• The Journal of Korean Institute of Communications and Information Sciences
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• v.32 no.11C
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• pp.1102-1110
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• 2007

In this paper, we design the FPGA (Field-Programmable Gate Array) of the CAMB (Constant-Amplitude Multi-code Biorthogonal) modulation, and implement the SoC (System on Chip). The ASIC (Application Specific Integrated Circuit) chip is be implemented through targeting and board test. This 12Mbps modem SoC includes the ARM (Advanced RISC Machine)7TDMI, 64Kbyte SRAM(Static Random Access Memory) and ADC (Analog to Digital Converter)/DAC (Digital to Analog Converter) for flexible applications. Additionally, the modem SoC can support the variable communication interfaces such as the 16-bits PCMCIA (Personal Computer Memory Card International Association), USB (Universal Serial Bus) 1.1, and 16C550 Compatible UART (Universal Asynchronous Receiver/Transmitter).

• Journal of the Institute of Electronics and Information Engineers
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• v.52 no.8
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• pp.49-58
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• 2015

A floating type of memristor emulator which acts like the behavior of $TiO_2$ memristor has been developed. Most of existing memristor emulators are grounded type which is built disregarding the connectivity with other memristor or other devices. The developed memristor emulator is a floating type whose output does not need to be grounded. Therefore, the emulator is able to be connected with other devices and be utilized for the interoperability test with various other circuits. To prove the floating function of the proposed memristor emulator, a Wheatstone bridge is built by connecting 4 memristor emulators in series and parallel. Also this bridge circuit suggest that it is possible to weight calculation of the neural network synapse.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.2 s.179
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• pp.199-206
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• 2006

Automatic grease lubricator is equipment that provides adequate amount of fresh grease constantly to the shaft and the bearings of machines. It minimizes the friction heat and reduces the friction loss of machines to the least. This research is to develop automatic grease lubricator by gear driven mechanism with controlled operation time. The ultimate design of this equipment is to lubricate an adequate amount of grease by a simple switch clicking according to the advanced set cycle. The backlash of the gear was minimized to increase the output power. To increase the power of gear mechanism, the binding frequency and the thickness of the coil were changed. To control the rotating cycles of the main shaft according to its set numbers, different resistance and chips were used to design the circuit to controls electrical signals with pulse. The body of the lubricator was analyzed by stress analysis with different constructed angle. The stress analysis for differing loading pressures applied to the exterior body of grease lubricator due to the setup angle, was found that the maximum stress was distributed over the outlet part where the grease lubricator suddenly narrowed contracts. Digital mock-up was analyzed and the rapid prototyping(RP) trial products were tested with PCB circuit and grease. The evaluation of the outlet capacity for RP trial products was conducted, because the friction caused by the outlet on the wall surface was an important factor in the operation of the equipment. Finally, the finishing process was applied to decrease the roughness of the surface to a comparable level and was able to test the performance examination for the product.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.81-81
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• 2009

최근 휴대폰, 노트북 등과 같은 소형 멀티미디어 기기의 사용이 증가함에 따라 전자 패키징 산업은 경박단소화를 요구하고 있습니다. 더불어 전기적 신호의 손실을 줄이기 위해 전기, 전자산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(Flexible Printed Circuit Board, FPCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(Rigid Printed Circuit Board, RPCB)의 전극간 접합에 많은 관심을 보이고 있습니다. 기존에 연성인쇄회로기판과 경성인쇄회로기판을 접합하는 방식으로는 connector를 이용한 체결법이 사용되고 있지만 완성품의 부피가 커지고 자동화 공정이 힘들며 I/O 개수가 제한적이어서 신호전달에 취약한 단점이 있습니다. 또한, 최근 FPCB를 RPCB에 접합하는데 interconnection으로 이방성 도전 필름(Anisotropic conductive film, ACF) 또는 비전도성 필름(Non-conductive film)이 널리 사용되고 있습니다. 하지만 필름의 가격이 비싸고, 낮은 전기 전도도를 보이며, 신뢰성 특성이 낮다는 단점을 가지고 있습니다. 본 실험에서는 기존의 connector 방식과 접착 필름을 이용한 방식을 대체하기 위하여 솔더를 interlayer로 이용하여 열과 압력으로 접합하는 방법에 대하여 연구하였습니다. 실험에 사용된 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)이고, RPCB와 FPCB의 표면처리는 ENIG로 하였습니다. 접합 온도와 접합 시간에 따라 최적의 접합 조건을 도출하고자 하였고, 접합된 시편을 가지고 신뢰성 테스트를 진행하였습니다. $85^{\circ}C$/85% 고온고습 시험과 고온 방치 시험을 통하여 접합부의 신뢰성을 테스트 하였고, 90도 Peel test로 기계적 접합 강도를 측정하였고, 파괴 단면을 Scanning Electron Microscopy (SEM), Energy-dispersive spectroscopy (EDS), X-ray photoelectron spectroscopy (XPS)로 분석하였습니다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.3 no.3
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• pp.661-669
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• 1999

A probe card is one of the most important pan of test systems as testing IC(integrated circuit) chips. This work was related to bump-type silicon vertical probe card which enabled simultaneous tests for multiple semiconductor chips. The probe consists of silicon cantilever with bump tip. In order to obtain optimum size of the cantilever, the dimensions were determined by FEM(finite element method) analysis. The probe was fabricated by RIE(reactive ion etching), isotropic etching, and bulk-micromachining using SDB(silicon direct bonding) wafer. The optimum height of the bump of the probe detemimed by FEM simulation was 30um. The optimum thickness, width, and length of the cantilever were 20 $\mum$, 100 $\mum$,and 400 $\mum$,respectively. Contact resistance of the fabricated probe card measured at contact resistance testing was less than $2\Omega$. It was also confirmed that its life time was more than 20,000 contacts because there was no change of contact resistance after 20,000 contacts.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.6
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• pp.646-652
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• 2014

This paper presents a design and fabrication of Ku-band power amplifier using Gallium Nitride High Electron Mobility Transistor (GaN HEMT) die. In order to fabricate the low-cost Ku-band power amplifier, a Printed Circuit Board(PCB) was used for input/output matching circuits instead of manufacturing process to use an expensive substrate. The measured output power is 42.6 dBm, the drain efficiency is 37.7 % and the linear gain is 7.9 dB under pulse operation at the frequency of 14.8 GHz. Under the continuous wave(CW) test, the output power is 39.8 dBm, the drain efficiency is 24.1 % and the linear gain is 7.2 dB.

• Journal of Satellite, Information and Communications
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• v.7 no.2
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• pp.76-79
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• 2012

Satellite power system is critical for mission design and survival operation. Accordingly power conversion circuit has to stable design and verify for operation condition change (load, voltage, thermal condition). however, multi-stage make complicate for modeling and get all state solution. In this paper present all state solution for multi-stage converter by using Extended Describing Function(EDF) modelling. EDF modelling has merit to solve complex circuit but it has limit too. Because of fundamental approximation, EDF modeling is not match all topology. Consequently, we verify passible topology for EDF modeling and stable design multi-stage converter.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.5
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• pp.339-347
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• 2019

The power circuit design of an on-board S-band transmitter for KSLV-II with derating(operation of a component at less than its maximum rated specification to enhance reliability) is investigated. The power circuit of the transmitter consists of linear voltage regulators, DC/DC converters for regulating the DC supply, and diodes for reverse voltage protection. After analyzing the load current of the components, derating requirements are explored. Furthermore, power dissipation and junction temperature rise are considered with respect to the load current. The analysis is compared to the results from an engineering model of the transmitter. The temperature of the components is derated by >$40^{\circ}C$ in an environment where the ambient temperature is $+60^{\circ}C$, which is the acceptance test specification of high temperature.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.4
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• pp.812-818
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• 2003

This paper presents a developed outside rotor type induction motor for the fan. Nearly all of the induction motors consist of two parts, rotor and stator, and the position of rotor is generally inside of stator. However, the rotor of the developed induction motor is located outside of stator. It is believed that the outside rotor type induction motor is suitable for the fan due to its large inertia, that is, it is considered that the change of air flow rate resulting from input power or load fluctuation is reduced. In this paper, the two tests which are suitable to obtain the electrical parameters of the outside rotor type induction motor were described, then various parameters of outside rotor type induction motor were measured. These are the locked rotor test and no load test. By using these tests, it was possible to determine the parameters which are presented in the steady-state equivalent-circuit of the outside rotor type induction motor. Load test of induction motor was carried out using a dynamometer and the torque-speed curve was obtained. It is believed that the results of this paper can be used for the development of the outside rotor type induction motor.

• Proceedings of the KIEE Conference
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• 2005.11b
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• pp.116-118
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• 2005

IEC 60364-4-44 provides rules for the protection against the effects of conducted and radiated disturbances on electrical installations. Especially this standards deals with the protection of low voltage facility against the ground fault in the high voltage side of power distribution system. Many countries defines the regulations on the use and production of electrical facilities based on their own power system and technical references which are considered to be suitable for themselves. The background of circuit of IEC 60364 is based on the ungrounded system as most of European countries adopt. However, since domestic ground system is multi-grounding system different from European system, it is necessary to evaluate or prove the effect of the IEC 60364 for introducing and applying it to the domestic grounding system as a Korean standard. This paper presents the establishment of test field to get background data to introduce the IEC 60364 and to evaluate the standard is applicable or not to domestic rule for the protection against ground fault through the related test.