve the parametric fault coverage of oscillation test method (OTM). The OTM has been popular as a vectorless scheme for analog circuit test, both as a general defect-oriented technique, as well as an oscillation built-in self- test (BIST) scheme. However, it still requires improvement in several aspects. This paper analyzes the limitation of OTM, and proposes new signature analysis scheme to improve its performance.

Study for Inspection Method of Electronic Components Using 3-D X-ray Imaging Technology (3차원 X-ray 영상 기법을 이용한 전자부품 검사 기술 연구)

  • Sim, Hyeok-Hun;Park, Gi-Nam;Kim, Jong-Hyeong;Park, Hui-Jae
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.16 no.5
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    • pp.157-161
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    • 2007
  • There are technological changes to reduce the size and weight of electronic components and to accommodate multi-functions in them. To meet this trend, more complicated technological processes are required. To maintain the processes, more accurate inspection systems are also necessary. Therefore, new inspection methods are needed, which is differ from conventional inspection methods such as electrical test methods ICT(In-Circuit Test), FCT(Function Test) and visual test using optical equipments. One of the possible approaches is non-destructive test using X-ray. In this paper, an inspection method using X-ray is developed and applied to inspection of soldering state and internal defects of electronic components.

A Study on Filtration System Model and Comparative Performance Tests of Automotive (여과시스템 모델과 자동차 연료필터의 비교성능시험 연구)

  • 이재천
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.3
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    • pp.194-201
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    • 2003
  • This study presents the comparative filtration performance evaluation of automotive fuel filters based on the theory of Beta ratio. For the experiments, the fuel component's test stand incorporating the multi-pass filtration test circuit was developed. A mathematical description of filtration process in general was derived. And the theoretical basis of multi-pass test and the test procedure were described in detail. Experimental results revealed that domestic fuel filter tested could not maintain consistent Beta ratio, that is filtration efficiency, although it had the holding capacity of contaminants close to the specification at maximum pressure drop across the filter assembly. The results of experiments and simulations also showed that filtration system model could be refined including desorption ratio to estimate the variable Beta ratio in service life.

A study on the key Issues for implementing the IEC61850 based Gateway (IEC61850 기반의 Gateway 개발을 위한 이슈에 관한 연구)

  • Oh, Moo-Nam;Lee, Suk-Bea;Woo, Chun-Hee;Kim, Jung-Soo
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.91_92
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    • 2009
  • As the increasing integrity of VLSI, the BIST(Built-In Self Test) is used as an effective method to test chips. Generally the pseudo-random test pattern generation is used for BIST. But it requires too many test patterns when there exist random resistant faults. Therefore we propose a mixed test scheme which applies to the circuit under test, a deterministic test sequence followed by a pseudo-random one. This scheme allows the maximum fault coverage detection to be achieved, furthermore the silicon area overhead of the mixed hardware generator can be reduced.

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A Sturdy on the Sleep Twist Round type Stacked Wind Power System for Appling Environment-Friendly Building and High Rise Housing (대형 건축물과 주거 친화형 저 풍속 연곡형 적층 풍력발전 시스템에 관한 연구)

  • Jung, Ja-Choon;Jang, Mi-Hye
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.4
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    • pp.796-800
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    • 2011
  • As the increasing integrity of VLSI, the BIST(Built-In Self Test) is used as an effective method to test chips. Generally the pseudo-random test pattern generation is used for BIST. But it requires too many test patterns when there exist random resistant faults. Therefore we propose a mixed test scheme which applies to the circuit under test, a deterministic test sequence followed by a pseudo-random one. This scheme allows the maximum fault coverage detection to be achieved, furthermore the silicon area overhead of the mixed hardware generator can be reduced.

Electrical Behavior of the Circuit Screen-printed on Polyimide Substrate with Infrared Radiation Sintering Energy Source (열소결로 제작된 유연기판 인쇄회로의 전기적 거동)

  • Kim, Sang-Woo;Gam, Dong-Gun;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.3
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    • pp.71-76
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    • 2017
  • The electrical behavior and flexibility of the screen printed Ag circuits were investigated with infrared radiation sintering times and sintering temperatures. Electrical resistivity and radio frequency characteristics were evaluated by using the 4 point probe measurement and the network analyzer by using cascade's probe system, respectively. Electrical resistivity and radio frequency characteristics means that the direct current resistance and signal transmission properties of the printed Ag circuit. Flexibility of the screen printed Ag circuit was evaluated by measuring of electrical behavior during IPC sliding test. Failure mode of the Ag printed circuits was observed by using field emission scanning electron microscope and optical microscope. Electrical resistivity of the Ag circuits screen printed on Pl substrate was rapidly decreased with increasing sintering temperature and durations. The lowest electrical resistivity of Ag printed circuit was up to $3.8{\mu}{\Omega}{\cdot}cm$ at $250^{\circ}C$ for 45 min. The crack length arisen within the printed Ag circuit after $10{\times}10^4$ sliding numbers was 10 times longer than that of after $2.5{\times}10^4$ sliding numbers. Measured insertion loss and calculated insertion loss were in good agreements each other. Insertion loss of the printed Ag circuit was increased with increasing the number of sliding cycle.