• Journal of the Korean Wood Science and Technology
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• v.28 no.4
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• pp.83-93
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• 2000

This study was carried out to improve the physico-mechanical properties of board products by applying the technique of high frequency heating, and find out the optimum conditions of high frequency heating, compared with the technique of hot platen heating. The possibility of isocyanate resin application to board production was also considered to solve the problem of free formaldehyde emission from urea resin which is generally used in wood industry. For this study, 30 mm thick MDP (medium density fiberboard) with isocyanate resin were manufactured by the techniques of hot platen heating, high frequency heating and the combination techniques of both heating methods, and compared in several point of views.