• 한국반도체및디스플레이장비학회:학술대회논문집
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• 한국반도체및디스플레이장비학회 2003년도 추계학술대회 발표 논문집
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• pp.146-153
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• 2003

This paper deals with the stress singularity induced at the interface corner between the viscoelastic thin film and the rigid substrate subjected to the combined influence of temperature change and moisture absorption. A boundary element analysis is employed to investigate the behavior of interface stresses. The film is assumed to be thermorheologically simple. It is further assumed that moisture effects are analogous to thermal effects. Numerical results are presented for a given viscoelastic model, indicating the singular residual stresses induced during cooling down from the curing temperature, and how they can be altered by subsequent moisture absorption at room temperature.

• 한국안전학회지
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• 제11권4호
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• pp.143-150
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• 1996

본 연구는 선형, 비선형 hygrothermal 응력 문제를 위한 explicit-Implicit 유한요소 해석 모델 개발에 관한 것이다. 부가적으로 moilsture 확산 방정식, J-적분 평가를 위한 균열 요소 및 가상 균열 진전법이 도입된다. 시간 변화에 따른 균열 추진력을 계산하기 위하여 선형 탄성 파괴 역학(LEFM)이론이 고려되며 재료의 기공은 실온에서 액체 상태의 습기로 포화되어 있으며 온도가 상승함에 따라 증기화된다는 가정하에서 균열 추진력과 증기 효과의 관계가 연구된다. 이상 기체방정식은 각 시간 단계에서 증기에 의한 열역학적 압력을 계산하기 위하여 이용된다. 다공질 재료의 시간 종속 응답을 지배하는 방정식들은 혼합이론에 기초하며 다공질 재료의 유체 흐름을 위한 Darcy의 법칙과 Von-Mises 항복 기준을 포함하고 있는 Perzyna의 점소성 모델이 첨가된다. 또한 Green-Naghdi 응력률이 중첩된 강체 운동하에서 응력 텐서 invariant로 사용되며, 모델링을 위하여 사각요소가 이용되고 비선형 지배 방정식을 풀기 위하여 full Newton-Raphson법에 의한 반복법이 사용된다. 본 연구를 통하여 얻은 결과는 다음과 같다. 1) 본 유한요소 프로그램은 복합재의 hygrothermal 파괴 해석에 매우 유용하게 적용될 수 있다. 2) 습기의 온도에 의한 영향을 가지는 재료의 J-적분을 정확히 예측하기 위하여는 증기 효과를 고려하여야 한다. 왜냐하면 초기단계에 균열 전파력이 가속되기 때문이다. 3) 본 해석을 위해 Uncoupled scheme에 의한 결과도 Coupled scheme에 결과에 비해 아주 타당하므로 CPU 측면에서 매우 경제적인 Uncoupled scheme이 추천된다.

• Advances in Computational Design
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• 제3권3호
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• pp.303-318
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• 2018

This article presents a semi-analytical solution for an exponentially graded piezoelectric hollow sphere. The sphere interacts with electric displacement, elastic deformations, electric potentials, magneto-thermo-elasticity, and hygrothermal influences. The hollow sphere may be standing under both mechanical and electric potentials. Electro-magneto-elastic behavior of magnetic field vector can be described in the hollow sphere. All material, thermal and magnetic properties of hollow sphere are supposed to be graded in radial direction. A semi-analytical technique is improved to deduce all fields in which different boundary conditions for radial stress and electric potential are presented. Numerical examples for radial displacement, radial and hoop stresses, and electric potential are investigated. The influence of many parameters is studied. It is seen that the gradation of all material, thermal and magnetic properties has particular effectiveness in many applications of modern technology.

• Journal of Mechanical Science and Technology
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• 제18권3호
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• pp.357-369
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• 2004

The purposes of the paper are to analyze the fracture phenomenon by delamination and cracking when the encapsulant of plastic IC package with polyimide coating shows viscoelastic behavior under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by the approaches of stress analysis and fracture mechanics. The model is the plastic SOJ package with the polyimide coating surrounding chip and dimpled diepad. On the package without cracks, the optimum position and thickness of polyimide coating to decrease the maximum differences of strains at the bonding surfaces of parts of the package are studied. For the model delaminated fully between the chip and the dimpled diepad, C(t)-integral values are calculated for the various design variables. Finally, the optimal values of design variables to depress the delamination and crack growth in the plastic IC package are obtained.

• Advances in aircraft and spacecraft science
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• 제11권1호
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• pp.1-21
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• 2024

The stiffness reduction of cross-ply composite laminates featuring a transverse cracking and delamination within the mid-layer is predicted through utilization of a modified shear-lag model, incorporating a stress perturbation function. Good agreement is obtained by comparing the prediction models and experimental data. The material characteristics of the composite are affected by fluctuations in temperature and transient moisture concentration distribution in desorption case, based on a micro-mechanical model of laminates. The transient and non-uniform moisture concentration distribution induces a stiffness reduction. The obtained results demonstrate the stiffness degradation dependence on factors such as cracks density, thickness ratio and environmental conditions. The present study underscores the significance of comprehending the degradation of material properties in the failure progression of laminates, particularly in instances of extensive delamination growth.

• 대한기계학회논문집A
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• 제20권4호
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• pp.1347-1355
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• 1996

The purpose of this paper is to evaluate the delamination and fracture integrity of the IC plastic package under hygrothermal loading by stress analysis and fracture mechanics approaches. The plastic SOJ package with a dimpled diepad under the reflow slodering process of IR heating type is considered. On the package without a crack, the stress variation according to the change of the design variables such as the material and shape of the package is calculated and the possibility of delamination is considered. For the model fully delaminated between the chip and diepad, J-integrals are calculated for the various design variables and the fracture integrity is discussed. From the results, optimal design values of variables to prevent the delamination and fracture of IC package are obtained. In this study, FDM program to obtain the vapor pressure from the content of moisture absorbed into the package is developed.

• 한국군사과학기술학회지
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• 제8권3호
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• pp.124-130
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• 2005

In this paper, the effects of matrix hygrothermal aging and residual stress changes on $Avimid^{(R)}$ K3B/IM7 laminates in $80^{\circ}C$ water were studied. The factors causing the $80^{\circ}C$ water to degradation of the laminates could be the degradation of the matrix toughness, the change in residual stresses. After 500 hours fully saturated aging of the neat resin, the weight gain was 1.55% increase with the diffusion coefficient $7{\times}10^{-6}m^2/s$ and the fracture toughness was decreased about 41%. After 100 hours fully saturated aging of the $[+45/0/-45/90]_s$ K3B/IM7 laminates in $80^{\circ}C$ water, the weight gain was 0.41% increase with the diffusion coefficient $1{\times}10^{-6}m^2/s$ and the loss of the microcracking fracture toughness was 43.8% of the original toughness. To see whether the residual stress influenced the fracture toughness, two ply $[90^{\circ}/0^{\circ}]$ laminates were put in $80^{\circ}C$ water from 2 hours to 8 hours. The changes in residual stress in 8 hours are less than 3MPa. Because the 3MPa change is not sufficient to degrade the laminates, the main factor to degrade the microcracking fracture toughness was the degradation of the matrix fracture toughness.

• Journal of Mechanical Science and Technology
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• 제18권9호
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• pp.1572-1581
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• 2004

The purposes of the paper are to apply the axiomatic design methodology to the design of PBGA package with polyimide coating under hygrothermal loading in the IR soldering process and to suggest more reliable design conditions by stress analysis. The analysis model is a 256-pin perimeter Plastic Ball Grid Array (PBGA) package with the polyimide coating surrounding chip and above surface of BT-substrate. The polyimide coating is suggested to depress the maximum stresses occurred on the stress concentration positions. The axiomatic design methodology is proved to be useful to find the more reliable design conditions for PBGA package. Finally, the optimal values of design variables to depress the stress in the PBGA package are obtained.

• Advances in aircraft and spacecraft science
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• 제6권4호
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• pp.315-331
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• 2019

The stiffness degradation of the cross-ply composite laminates containing a transverse cracking and delamination in $90^{\circ}$ layer is predicted by using a modified shear-lag model by introducing the stress perturbation function. The prediction shows better agreement with the experimental results published by Ogihara and Takeda 1995, especially for laminates with thicker $90^{\circ}$ plies in which extensive delamination occurs. A homogenised analytic model for average transient moisture uptake in composite laminates containing periodically distributed matrix cracks and delamination is presented. It is shown that the model well describes the moisture absorption in a cross-ply composite laminate containing periodically distributed transverse matrix cracks in the $90^{\circ}$ plies. The obtained results represent well the dependence of the stiffness degradation on the crack density, thickness ratio and moisture absorption. The present study has proved to be important to the understanding of the degradation of the material propertiesin the failure process when the laminates in which the delamination grows extensively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.994-996
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• 1999

Hygrothermal aging at the elevated temperature induces the long-term degradation of the epoxy resin. We investigated the effects of hydrothermal stress on the dielectric breakdown phenomena of epoxy composite filled with natural zeolite. The cured specimens absorbed the moisture in the autoclave at $120^{\circ}C$. $T_g$ of the deteriorated composite by moisture absorption decreased. The dielectric breakdown strength decreased with the moisture absorption cycle. It was concluded that the thermal stress and the high water-vapour-pressure deteriorated the natural zeolite filled epoxy resin system, consequently and the tree growth rate increased.