• Title/Summary/Keyword: high uniformity

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A Study on the Heat Transfer Characteristics and Performance of the High Temperature Range Heater Plate Using Liquid-Vapor Phase Change Heat Transfer (기-액 상변화 열전달식 고온 히터 플레이트의 작동 특성과 성능에 관한 연구)

  • Kang, Hwan-Kook;Yim, Kwang-Bin
    • Journal of Surface Science and Engineering
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    • v.46 no.6
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    • pp.283-289
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    • 2013
  • The experimental study for the temperature uniformity on the wafer using liquid-vapor phase heat transfer mechanism is performed. For the experiment, the heater plate which is consist of stainless steel container, working fluid and electrical heater is designed, manufactured and tested at the range of 600 to $850^{\circ}C$. The results showed that the phase change type heater plate was much more uniform and stable temperature on the heater plate surface and wafer than the uniform heat flux type heater plate at the atmospheric condition. Also, the results of 300 mm outer diameter of heater plate showed that the same temperature uniformity compared with 230 mm.

Development of photoresist ashing process in an ICP with periodic axial magnetic field (주기적인 축방향 자기장을 추가한 유도결합형 플라즈마 장치에서의 감광제 제거공정 개발)

  • 송호영;라상호;박세근;오범환
    • Proceedings of the IEEK Conference
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    • 2000.06b
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    • pp.290-293
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    • 2000
  • Low frequency(<100Hz) weak magnetic field(<20gauss) is applied axially to an inductively coupled oxygen plasma(ICP), and its plasma characteristics are monitored by OES(Optical Emission Spectroscopy) and Langmuir probe. It is found that periodic magnetic field enhances ashing rate by 25% and improves its uniformity upto 4.5% over 8" wafer. From electron energy distribution function, both low and high energy electrons are identified and relative abundancy is found to be controlled by the applied frequency. Moreover, it is observed that ionization and dissociation species are varied with applied frequency. We insert an aluminium baffle in the chamber to get better uniformity and less plasma damage.

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Enhancement of the Thickness Uniformity of a Phosphor Layer in the Cold Cathode Fluorescent Lamp

  • Kim, Min-Wan;Kim, Hie-Chul;Kim, Suk-Hwan;Lee, Sang-Woo;Choi, Byung-Ho;Kim, Kyung-Hwan;Sohn, Woo-Keun
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.1068-1071
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    • 2004
  • We report the techniques to obtain the high uniformity of the phosphor film thickness in the cold cathode fluorescent lamps, which are widely used as a back-light for the liquid crystal display. The thickness variation of the phosphor layer was sensitive to blowing conditions. The optimum conditions were obtained at flow rate of 15 sccm for 30 min at 40 $^{\circ}C$. The optimum and uniform thickness of a phosphor layer gives good luminous output.

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LCD backlighting system with high luminance and good uniformity (LCD backlight unit의 고분자 산란형 도광판에 관한 연구)

  • Jung, Il-Yong;Park, Woo-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.04a
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    • pp.173-176
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    • 2000
  • we analyzed multiple ray tracing in the highly scattering optical transmission(HSOT) polymer plate by means of the Monte carlo simulation. Light transmission behavior in the light guide was simulated by a 3-dimensional ray tracing program considering scattering angle given by the Mie theory and mean free path. To improve the uniformity of the conventional HSOT backlight unit, We employed additionally dot patterns. For the proposed structure, we calculated the light transmission behavior and obtained a bright and uniform backlight unit for a large size LCD panel of more than 12 inch.

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Formation of Fine Pitch Solder Bump with High Uniformity by the Tilted Electrode Ring (경사진 전극링을 이용한 고균일도의 미세 솔더범프 형성)

  • Ju, Chul-Won;Lee, Kyung-Ho;Min, Byoung-Gue;Kim, Seong-Il;Lee, Jong-Min;Kang, Young-il
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.9
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    • pp.798-802
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    • 2005
  • The plating shape in the opening of photoresist becomes gradated shape in the fountain plating system, because bubbles from the wafer surface are difficult to escape from the deep openings, vias. In this paper, the bubble flow from the wafer surface during plating process was studied and we designed the tilted electrode ring to get uniform bump height on all over the wafer and evaluated the film uniformity by SEM and $\alpha-step$. In a-step measurement, film uniformities in the fountain plating system and the tilted electrode ring contact system were $\pm16.6\%,\;\pm4\%$ respectively.

Environmentally-Sustainable Single End Slashing

  • Ok, Hyun-Young;Park, Heung-Sup;Carr, Wallace;Park, Soo-Min
    • Proceedings of the Polymer Society of Korea Conference
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    • 2006.10a
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    • pp.376-376
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    • 2006
  • The process of weaving fabrics with high levels of tension and abrasion can cause damage to the yarn threads. To protect threadlines during the process, a protective polymer is coated on the surface of the yarns prior to weaving. This application process is known as slashing. The current slashing system is incompatible with today's demand activated manufacturing strategies. Methods of improving the uniformity of polymer coating application were studied, and several applicators were designed and evaluated. Prewetting of the threadlines before coating application was shown to greatly improve coating uniformity. The objective of the research is to design a single-end slashing process that is environmentally friendly and will improve productivity and flexibility.

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(100) Textured Si Films with Controlled Microstructures Obtained via Hybrid SLS

  • Wilt, P.C. Van Der;Chitu, A.M.;Turk, B.A.;Chung, U.J.;Limanov, A.B.;Im, James S.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.768-771
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    • 2006
  • Uniformity and performance characteristics of LTPS TFTs are important parameters for making advanced active-matrix displays. In this paper, we describe an SLS-based crystallization approach for producing orientation-controlled Si films with reduced concentrations of planar defects that stand to potentially deliver unprecedented levels of device uniformity and performance. Specifically, a 2-step process referred to as hybrid SLS has been developed that produces a variety of high-quality {100} surface-oriented Si films.

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Driving Method of Direct Type Multi-Lamp Backlight with High Uniformity (고균일도 직하형 백라이트 구동방법)

  • Chun, Young-Tea;Lim, Sung-Kyoo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.05a
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    • pp.123-127
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    • 2004
  • Cold cathode fluorescent lamp (CCFL) has been used as a light source for direct type backlights for LCD monitors or TV. One inverter for one CCFL was necessary for maintaining the lamp current so that many inverters were used to drive as many CCFLs of direct type backlight for LCD TV. An inverter for driving 16 CCFLs was developed to reduce the backlight cost. The length and diameter of CCFL were 450mm and 4mm, respectively. Backlight including 16 CCFLs for 26" LCD TV was assembled by using one inverter. The uniformities of the assembled backlight operated by the conventional inverter and the newly developed inverter were 75% and 88%, respectively.

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The Third National Congress on Fluids Engineering: Thermal design for the vertical type oven of soldering process. (반도체 공정용 수직로 설계를 위한 열유동 제어.)

  • Jeong, Won-Jung;Kwon, Hyun-Goo;Cho, Hyung-Hee
    • 유체기계공업학회:학술대회논문집
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    • 2006.08a
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    • pp.561-564
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    • 2006
  • Because of new requirements related to the employment of SMT(Surface Mounting Technology) manufacturing and the diversity of components on high density PCB(printed circuit boards), Thermal control of the reflow process is required in oder to achieve acceptable yields and reliability of SMT assemblies. Accurate control of the temperature distribution during the reflow process is one of the major requirements, especially in lead-free assembly. This study has been performed for reflow process using the commercial CFD tool(Fluent) for predicting flow and temperature distributions. There was flow recirculation region that had a weak point in the temperature uniformity. Porous plate was installed to prevent and minimize flow recirculation region for acquiring uniform temperature in oven. This paper provided design concept from CFD results of the steady state temperature distribution and flow field inside a reflow oven.

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Optimization of inlet velocity profile for uniform epitaxial growth (균일한 에피층 성장을 위한 입구 유속분포 최적화)

  • Cho W. K.;Choi D. H.;Kim M.-U.
    • 한국전산유체공학회:학술대회논문집
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    • 1998.11a
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    • pp.121-126
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    • 1998
  • A numerical optimization procedure is developed to find the inlet velocity profile that yields the most uniform epitaxial layer in a vertical MOCVD reactor. It involves the solution of fully elliptic equations of motion, temperature, and concentration; the finite volume method based on SIMPLE algorithm has been adopted to solve the Navier-Stokes equations. The overall optimization process is highly nonlinear and has been efficiently treated by the sequential linear programming technique that breaks the non-linear problem into a series of linear ones. The optimal profile approximated by a 6th-degree Chebyshev polynomial is very successful in reducing the spatial non-uniformity of the growth rate. The optimization is particularly effective to the high Reynolds number flow. It is also found that a properly constructed inlet velocity profile can suppress the buoyancy driven secondary flow and improve the growth-rate uniformity.

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