• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.543-543
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• 2013

Thin-film transistors (TFTs) based on oxide semiconductors have been regarded as promising alternatives for conventional amorphous and polycrystalline silicon TFTs. Oxide TFTs have several advantages, such as low temperature processing, transparency and high field-effect mobility. Lots of oxide semiconductors for example ZnO, SnO2, In2O3, InZnO, ZnSnO, and InGaZnO etc. have been researched. Particularly, zinc-tin oxide (ZTO) is suitable for channel layer of oxide TFTs having a high mobility that Sn in ZTO can improve the carrier transport by overlapping orbital. However, some issues related to the ZTO TFT electrical performance still remain to be resolved, such as obtaining good electrical contact between source/drain (S/D) electrodes and active channel layer. In this study, the bottom-gate type ZTO TFTs with staggered structure were prepared. Thin films of ZTO (40 nm thick) were deposited by DC magnetron sputtering and performed at room temperature in an Ar atmosphere with an oxygen partial pressure of 10%. After annealing the thin films of ZTO at $400^{\circ}C$ or an hour, Cu, Mo, ITO and Ti electrodes were used for the S/D electrodes. Cu, Mo, ITO and Ti (200 nm thick) were also deposited by DC magnetron sputtering at room temperature. The channel layer and S/D electrodes were defined using a lift-off process which resulted in a fixed width W of 100 ${\mu}m$ and channel length L varied from 10 to 50 ${\mu}m$. The TFT source/drain series resistance, the intrinsic mobility (${\mu}i$), and intrinsic threshold voltage (Vi) were extracted by transmission line method (TLM) using a series of TFTs with different channel lengths. And the performances of ZTO TFTs were measured by using HP 4145B semiconductor analyzer. The results showed that the Cu S/D electrodes had a high intrinsic field effect mobility and a low effective contact resistance compared to other electrodes such as Mo, ITO and Ti.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• KIEAE Journal
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• v.16 no.3
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• pp.121-128
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• 2016

Purpose: The vacuum glazing should constantly retain the gap in vacuum state to maintain high thermal performance. To do so, pillars are used to prevent the glazing from clinging to each other by the atmospheric pressure and therefore surface of the vacuum glazing is consistently affected by residual stress. The vacuum glazing could be applied to curtain wall systems at spandrel area to fulfill a rigorous domestic standard on U-value of the external wall. However, this can lead to high glazing temperature increase by heat concentration at a back panel and finally thermal stress breakage. This study experimentally determined weakness of the vacuum glazing systems on the thermal stress breakage and investigated effect of the residual stress. Method: The experiment first built two scale-down mock-up facilities that replicate the spandrel area in curtain wall, and then installed single low-e glass and vacuum glazing respectively. The two mock-up facilities were exposed to outside to induce the thermal stress breakage. Result: The experiment showed that the temperature occurred the thermal stress breakage was $114.4^{\circ}C$ for the single low-e glass and $118.9^{\circ}C$ for the vacuum glazing respectively. The result also showed the vacuum glazing reached the critical point earlier than the single low-e glass, which means that the vacuum glazing has high potential to occur the thermal shock breakage. In addition, the small temperature difference between two glazing indicates that the residual stress scarcely affects breakage of the vacuum glazing.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.3
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• pp.138-145
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• 2012

The material used in this study is dielectric and ferrite. Because of the unique characteristics of the material, it is easily exposed to external shocks and pressure, which cause damage to the product. However, after being processed under high-temperature environment repeatedly, the mechanical strength of the product is greatly increased due to the change of the electrical properties. In this paper, dielectric and bonded ferrite material was tested for the material properties. The equipment for this experiment was produced and tested to allow Cylindrical and Three-dimensional geometry of the product for the vacuum deposition. For Cylindrical shape of the product, in order to obtain the equivalent film thickness, the device is constructed in a vacuum chamber which gives arbitrary revolving and rotating capability. The electrical performance of the product is obtained through this process as well. However, as mentioned above, with repeating processes under high temperature and exposure to external environment, the product is easy to be broken. This experiment has enabled us to find out a stable condition to apply the communication of the RF high frequency to each of the core elements, such as Ferrite and Dielectric which is then used for the mechanical strength of the Raw material, hetero-junction material, Hetero-junction Ag Coating material and hetero-junction Ag Coating SiO2 Coating material respectively.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.4
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• pp.447-452
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• 2011

It is well known that the dominant damage mechanisms in high-temperature steam turbine facilities such as rotor and casing are creep and fatigue damages. Even though coupling of creep and fatigue should be considered while predicting the life of turbine facilities, the remaining life of large steam turbine facilities is generally determined on the basis of creep damage because the turbines must generate stable base-load power and because they are operated at a high temperature and pressure for a long time. Almost every large steam turbine in Korea has been operated for more than 20 years and is made of steel containing various amounts of principal alloying elements nickel, chromium, molybdenum, and vanadium. In this study, creep damage model of 1Cr1Mo1/4V steel for turbine rotor is proposed and that can assess the high temperature creep life of large steam turbine facilities is proposed.

• Korean Journal of Materials Research
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• v.8 no.11
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• pp.987-992
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• 1998

Titanium aluminide intermetallic compound was formed from high purity elemental Ti and A1 foils by selfpropagating, high-temperature synthesis(SHS1 in hot press. Formation of $TiAl_3$ intermetallics at the interface between Ti and Al foil was observed to be controlled by temperature, pressure and heating rate. Especially, the heating rate is the most important role to form intermetallic compound by SHS reaction. According to DTA experiment, the SHS reactions appeared at two different temperatures below and above the melting point of Al. It was also observed that both SHS reaction temperatures increased with increasing the heating rate. After the SHS reaction of alternatively layered 10 Ti and 9 A1 foils at the heating rate of $20^{\circ}C$/min, the $700\mu\textrm{m}$ thick titanium aluminide sheet was formed by heat treatment at $810^{\circ}C$ for 4hours.

• Journal of Surface Science and Engineering
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• v.47 no.3
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• pp.109-115
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• 2014

High power impulse magnetron sputtering (HIPIMS), also known as the technology is called peak power density in a short period, you can get high, so high ionization sputtering rate can make. Higher ionization of sputtered species to a variety of coating materials conventional in the field of improving the characteristics and self-assisted ion thin film deposition process, which contributes to a superior being. HIPIMS at the same power, but the deposition speed is slow in comparison with DC disadvantages. Since recently as a replacement for HIPIMS modulated pulse power (MPP) has been developed. This ionization rate of the sputtered species can increase the deposition rate is lowered and at the same time to overcome the problems to be reported. The differences between the MPP and the HIPIMS is a simple single pulse with a HIPIMS whereas, MPP is 3 ms in pulse length is adjustable, with the full set of multi-pulses within the pulse period and the pulse is applied can be micro advantages. In this experiment, $In_2O_3$ : $SnO_2$ composition ratio of 9 : 1 wt% target was used, Ar : $O_2$ flow rate ratio is 4.8 to 13.0% of the rate of deposition was carried out at room temperature. Ar 40 sccm and the flow rate of $O_2$ and then fixed 2 ~ 6 sccm was compared against that. The thickness of the thin film deposition is fixed at 60 nm, when the partial pressure of oxygen at 9.1%, the specific resistance value of $4.565{\times}10^{-4}{\Omega}cm$, transmittance 86.6%, mobility $32.29cm^2/Vs$ to obtain the value.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.47 no.9
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• pp.629-641
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• 2019

In order to limit the temperature rise of the structure to a certain level or less while maintaining the aerodynamic shape of solid rocket nozzle by effectively blocking a large amount of heat introduced by the combustion gas of high temperature and high pressure, the heat-resistant materials such as C/C composite having excellent ablation resistance are applied to a position in contact with the combustion gas, and the heat-insulating materials having a low thermal diffusivity are applied to the backside thereof. SiC/SiC composite, which has excellent oxidation resistance, is applied to gas turbine engines and contributes to increase engine performance due to light weight and heat-resistant improvement. Scramjet, flying at hypersonic speed, has been studying the development of C/SiC structures using the endothermic fuel as a coolant because the intake air temperature is very high. In this paper, characteristics, application examples, and development trends of various heat-resistant composites used in solid rocket nozzles, gas turbine engines, and ramjet/scramjet propulsions were discussed.

• Nuclear Engineering and Technology
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• v.51 no.1
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• pp.238-248
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• 2019

In the high-temperature and high-pressure irradiation environments, the multi-field coupling processes of hydrogen diffusion, hydride precipitation and mechanical deformation in Zircaloy cladding tubes occur. To simulate this hydrogen-induced complex behavior, a multi-field coupling method is developed, with the irradiation hardening effects and hydride-precipitation-induced expansion and hardening effects involved in the mechanical constitutive relation. The out-pile tests for a cracked cladding tube after irradiation are simulated, and the numerical results of the multi-fields at different temperatures are obtained and analyzed. The results indicate that: (1) the hydrostatic stress gradient is the fundamental factor to activate the hydrogen-induced multi-field coupling behavior excluding the temperature gradient; (2) in the local crack-tip region, hydrides will precipitate faster at the considered higher temperatures, which can be fundamentally attributed to the sensitivity of TSSP and hydrogen diffusion coefficient to temperature. The mechanism is partly explained for the enlarged velocity values of delayed hydride cracking (DHC) at high temperatures before crack arrest. This work lays a foundation for the future research on DHC.

• Journal of Hydrogen and New Energy
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• v.33 no.1
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• pp.47-54
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• 2022

In this study, we performed numerical analysis for 1 kWe SOFC stack of internal manifold types according to the different manifold sizes to verify the influence of the flow uniformity into each cell. To simulate the flow phenomena in the stack, the continuity and momentum conservation equations including the standard k-𝜺 turbulent model for the steady-state conditions were applied. From the calculation results, we verified that the pressure drop from inlet pipes to outlet pipes decreased to a log scale as the manifold size increased in the internal manifold types. Also, we found that the flow uniformity increased on an exponential scale as the manifold size increased. In addition, the calculation results showed that the flow uniformity gradually improved as the fuel and oxygen utilization increased.