• Journal of Technologic Dentistry
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• v.23 no.1
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• pp.107-114
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• 2001

R.P.D fabrication can be made if the skills already is properly used in the manufacturing press. You may feel extremely comfortable to wear it. The material used has high elasticity that it can endure the hole process of Acetal Wax pattern casting without any deformation moreover its adaptability is not bad. Because of the poor financial condition of patterns and health insurance, Acetal R.P.D Framework can be one of the best alternatives used for setting clasp partial denture cheaply. R.P.D Framework is aesthetically excellent. The color caused by saliva is so similar to that of the rest of teeth that even dentists as well as patients can not recognize clasp arm. Clasp also helps to secure prosthesis ideally without damaging teeth due to its deep position downward. Since dentists and patients have a good reaction to clasp so far, we are encouraged to apply it to other technical fields.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.784-786
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• 2009

Thermal transfer of emitting layer from the donor film to the substrates depends on the physical interaction between the donor film, the emitting layer, and the hole-transport layer (HTL). The interfacial adhesion between the donor film and the EML, the cohesive force of the EML, and the interfacial adhesion between the EML and the HIL have to be optimized to achieve good LITI pattern quality. It was found that surface pretreatment of the donor plate was important on the laser induced thermal transfer of the emitting layer onto the HIL layer of the OLED devices.

• KIEE International Transactions on Electrophysics and Applications
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• v.3C no.6
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• pp.224-229
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• 2003

An ultra high frequency (UHF) coupler possessing ultra wide band (UWB) characteristics ranging from hundreds of MHz to several GHz is desirable for the detection of the partial discharge (PD) pulses because the pulses propagate with rise time shorter than one nanosecond in a gas-insulated substation (GIS). Thus, the authors have proposed a log-periodic antenna for GIS PD detection. Various parameters of the coupler such as frequency bandwidth, coupler gain, radiation pattern, and coupler geometry were considered throughout the simulations. The experiments for the detection characteristics of the coupler were carried out in the mock-up GIS chamber. The results indicated that the detection characteristics of the coupler are dependent on the installation angle of the coupler, the position of the coupler in the hand hole and the existence of the spacer.

• Journal of ILASS-Korea
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• v.9 no.4
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• pp.77-82
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• 2004

This paper describes the improvement of engine cooling system. To improve engine cooling performance, the authors approached in two ways. One is to increase water pump performance, changing of impeller shape and lightening of material were carried out. The second one is cooling efficiency rise, which were investigated with head gasket coolant flow passage optimization with flow visualization technique. The test results show that water pump performance was increased effectively, reduction of pump drive torque, and increase of pump flow-rate and pressure rise. Gasket hole pattern optimization test results represent an optimized head coolant flow which stands cross flow from exhaust to intake port side and small vortex were removed.

• Journal of the Optical Society of Korea
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• v.6 no.3
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• pp.83-86
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• 2002

Nanoscopic emission from periodic nano-hole arrays in thick metal films is studied experimentally. The experiments give direct evidence for SP excitations in such structures. We show that the symmetry of the emission is governed by polarization and its shape is defined the interference of SP waves of different diffraction orders. Near-Held pattern analysis combined with the far-Held reflection and transmission measurements suggests that the SP eigenmodes of these arrays may be understood as those of ionic plasmon molecules.

• 기계와재료
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• v.22 no.1
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• pp.22-29
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• 2010

최근 휴대폰 등 모방일 전자기기 산업에서 차세대 고부가 PCB(MLB, HDI, FPC, 등) 및 고기능 PCB(COF, MOF, SOF)의 급속한 적용 확대로 직경$20{\mu}m$급의 비아홀(viahole) 및 interconnection 홀 가공을 위한 초정밀/초고속 레이저 드릴링 공정 및 장비기술 개발에 대한 시장의 요구가 급증하고 있다. 이에 반해 기존의 CO2 레이저 드릴링은 기술적 한계에 도달하여 시장의 요구에 대응이 불가하며, 선진업체에서는 최근 UV 레이저 드릴링 장비에 대한 시장 점유율을 높여가고 있다. 특히 국내시장은 미국의 ESI사가 독점하고 있어 기술개발 투자를 통한 국산화가 절실한 상황이다. 이에 당사에서는 초고속/초정밀 UV laser 시스템을 이용한 FPC iva hole drilling을 연구과제로 개발을 진행하고 있으며 국산화를 넘어서 세계시장점유를 목표로 공정장비개발을 진행중이다.

• Proceedings of the KIEE Conference
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• 1996.11a
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• pp.471-474
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• 1996

The effects of injection angles between $0^{\circ}$ and $9^{\circ}$, mainstream turbulent intensities between 0.36 percent and 9.3 percent and embedded longitudinal vortices on jets issuing from a single film cooling hole and from a row of inclined holes are investigated. The heat transfer coefficients around film cooling holes are affected greatly by the compound injection angles. The injected jets affected weakly by the freestream turbulence at low level. However, the heat transfer coefficients near the film cooling holes have higher values at a high turbulence intensity. The vortices generated from a delta winglet change the injected jet direction and the kidney-type vortex pattern.

• Journal of Electrical Engineering and Technology
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• v.9 no.3
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• pp.1016-1022
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• 2014

Kinect is a motion sensing camera released by Microsoft in November 2010 for the Xbox360 that is used to produce depth and color images. Because Kinect uses an infrared pattern, it generates holes and noises around an object's boundaries in the obtained images. The flickering phenomenon and unmatched edges also occur. In this paper, we propose a real time virtual-view video synthesis algorithm which results in a high quality virtual view by solving these problems stated above. The experimental results show that the proposed algorithm performs much better than the conventional algorithms.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.93-94
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• 2005

Cu metallization using electrochemical plating(ECP) has played an important role in back end of line(BEOL) interconnect formation. In this work, we studied the optimized copper thickness using Bottom-up Gap-fill in Cu ECP, which is closely related with the pattern dependencies in Cu ECP and Cu dual damascene process at 0.13 ${\mu}m$ technology node. In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge, Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.14-15
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• 2006

Application of the parallel Build-up is increasing continuously. This report presents about the PCB Build-up technology since 2000. Among the parallel build-up technologies, PALAP application - after making the via, filling the via with electric conductive paste, then expose to make wiring pattern and put them by layer without any glue or middle - is actively developing, especially DENSO company.