• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.36 no.4
• /
• pp.303-325
• /
• 2023

Flexible fiber- or yarn-based one-dimensional (1-D) energy storage devices are essential for developing wearable electronics and have thus attracted considerable attention in various fields including ubiquitous healthcare (U-healthcare) systems and textile platforms. 1-D supercapacitors (SCs), in particular, are recognized as one of the most promising candidates to power wearable electronics due to their unique energy storage and high adaptability for the human body. They can be woven into textiles or effectively designed into diverse architectures for practical use in day-to-day life. This review summarizes recent important development and advances in fiber-based supercapacitors, concerning the active materials, fiber configuration, and applications. Active materials intended to enhance energy storage capability including carbon nanomaterials, metal oxides, and conductive polymers, are first discussed. With their loading methods for fiber electrodes, a summary of the four main types of fiber SCs (e.g., coil, supercoil, buckle, and hybrid structures) is then provided, followed by demonstrations of some practical applications including wearability and power supplies. Finally, the current challenges and perspectives in this field are made for future works.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.3
• /
• pp.7-17
• /
• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.