• 한국방사선학회논문지
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• 제16권7호
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• pp.969-974
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• 2022

디지털 엑스레이 디텍터 영상 취득에 있어 동적 범위를 최대화하고 영상지연을 최소화하기 위해서는 엑스레이 영상센서의 픽셀내 포토다이오드에 존재하는 잔류 정전기생용량을 빠르고 완전하기 제거하는 것이 매우 중요하다. 이러한 요구사항은 특히 고속 프레임과 낮은 영상지연이 필요한 산업용 2D/3D 자동화 엑스레이 검사와 의료용 CT 엑스레이 디텍터에 특별히 요구된다. 본 연구는 리셋 박막트랜지스터, 리드아웃 박막트랜지스터 그리고 포토다이오드로 픽셀이 구성된 듀오픽스^TM 엑스레이 영상센서를 처음으로 제안한다. 듀오픽스^TM 엑스레이 영상센서의 구동을 검증하기 위해 105 ㎛의 픽셀 사이즈, 347 mm × 430 mm의 영상영역 그리고 3300 × 4096의 픽셀 (13.5M pixels)을 갖는 듀오픽스^TM 엑스레이 영상센서를 설계, 제작하여 모듈테스터와 영상취득 프로그램을 통해 영상을 취득하였다.

• 대한기계학회논문집B
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• 제36권12호
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• pp.1217-1222
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• 2012

능동 유동 제어의 되먹임 신호 및 벽면 전단 응력 측정 등을 위해 벽면 유동 센서가 사용되고 있다. 본 연구에서는 광학 마우스에 사용되는 미세 영상 장치를 이용하여 벽면 근처에서 2차원 및 3차원 유체 속도를 측정할 수 있는 센서를 개발하였다. 미세 영상 장치에서 나오는 영상 신호 획득 시스템을 구축하고 획득한 영상에 입자화상속도기법과 초점이탈 영상기법을 적용하여 측정 영역에서의 산란 입자의 위치를 측정하였다. 모사 유동 실험을 통해, 개발된 벽면 유동 센서의 공간 해상도 및 측정 정확도를 검증하였고 기존 미세 영상 장치의 quadrature 신호 결과와 비교하여 입자화상속도기법을 적용할 경우, 측정 정확도 및 측정 범위가 확대되는 것을 확인하였다.

• Advances in aircraft and spacecraft science
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• 제10권1호
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• pp.67-82
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• 2023

Linear array imaging sensors are widely used in remote sensing satellites. The final products of an imaging sensor can only be used when they are geometrically, radiometrically, and spectrally calibrated. Therefore, at the first stages of sensor design, a detailed calibration procedure must be carefully planned based on the accuracy requirements. In this paper, focusing on inherent optical distortion, a step-by-step procedure for laboratory geometric calibration of a typical push-broom satellite imaging sensor is simulated. The basis of this work is the simulation of a laboratory procedure in which a linear imager mounted on a rotary table captures images of a pin-hole pattern at different angles. By these images and their corresponding pinhole approximation, the correction function is extracted and applied to the raw images to give the corrected ones. The simulation results illustrate that using this approach, the nonlinear effects of distortion can be minimized and therefore the accuracy of the geometric position of this method on the image screen can be improved to better than the order of sub-pixel. On the other hand, the analyses can be used to proper laboratory facility selection based on the imaging sensor specifications and the accuracy.

• Current Optics and Photonics
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• 제7권4호
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• pp.398-407
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• 2023

We explored a method to evaluate imaging performance for the optimal assembly of an endoscopic miniature lens and a sensor constituting an imaging module at the distal end of gastrointestinal endoscopy. For the assembly of the imaging module, the image sensor was precisely located at the focal plane when collimated light passed through the endoscopic lens. As another method, the distance between the lens and sensor was adjusted to obtain the highest focus index from images measured the star chart of the International Organization for Standardization (ISO) standard at various positions. We analyzed the slanted-edge modulation transfer function (MTF), corresponding depth of field, and number of line pairs for MTF 50% and 20% at each working distance within the range of 5-100 mm for imaging modules assembled in different ways. Assembly conditions of the imaging module with better MTF performance were defined for each working distance range of 5-30 mm and 30-100 mm, respectively. In addition to the MTF performance, the focus index of each assembled module was also compared. In summary, we examined the performance of imaging modules assembled with different methods within the suggested working distance and tried to establish the optimal assembly protocol.

• 제어로봇시스템학회논문지
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• 제6권5호
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• pp.396-403
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• 2000

A thermal imaging system is implemented for the measurement and the analysis of the thermal distribution of the target objects. The main part of the system is a thermal camera in which a focal plane array typed sensor is introduced. The sensor detects the mid-range infrared spectrum of target objects and then it outputs a generic video signal which should be processed to form a frame thermal image. Here, a digital signal processor(DSP) is applied for the high speed processing of the sensor signals. The DSP controls analog-to-digital converter, performs correction algorithms and outputs the frame thermal data to frame buffers. With the frame buffers can be generated a NTSC signal and transferred the frame data to personal computer(PC) for the analysis and a monitoring of the thermal scenes. By performing the signal processing functions in the DSP the overall system achieves a simple configuration. Several experimental results indicate the performance of the overall system.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.453-456
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• 2009

We present a new generation of imaging colorimeter that ensures improved accuracy and sensitivity for shorter measurement times. The imaging optics is telecentric on the sensor and allows measurements at any distances without additional calibration. A new technology is used to make the color filters and flat densities. Imaging polarimetry at fixed wavelength is also possible with the same instrument.

• 한국방사선학회논문지
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• 제8권7호
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• pp.371-376
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• 2014

CdTe 멀티에너지 X선 영상센서와 ROIC를 패키징 하기 위한 flip chip bump bonding, Au wire bonding 및 encapsulation 공정조건을 개발하였으며 성공적으로 모듈화 하였다. 최적 flip chip bonding 공정 조건은 접합온도 CdTe 센서 $150^{\circ}C$, ROIC $270^{\circ}C$, 접합압력 24.5N, 접합시간 30s일 때이다. ROIC에 형성된 SnAg bump의 bonding이 용이하도록 CdTe 센서에 비하여 상대적으로 높은 접합온도를 설정하였으며, CdTe센서가 실리콘 센서에 비하여 쉽게 파손되는 것을 고려하여 접합압력을 최소화하였다. 패키징 완료된 CdTe 멀티에너지 X선 모듈의 각각 픽셀들은 단락이나 합선 등의 전기적인 문제점이 없는 것을 X선 3D computed tomography를 통해 확인할 수 있었다. 또한 Flip chip bump bonding후 전단력은 $2.45kgf/mm^2$ 로 측정되었으며, 이는 기준치인 $2kgf/mm^2$ 이상으로 충분한 접합강도를 가짐을 확인하였다.

• 센서학회지
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• 제26권4호
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• pp.245-250
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• 2017

A novel method to implement a birdcage-type receiving coil sensor for use in a magnetic resonance imaging(MRI) system has been demonstrated employing a flexible printed circuit board (FPCB) fabrication technique. Unlike the conventional methods, the two-dimensional shape of the coil sensor is first implemented as a FPCB and then it is attached to the surface of a cylindrical supporting structure to implement the three-dimensional birdcage-type coil sensor. The proposed method is very effective to implement object-specific MRI coil sensors especially for small animal measurements in research and preclinical applications since the existing well-developed FPCB-based techniques can easily meet the requirements on accuracies and costs during coil implement process. The performances of the coil sensor verified through $^1H$ 1.5T MRI measurements for small animals and it showed excellent characteristics by providing a high spatial precision and a high signal-to-noise ratio.

• 센서학회지
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• 제27권5호
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• pp.311-316
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• 2018

An antenna-coupled bolometer-type terahertz sensor was designed, fabricated, evaluated, and utilized to obtain terahertz transmission images. The sensor consists of a thin film bowtie antenna that resonates accordingly in response to an incident terahertz beam, a heater that converts the applied current in the antenna into heat, and a microbolometer that converts the rise in temperature into a change in resistance. The device is fabricated by a bulk micromachining process on a 4-inch silicon wafer. The fabricated sensor chip has a size of $2{\times}2mm$ and an active area of $0.1{\times}0.1mm^2$. The temperature coefficient of resistance (TCR) of the bolometer film (VOx) is 2.0%, which is acceptable for bolometer applications. The output sensor signal is proportional to the power of the incident terahertz beam. Transmission images were obtained with a 2-axis scanning imaging system that contained the sensor. The small active area of the sensor will enable the development of highly sensitive focal plane array sensors in terahertz imaging cameras in the future.

• Journal of Electrical Engineering and Technology
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• 제10권5호
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• pp.2205-2210
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• 2015

Experimental studies have been carried out to study the principle operation of the conductive type wire-mesh tomography sensor and analyse the wire-mesh tomography sensor for the liquid/gas two-phase flow interface and void fraction distribution in a process column. The measurement of the two-phase flows in the process column is based on the cross-sectional local instantaneous conductivity. The sensor consists of two planes of parallel electrode wires with 16 electrodes each and was placed orthogonally with each plane. The sensor electrode wires were made of tinned copper wire with an outer diameter of 0.91 mm which stretched over the sensor fixture. Therefore, this result in the mesh grid size with 5.53×5.53mm². The wire-mesh sensor was tested in a horizontal liquid/gas two-phase flows process column with nominal diameter of 95.6 mm and the sampling frequency of 5882.3529 Hz. The tomogram results show that the wire-mesh tomography provides significant results to represent the void fraction distribution in the process column and estimation error was found in the liquid/gas interface level