• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.10a
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• pp.407-410
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• 2012

Recently, wireless network services are widely used, depending on the development of wireless network module technologies and the utilization gradually expanded, and thus is a trend that appears a lot of IT convergence industries. For this study, the OBD-II communication to Import your vehicle information, and other external devices in high-speed driving condition of the vehicle to verify the information system was developed to transfer data to an external server. From various sensors inside the vehicle using the OBD-II connector easily convert all users to read the information, then, Sent to the external server using the wireless network module, high-speed vehicle status check system was implemented. It was to test the performance of the system was developed using the actual circuit in a high-speed road racing vehicles. Transfer data generated from high-speed driving vehicles through the OBD-II scanner and check the status of a high-speed vehicle system was confirmed that this data is normally received. In the future, these new cars convergence of IT technology will grow as a new field of research.

• Applied Chemistry for Engineering
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• v.20 no.6
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• pp.622-627
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• 2009

Using an alkali-solution developable photosensitive resin and a carbon black as a conductive filler, photo-patternable pastes for polymer thick film resistor were fabricated and evaluated. A photo solder resist (PSR), which is usually used as protecting layer of printed circuit board (PCB), was used as a photosensitive resin so that ultraviolet exposure and alkali-aqueous solution development of paste were possible. After fabricating the photosensitive polymer resistor paste, the electrical properties of thick film resistors were measured using PCB test boards. Sheet resistance was decreased with increasing amount of carbon black, but the developability was limited in excess loading of carbon black. The sheet resistance was also reduced by re-curing and the change rate was smaller in higher carbon black loading. Moreover, finely patterned meander-type thick film resistors were fabricated using photo-process and large resistance up to several tens of sheet resistance could be obtained in small area by this technique.

• Korean Journal of Materials Research
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• v.24 no.3
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• pp.166-173
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• 2014

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.

• Journal of the Semiconductor & Display Technology
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• v.15 no.4
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• pp.10-15
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• 2016

In this paper, novel ball grid array (BGA) interconnection process using solderable anisotropic conductive adhesives (SACAs) with low-melting-point alloy (LMPA) fillers have been developed to enhance the processability in the conventional capillary underfill technique and to overcome the limitations in the no-flow underfill technique. To confirm the feasibility of the proposed technique, BGA interconnection test was performed using two types of SACA with different LMPA concentration (0 and 4 vol%). After the interconnection process, the interconnection characteristics such as morphology of conduction path and electrical properties of BGA assemblies were inspected and compared. The results indicated that BGA assemblies using SACA without LMPA fillers showed weak conduction path formation such as solder bump loss or short circuit formation because of the expansion of air bubbles within the interconnection area due to the relatively high reflow peak temperature. Meanwhile, assemblies using SACA with 4 vol% LMPAs showed stable metallurgical interconnection formation and electrical resistance due to the favorable selective wetting behavior of molten LMPAs for the solder bump and Cu metallization.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.885-888
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• 2015

A secure and effective on-chip bus for detecting and preventing malicious attacks by infected IPs is presented in this paper. Most system inter-connect (on-chip bus) are vulnerable to hardware Trojan (Malware) attack because all data and control signals are routed. A proposed secure bus with modifications in arbitration, address decoding, and wrapping for bus master and slaves is designed using the Advanced High-Performance and Advance Peripheral Bus (AHB and APB Bus). It is implemented with the concept that arbiter checks share of masters and manage infected masters and slaves in every transaction. The proposed hardware is designed with the Xilinx 14.7 ISE and verified using the HBE-SoC-IPD test board equipped with Virtex4 XC4VLX80 FPGA device. The design has a total gate count of 40K at an operating frequency of 250MHz using the $0.13{\mu}m$ TSMC process.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.51 no.9
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• pp.522-529
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• 2002

In this paper, computer simulations of the physical Phenomena occurring in the arc region before and after current zero were carried out to evaluate the thermal recovery characteristics of a Laval nozzle. A commercial CFD program "PHOENICS" is used for the simulation and the user-coded subroutines to consider the arcing phenomena were added to this program by the authors. The computed results were verified by the comparison with the test results presented by the research group of GE Co.(General Electric Company). In order to investigate the state of the arc region after current zero, the simulation was carried out with three steps. They are steady state arc simulation, transient arc simulation before current zero, and transient hot-gas flow simulation after current zero. The semi-experimental arc radiation model is adapted to consider the radiation energy transport and Prandtl's mixing length model is employed as the turbulence model. The electric field and the magnetic field were calculated with the same grid structure used for the simulation of the flow field. The post-arc current was calculated to evaluate the thermal recovery characteristics after current zero. Compared with the results obtained by GE Co., it has been found that the critical RRRV(ratio of rise of recovery voltage) will be determined previously by this study.his study.

• Journal of the Korea Convergence Society
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• v.12 no.5
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• pp.17-22
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• 2021

Eco-friendly magnesium-air battery is a kind of metal-air battery known as a primary battery with a very high theoretical discharge capacity. This battery is also called a metal-fuel cell from the viewpoint of using oxygen in the atmosphere as a cathode active material and magnesium alloy as a fuel. Since battery performance is determined by the properties of the magnesium alloy used as a anode, more research and development of the magnesium alloy electrode as a anode material are required in order to commercialize it as a high-performance battery. In this study, the commercialized magnesium alloys(AZ31, AZ61) were selected and then electrochemical measurements and discharge test were conducted. Electrochemical properties of magnesium alloys were investigated by OCP changes, Tafel parameters and CV measurement, and the feasibilities of AZ61 alloy with excellent discharge capacity(1410mAhg^-1) as electrode materials were evaluated through CC discharge experiments.

• Journal of Electrochemical Science and Technology
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• v.12 no.4
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• pp.431-439
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• 2021

This research work aims to investigate the effect of the aerobic bacterium, Pseudomonas aeruginosa on the mechanical and electrochemical properties of the 316L stainless steel and α-brass. These properties of both the alloys were determined after 7 days of exposure to the controlled and inoculated media at 37℃. The microstructural and electrochemical test results revealed the deleterious effects of Pseudomonas aeruginosa. After exposure to the inoculated medium, the scanning electron microscopy (SEM) results showed the larger pitting and formation of relatively dense biofilm on α-brass compared to 316L stainless steel. The tensile strength and hardness of 316L stainless steel were slightly affected after exposure to the controlled and inoculated media. After exposure to the controlled medium and inoculated media, the tensile strength of the α-brass was least affected but a significant decrease in the hardness (from 165 HV to 124 HV) was observed due to the severe attack induced by the Pseudomonas aeruginosa. Similarly, the open-circuit potential of the 316L stainless steel in the inoculated medium was measured to be less active (-410 mV vs Ag/AgCl) than α-brass (-550 mV vs Ag/AgCl). In the inoculated medium, potentiodynamic polarization curves confirmed the severe attack of Pseudomonas aeruginosa on α-brass (7.15 × 10^-2 mm/year) compared to 316L stainless steel which registered a corrosion rate of 5.14 × 10^-4 mm/year.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.3 s.40
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• pp.1-8
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• 2006

Higher density integration and adoption of new materials in advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, metal interconnects respond to applied voltages by electrochemical ionization and conductive filament formation, which leads to short-circuit failure of the electronic package. In this work, in-situ water drop test and evaluation of corrosion characteristics for SnPb solder alloys in D.I. water and NaCl solutions were carried out to understand the fundamental electrochemical migration characteristics and to correlate each other. It was revealed that electrochemical migration behavior of SnPb solder alloys was closely related to the corrosion characteristics, and Pb was primarily ionized in both D.I. water and $Cl^{-}$ solutions. The quality of passive film formed at film surface seems to be critical not only for corrosion resistance but also for ECM resistance of solder alloys.

• The Korean Journal of Physiology
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• v.9 no.2
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• pp.7-15
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• 1975

The maximum breathing capacity (MBC) and the maximum mid-expiratory flow rate (MMF) are widely used in evaluation of the ventilatory function, among various parameters of pulmonary function. The MBC volume is the amount of gas which can be exchanged per unit time during maximal voluntary hyperventilation. Performance of this test, unlike that of single breath maneuvers, is affected by the integrity of the respiratory bellows as a whole including such factors are respiratory muscle blood supply, fatigue, and progressive trapping of air. Because of this, the MBC and its relation to ventilatory requirement correlates more closely with subjective dyspnea than does any other test. The MMF is the average flow rate during expiration of the middle 50% of the vital capacity. The MMF is a measurement of a fast vital capacity related to the time required for the maneuver and the MMF relates much better to other dynamic tests of ventilatory function and to dyspnea than total vital capacity, because the MMF reflects the effective volume, or gas per unit of time. Therefore, it is important to have a prediction formula with one can compute the normal value for the subject and the compare with the measured value. However, the formulas for prediction of both MBC and MMF of the Korean children and adolescents are not yet available in the present. Hence, present investigation was attempt to derive the formulas for prediction of both MBC and MMF of the Korean children and adolescents. MBC and MMF were measured in 1,037 healthy Korean children and adolescents (1,035 male and 1,002 female) whose ages ranged from 8 to 18 years. A spirometer (9L, Collins) was used for the measurement of MBC and MMF. Both MBC and MMF were measured 3times in a standing position and the highest values were used. For measurement, the $CO_2$ absorber and sadd valve were removed from the spirometer in order to reduce the resistance in the breathing circuit and the subject was asked to breathe as fast and deeply as possible for 12 seconds in MBC and to exhale completely as fast as possible after maximum inspiration for MMF. During the measurement, investigator stood by the subject to give a constant encouragement. All the measured values were subsequently converted to values at BTPS. The formulas for MBC and MMF were derived by a manner similar to those for Baldwin et al (1949) and Im (1965) as function of age and BSA or age and height. The prediction formulas for MBC (L/min, BTPS) and MMF (L/min, BTPS) of the Korean children and adolescents as derived in this investigation are as follows: For male, MBC=[41.70+{$2.69{\times}Age(years)$}]${\times}BSA$ $(m^{2})$ MBC=[0.083+{$0.045{\times}Age(years)$}]${\times}Ht$ (cm) For female, MBC=[45.53+{$1.55{\times}Age(years)$}]${\times}BSA$ $(m^2)$ MBC=[0.189+{$0.029{\times}Age(years)$}]${\times}Ht$ (cm) For male, MMF= [0.544+{$0.066{\times}Age(years)$}]${\times}Ht$ (cm) For female, MMF=[0.416+{$0.064{\times}Age(years)$}]${\times}Ht$ (cm)