• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.23.2-23.2
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• 2009

Atomic layer deposition (ALD)have been proven to be a very attractive technique for the fabrication of advanced gate dielectrics and DRAM insulators due to excellent conformality and precise control of film thickness and composition, However, one major disadvantages of ALD is its relatively low deposition rate (throughput) because the deposition rate is typically limited by the time required for purging process between the introduction of precursors. In order to improve its throughput, many efforts have been made by commercial companies, for example,the modification reactor and development of precursors. However, any promising solution has not reported to date. We developed a new concept ALD system(Lucida TM S200) with high-throughput. In this process, a continuous flow of ALD precursor and purging gas are simultaneously introduced from different locations in the ALD reactor. A cyclic ALD process is carried out by moving the wafer holder up and down. Therefore, the time required for ALD reaction cycle is determined by speed of the wafer holder and vapor pressure of precursors. We will present the operating principle of our system and results of deposition.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.4
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• pp.407-418
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• 2014

As the high-throughput requirement in the next generation communication system increases, it becomes essential to implement high-throughput SISO (Soft-Input Soft-Output) decoder with minimal hardware resources. In this paper, we present the comparison results between cascaded radix-4 ACS (Add-Compare-Select) and LUT (Look-Up Table)-based radix-4 ACS in terms of delay, area, and power consumption. The hardware overhead incurred from the retiming technique used for high speed radix-4 ACS operation is also analyzed. According to the various analysis results, high-throughput radix-4 SISO decoding architecture based on simple path metric recovery circuit is proposed to minimize the hardware resources. The proposed architecture is implemented in 65 nm CMOS process and memory requirement and power consumption can be reduced up to 78% and 32%, respectively, while achieving high-throughput requirement.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.4
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• pp.419-426
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• 2014

This paper proposes a high-throughput encoding process and encoder architecture for quasi-cyclic low-density parity-check codes in IEEE 802.11ac standard. In order to achieve the high throughput with low complexity, a partially parallel processing based encoding process and encoder architecture are proposed. Forward and backward accumulations are performed in one clock cycle to increase the encoding throughput. A low complexity cyclic shifter is also proposed to minimize the hardware overhead of combinational logic in the encoder architecture. In IEEE 802.11ac systems, the proposed encoder is rate compatible to support various code rates and codeword block lengths. The proposed encoder is implemented with 130-nm CMOS technology. For (1944, 1620) irregular code, 7.7 Gbps throughput is achieved at 100 MHz clock frequency. The gate count of the proposed encoder core is about 96 K.

• Journal of the Korea Safety Management & Science
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• v.15 no.1
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• pp.293-301
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• 2013

The purpose of this study is to introduce the limit of previously used six sigma quality process evaluation metrics, $Z_{st}$ and $P_{pk}$, and a solution to overcome this drawback by using a metric based on performance evaluation of Z-factor quality innovation. Case analysis on projects from national six sigma contest from 2011 to 2012 is performed and literature review on new drug development HTS (High Throughput Screening) is used to propose innovative performance evaluation metrics. This research shows that experimental study on six sigma evaluation metric, $Z_{st}$ and $P_{pk}$, have no significance difference between industrial type (Manufacturing, Semi-Public Institute, Public Institute) and CTQ type (Product Technology Type CTQ, Process Technology Type CTQ). Following discovery characterize this quality improvement as fixed target type project. As newly developed moving target type of quality innovation performance metric Z-Factor is used for evaluating experimental study, hypothetical analysis suggests that $Z_{st}$ and $P_{pk}$ share different relationship or even show reciprocal relationship. Constraints of the study are relatively small sample size of only 37 projects from past 2 years and conflict on having interview and communication with six sigma quality practitioner for qualitative experimental study. Both moving target type six sigma innovation project and fixed target type improvement project or quality circle enables efficient ways for a better understanding and quality practitioner use by applying quality innovation performance metric. Downside of fixed target type quality performance evaluation metric, $Z_{st}$ and $P_{pk}$, is presented through experimental study. In contrast, advantage of this study is that high throughput requiring product technology, process technology and quantum leap typed innovation effect is evaluated based on precision and accuracy and Z-Factor that enables relative comparison between enterprises is proposed and implemented.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.05a
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• pp.259-264
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• 2004

The hot embossing process as a method for the fabrication of polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this paper, we carried out experimental studies and numerical simulations in order to understand the viscous flow of polymer film during hot embossing process. As the initial step of quantitating the hot embossing process, simple parametric studies for the embossing conditions have been carried out using high resolution masters which patterned by DRIE process. Under different embossing times and pressures, the viscous flow of PMMA films into micro/nano cavities has been investigated. Also, the viscous flow during the hot embossing process has been simulated by the continuum based FDM analysis considering micro/nano effect, such as surface tension and contact angle.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1036-1042
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• 2003

The hot embossing process has been mentioned as one of major nanoreplication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the embossing process , simple parametric study about embossing time have been carried out using high-resolution masters which patterned by the DRIE process and laser machining. Under the various embossing time, the viscous flow of thin PMMA films into microcavities during compression force has been investigated. Also, a study about simulating the viscous flow during embossing process has planned and continuum scale FDM analysis was applied on this simulation. With currently available test data and condition, simple FDM analysis using FLOW3D was made attempt to match simulation and experiment.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.371-376
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• 2003

The hot embossing process has been mentioned as one of major nanoreplication techniques. This is due to its simple process, low cost, high replication fidelity and relatively high throughput. As the initial step of quantitating the embossing process, simple parametric study about embossing time have been carried out using high-resolution masters which patterned by the DRIE process and laser machining. Under the various embossing time, the viscous flow of thin PMMA films into microcavities during Compression force has been investigated. Also, a study about simulating the viscous flow during embossing process has planned and continuum scale FDM analysis was applied on this simulation. With currently available test data and condition, simple FDM analysis using FLOW3D was made attempt to match simulation and experiment.

• Bulletin of the Korean Chemical Society
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• v.30 no.6
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• pp.1325-1330
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• 2009

A general method has been developed for the solid phase synthesis of drug-like 7-aryl-benzo[b][1,4]oxazin-3(4H)- one derivatives 6. The method relies on a novel, microwave irradiation promoted cyclization reaction of the BOMBA resin bound, N-substituted-$\alpha$-(2-chloro-4-bromophenoxy)acetamide 3 that takes place via a Smiles rearrangement. The 7-bromobenzo[1,4]oxazine 4, produced in this process is converted to 7-aryloxazin analogs 5 by utilizing Suzuki coupling with various substituted arylboronic acids. Finally, the target 7-aryl-benzo[b][1,4]oxazin-3(4H)-ones 6 are liberated from the resin by treatment with 5% TFA. The progress of the reactions involved in this preparative route can be monitored by using ATR-FTIR spectroscopy on a single bead. The target compounds, obtained by using this five-step sequence, are produced in high yields and purities.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.3
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• pp.175-180
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• 2003

As the integrated circuit device shrinks to the deep submicron regime, the ion implantation process with high ion dose has been attracted beyond the conventional ion implantation technology. In particular, for the case of boron ion implantation with low energy and high dose, the stabilization and throughput of semiconductor chip manufacturing are decreasing because of trouble due to the machine conditions and beam turning of ion implanter system. In this paper, we focused to the improved characteristics of processing conditions of ion implantation equipment through the modified deceleration mode. Thus, our modified recipe with low energy and high ion dose can be directly apply in the semiconductor manufacturing process without any degradation of stability and throughput.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.693-694
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• 2009