• Title/Summary/Keyword: hot plate method

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A New Hot-Plate Method using Threshold Temperature; its Application on the Study of the Interaction between Naloxone or Diazepam and Morphine (신열판실험방법(新熱板實驗方法)에 의(依)한 Naloxone과 Diazepam이 Morphine 진통효과(鎭痛效果)에 미치는 영향(影響)에 관(關)한 검색(檢索))

  • Moon, Young-Hwan;Chun, Boe-Gwun
    • The Korean Journal of Pharmacology
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    • v.18 no.2
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    • pp.45-50
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    • 1982
  • Yeum et al. formulated a new hot-plate method using the threshold temperature, and there are some controversies on the effects of naloxone and diazepam on the antinociceptive action. In this paper, the comparison of three methods registering analgesic activity and the application of the new hot-plate method formulated by Yeum et al. on the study of the influences of naloxone and diazepam on the analgesic effect of morphine were tried in male mice. The results obtained were summarized as follows; 1) The least-square regression lines of the morphine analgesia plotted against log-dose showed the correlation coefficient of above 0.90, but the competitive antagonism produced by naloxone (0.1 mg/kg) against the analgesia was more prominently demonstated by the new hot-plate method than the other methods: original hot-plate method and electrical stimulation method. 2) In the experiment using the new hot-plate method, the log dose-response curve of morphine (y=7.30 x+49.80, r=0.998) was shifted to the right by the pretreatment of naloxone (0.1 mg/kg), but was slightly shifted to the left by the pretreatment of diazepam (2.5 mg/kg). This study suggests that for the analgesia experiment, the new hot-plate method is superior to the original hot-plate method or the electrical stimulation method, and that the potentiative effect of diazepam on the morphine anagesia is not significant.

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Experimental and FE Analyses of Hot Curvature-Forming for Aluminum Thick Plate Using Grid-Typed Hybrid Die (격자형 하이브리드 금형에 의한 열간 알루미늄후판 곡면성형공정해석 및 실험)

  • Lee, I.K.;Lee, J.M.;Son, Y.K.;Lee, C.J.;Kim, B.M.
    • Transactions of Materials Processing
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    • v.20 no.4
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    • pp.316-323
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    • 2011
  • The hot curvature-forming of large aluminum thick plate using a grid-typed hybrid die is a process for the production of a spherical LNG tank. Many variables such as the initial die surface quality, grid size, grid thickness, size of blank plate and cooling line design, control the success of the process. In addition, the plate used in this process is generally larger than $10{\times}10m$ in size. Thus, it is very difficult to predict the surface characteristics of the plate during forming and to measure the different parameters due to the high cost of the experiments. In order to optimize the process design for the grid-type die, the development of an analytical method to predict the surface characteristics of the final product in hot curvature-forming is needed. This paper described the development of the method and procedures for FE simulations of the hot curvature-forming process, including hot forming, air flow, cooling, and thermal deformation analyses. An experiment for a small scale model of the process was conducted to check the validity of the numerical method. The results showed that the curvature of the plate in the analysis agrees well with that of the experiment within 0.037 and 0.016% tolerance margins for its side and corner, respectively.

Accuracy and Precision of Microwave Oven Digestion/Atomic Absorption Spectrophotometry for Analyzing Airborne Chromium Collected on MCE Filter in Plating Operation (도금공정 크롬시료 분석을 위한 Microwave Oven Digestion/Atomic Absorption Spectrophotometry 방법의 정확도 및 정밀도 평가)

  • Lee, Byung-Kyu;Lee, Ji-Tae;Shin, Yong-Chul
    • Journal of Korean Society of Occupational and Environmental Hygiene
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    • v.11 no.1
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    • pp.48-55
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    • 2001
  • The purpose of this study was to evaluate the analytical accuracy and precision of microwave oven digestion/atomi absorption spectrophotometry (AAS) for analyzing airborne chromium collected on mixed cellulose ester membrane (M filter from the work environment, and to compare the accuracy and the precision with those of the National Institute for Occupational Safety and Health (NIOSH) Method #7024 hot plate digestion/AAS method. For this study, field air sample pairs were collected from a electroplating process, and spiked samples in a laboratory were prepared and using these samples. Two digestion methods were comp; and evaluated in terms of recovery rate and bias as indices of accuracy and coefficient of variation as a index of precision. The results and conclusions are as follows. In spiked samples, the accuracies (% mean recoveries) of hot plate/AAS and microwave oven/AAS method were 97.19%, 97.1%, respectively, and the precisions (pooled respectively, and the precisions (pooled coefficient of variance, $CV_{pooled}$) 6.93% and 3.88%, respectively. The biases of hot plate ani microwave oven methods were 4.56 - 14.7% and 2.22 - 7.42% respectively. There was no statistically significant difference between hot plate and microwave oven methods recovery rates of spiked samples (p>0,05). Also, no statistically significant difference was shown among the concentrations of air samples determined by two method (p>0.05). In conclusion, microwave oven/AAS method h excellent accuracy and precision, and advantages such as time-saving and simple procedure in comparison with the classical NIOSH method. Therefore, this method can be use widely to analyze airborne chromium collected on MCE filter from the work environments.

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Residual Stress Evolution during Leveling of Hot Rolled High Strength Coils and Camber Prediction by Residual Stress Distribution (냉간 성형용 열연 고강도 강판의 교정 중 잔류응력 변화와 절단 후 캠버 발생 예측)

  • Park, K.C.;Ryu, J.H.
    • Transactions of Materials Processing
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    • v.17 no.2
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    • pp.107-112
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    • 2008
  • In order to investigate the residual stress evolution during the leveling process of hot rolled high strength coils for cold forming, the in-plane residual stress of plate sampled at SPM, rough leveler and finish leveler were measured by cutting method. Residual stress was localized near the edge of plate. As the thickness of plate was increased, the size of residual stress region was expanded. The gradient of residual stress within the plate was reduced during the leveling process. But the residual stress itself was not removed completely within the ranges of tested conditions. The exact camber of cut plate was able to be predicted by the measurement of residual stress distribution after leveling of the plate.

Residual Stress Evolution during Leveling of Hot Rolled Cold Forming Purpose High Strength Coils and Camber Prediction (냉간 성형용 열연 고강도 강판의 교정 중 잔류음력 변화와 절단 후 camber 발생 거동 연구)

  • Park, K.C.;Ryu, J.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2007.10a
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    • pp.112-115
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    • 2007
  • In order to investigate the residual stress evolution during the leveling process of hot rolled high strength coils for cold forming, the in-plane residual stress of plate sampled at SPM, rough leveler and finish leveler were measured by cutting method. Residual stress was localized near the edge of plate. As the thickness of plate was increased, the region with residual stress was expanded. The gradient of residual stress within plate was reduced during the leveling process. But the residual stress itself was not removed at the ranges of tested conditions. From the measured residual stress distribution within the plate, camber of plate cut to small width was predicted exactly within error range of experiment.

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The Microstructures and Hot Extrudability of Semi-solid AM100A Magnesium Alloy Fabricated by Cooling Plate (냉각판으로 제조한 반응고 AM100A 마그네슘 합금의 미세조직 및 열간 압출성)

  • Kim, Dae-Hwan;Sung, Young-Rock;Shim, Sung-Yong;Lee, Sang-Yong;Kim, Kwang-Sam;Lim, Su-Gun
    • Journal of Korea Foundry Society
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    • v.29 no.3
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    • pp.144-149
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    • 2009
  • In this study, we investigated optimum condition of cooling plate method to obtain semi-solid AM100A Mg alloy with fine and globular morphology. AM100A Mg alloy were hot extruded at $380^{\circ}C$ extrusion temperature under extrusion ratio of 25 : 1 and ram speed of 2.4 mm/sec. Vickers hardness test, optical microscopy, scanning electron microscopy, and image analyzer were performed to identify the optimum conditions of cooling plate method. Optimum conditions of cooling plate method to fabricate semi-solid AM100A Mg alloy with fine and globular microstructures were achieved at a pouring temperature of $602^{\circ}C$ and the angle of cooling plate of 60 degree.

NUMERICAL SIMULATION OF THERMAL CONTROL OF A HOT PLATE FOR THERMAL NANOIMPRINT LITHOGRAPHY MACHINES (고온 나노임프린트 장비용 핫플레이트의 열제어에 대한 수치모사)

  • Park, G.J.;Kwak, H.S.;Shin, D.W.;Lee, J.J.
    • 한국전산유체공학회:학술대회논문집
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    • 2007.04a
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    • pp.153-158
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    • 2007
  • Since the introduction of Nanoimprint in the mid-1990s, Nanoimprint lithography, a low-cost, non-convential method, has been the dominant lithography technology that guarantees high-throughput patterning of nanostructures. Based on the mechanical embossing mechanism, Nanoimprint lithography creates the nanopatterns on the polymer material cast on the substrate. In essence, the process needs nanofabrication equipment for printing with the adequate control of temperature, pressure and control of parallels of the stamp and substrate. This article introduce the possibility and reality of the thermal control on the hot plate using a CFD code. Numerical computation has been conducted for assessing the feasibility of a hot plate($120{\times}120\;mm2$). PID control is adopted to ensure high temperature uniformity in several zones. Parallel experiments have also been performed for verifying thermal performance. Not only show the results the optimum number of thermocouples related to controllers but also suggest that the thermal simulation using a CFD code would be an alternative method to design and develop the thermal control equipment in the financial aspect.

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Effect of Contact Conductance and Semitransparent Radiation on Heat Transfer During CVD Process of Semiconductor Wafer (접촉전도와 반투명 복사가 반도체 웨이퍼의 CVD 공정 중 열전달에 미치는 영향)

  • Yoon, Yong-Seok;Hong, Hye-Jung;Song, Myung-Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.32 no.2
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    • pp.149-157
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    • 2008
  • During CVD process of semiconductor wafer fabrication, maintaining the uniformity of temperature distribution at wafer top surface is one of the key factors affecting the quality of final products. Effect of contact conductance between wafer and hot plate on predicted temperature of wafer was investigated. The validity of opaque wafer assumption was also examined by comparing the predicted results with Discrete Ordinate solutions accounting for semitransparent radiative characteristics of silicon. As the contact conductance increases predicted wafer temperature increases and the differences between maximum and minimum temperatures within wafer and between wafer and hot plate top surface temperatures decrease. The opaque assumption always overpredicted the wafer temperature compared to semitransparent calculation. The influences of surrounding reactor inner wall temperature and hot plate configuration are then discussed.

Analysis on Hot Plate Welding of Thermoplastic Elastomer Packing (열가소성 엘라스토머 패킹의 열융착 해석)

  • Kim, Min Ho;Lee, Yong Tae;Chung, Jae Dong
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.28 no.12
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    • pp.477-482
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    • 2016
  • Airtight containers have been widely used in many industries and household. They need a packing for sealing between the inside and outside. Previous packing materials have some drawbacks like stench, stickiness, and difficulty of applying to automated manufacturing systems. So, a new packing material which is harmless and suitable for automation is needed. This study performed a hot plate welding process of thermoplastic elastomer (TPE) as the packing material. The hot plate welding process included a phase change process of solidification and melting. The porosity-enthalpy method was adopted in order to simulate phase change problems. The TPE showed non-Newtonian fluid characteristics during the melting process. Since properties of SEBS are not well-defined, we established TPE properties by observing the melting behavior of TPE. In order to find an optimized condition, a parametric study including packing thickness, shapes, hot plate temperature, and thermal resistance, was conducted.

Development of Thermal Performance Tester for Non-Homogeneous Insulation Pannels Installed Vertically (수직으로 설치된 비균질 평판 단열재용 성능시험장치 개발)

  • Oh, Hong Young;Song, Ki O;Jeon, Hyun Ik;Cho, Sun Young
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.28 no.4
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    • pp.153-157
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    • 2016
  • In case of metal insulation, which is produced by stacking stainless steel sheets and air layers in a multi-stack manner at a specific thickness, insulation performance will be evaluated based on thermal transmittance rather than the intrinsic physical properties of each material such as thermal conductivity. However, there is no standard for measuring thermal transmittance targeted for non-homogeneous insulation which is used in relatively high temperature conditions such as a power station. In this study, the thermal conductivity of homogeneous insulation acquired by the standardized guard hot plate method and the thermal conductivity of homogeneous insulation measured by the newly developed performance tester were compared to verify the confidence level of the tester. As a result, thermal conductivity acquired by the newly developed thermal transmittance tester was about 6% higher than the thermal conductivity measured by the existing guard hot plate method under the anticipated service temperature conditions.