• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.32 no.2
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• pp.147-150
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• 2019

There is a need for the development of transparent conductive materials that are economical and environmentally friendly with exhibit low resistivity and high transmittance in the visible spectrum. In this study, the deposition rate and uniformity of Al-doped ZnO-thin films were improved by changing the Z-motion of the sputtering system. The deposition rate and the uniformity were determined to be 3.44 nm/min and 1.23%, respectively, under the 10 mm Z-motion condition. During $O_2$ plasma treatment, the intrusion-type metal elements in the thin film were reduced, which contributed to an oxygen vacancy reduction in addition to structural stabilization. Moreover, the sheet resistance was more easily saturated.

• Journal of Bio-Environment Control
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• v.23 no.2
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• pp.131-138
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• 2014

'Hanareum' pear is expected to produce the high quality small and medium-sized fruits without any major changes in the current cultivation techniques, inasmuch as its basic characteristics are already included in the range of small and medium-sized fruits. Thus, we tested the possibility of utilization of 'Hanareum' pear for producing small and medium-sized fruits, while establishing the limit of minimum fruit weight for the fruits in high quality. With the results of correlation analysis, it was possible to predict the fruit weight through the observation of soluble solid contents and flesh firmness, because both factors were closely correlated to fruit weight in all treatments. Moreover, these factors were confirmed to be useful indicators of forecasting consumer preference in the sensory evaluation. The fruit marketability was excellent under the conditions that were greater than $11.6^{\circ}Bx$ and less than 25.6 N for soluble solid contents and flesh firmness, respectively. When applying these standards of fruit quality to the results of regression analysis for fruit weight, non-treated fruits fulfilled both standards when the fruit weight was higher than 436 g, and the quality uniformity was also high on this state. Therefore, the production of high quality small and medium-sized fruits was determined to be under this condition. The weight limit for GA treated fruits was 620 g, and both fruit quality and uniformity were below the weight range of small and medium-sized fruits, with 300~500 g. Thus, GA treatment was suggested to be avoided, in order to produce the high quality small and medium-sized fruits.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.2
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• pp.147-154
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• 2003

A three-dimensional numerical analysis of the flow and heat transfer characteristic of wood-flour-filled polypropylene melt in an extrusion die was carried out. Used for this analysis were Finite Concept Method based on FVM, unstructured grid and non-Newtonian fluid viscosity model. Temperature and flow fields are closely coupled through temperature dependent viscosity and viscous dissipation. With large Peclet, Nahme, Brinkman numbers, viscous heating caused high temperature belt near die housing. Changing taper plate thickness and examining some predefined parameters at die exit investigated the effect of taper plate on velocity and temperature uniformities. In the presence of taper plate, uniformity at die exit could be improved and there existed an optimum thickness to maximize it.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.216-219
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• 2005

In recent, LCD becomes one of the main display devices and expected to have quite good market share during the next couple of years. The demand for low cost and high performance, however, is becoming severe as the competition among other display devices like PDP, OLED increases. To satisfy this demand from market, we need to optimize the parts or modules of the LCD, reduce the number of the assemble and enhance the process for the high brightness and uniformity of the LCD. The LCD consists mainly of LCD panel and Backlight unit(BLU). BLU, which takes big portion of the cost for LCD, consists of light source, light guide panel and many kinds of functional film. Recently light guide panel or film for BLU has micro patterns on its surface and consequently to reduce the number of parts and enhace the brightness and its uniformity. In this study, some methodologies for the fabrication of the master/stamper and molding the light quide panel are introduced for 50um pitch of prizm patterned substrate. Mechanical machining process is adapted and optimized to fabricate micro patterned stamper using the micro cutting tool. Injection molding technology is also developed to obtain uniformly replicated micro patterned products.

• Current Optics and Photonics
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• v.1 no.3
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• pp.221-227
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• 2017

To apply a square-shaped beam homogenizer to laser shock peening, it should be designed with a long working distance and by considering metal targets with various shapes and textures. For long working distances, a square-shaped beam homogenizer with a long depth of focus is required. In the range of working distance, the laser beam is required to have not only high efficiency but high uniformity, in other words, a good peening quality is guaranteed. In this study, we defined this range as the working distance for laser shock peening. We have simulated the effect of some parameters on the working distance. The parameters include the focal length of the condenser lens, pitch size of the array lens, and plasma threshold of the metal. The simulation was performed through numerical analysis by considering the diffraction effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.39-42
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• 2002

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity(WIWNU) were measured as a function of different slurry composition. As a experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows In the first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saving of high costs of slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05b
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• pp.15-18
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• 2005

As a display becomes large recently, Acquisition of high luminance and Luminance uniformity is becoming difficult in the existing CCFL or EEFL backlight system. So, study for a performance enhancement has enforced. but lamp development of flat type is asked for high luminance and a luminance uniformity security in of LCD and area anger trend ultimately. In this paper, we changed a tip shape of an electrode for production by the most suitable LCD backlight surface light source, and confirmed discharge characteristic along discharge gas pressure and voltage, and confirmed electric field distribution and discharge energy characteristic through a Maxwell 2D simulation. Therefore the discharge firing voltage characteristic showed a low characteristic than a rectangular type and round type in case of electrode which used tip of a triangle type, and displayed a discharge electric current as a same voltage was low.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.05a
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• pp.82-85
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• 2006

As a display becomes large recently, Acquisition of high luminance and Luminance uniformity is becoming difficult in the existing CCFL or EEFL backlight system. So, study for a performance enhancement has enforced. but lamp development of flat type is asked for high luminance and a luminance uniformity security in of LCD and area anger trend ultimately. In this paper, we changed a tip shape of an electrode for production by the most suitable LCD backlight surface light source, and confirmed discharge characteristic along discharge gas pressure and voltage, and confirmed electric field distribution and discharge energy characteristic through a Maxwell 2D simulation. Therefore the discharge firing voltage characteristic showed a low characteristic than a rectangular type and round type in case of electrode which used tip of a triangle type, and displayed a discharge electric current as a same voltage was low.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.27 no.2
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• pp.104-109
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• 2014

To operate organic light emitting device (OLED) with alternating current (AC) power source without AC/DC(direct current) converter, we fabricated the fluorescent OLED and measured the emission characteristics with AC and DC. The OLED operated by AC showed higher maximum current efficiency of 8.2 cd/A and maximum power efficiency of 8.3 lm/W. But current efficiency and power efficiency of AC driven OLED showed worse than DC driven OLED at high voltage above 10 V. This result can be explained by the peak voltage of AC was $\sqrt{2}$ times than DC, In case of low driving voltage the emission characteristics were improved by the peak voltage of AC, but in case of high driving voltage the emission efficiencies were decreased by the roll off phenomena. Finally, serial OLED arrays using twelve OLEDs driven by AC 110 V showed average voltage of 9.17 V, voltage uniformity of 99.0%, average luminance of $1,175cd/m^2$, luminance uniformity of 94.4%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.9
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• pp.759-764
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• 2003

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of roused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity (WIWNU) wore measured as a function of different slurry composition. As an experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt％ contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows , In tile first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saying of high costs of slurry.