• 제목/요약/키워드: high scan speed

검색결과 179건 처리시간 0.036초

레이저 클래딩 공정 조건이 코발트 합금-텅스텐 카바이드 혼합 코팅층의 균열 발생에 미치는 영향 (Cracking Susceptibility of Laser Cladding Process with Co-Based Metal Matrix Composite Powders)

  • 이창민;박형권;이창희
    • Journal of Welding and Joining
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    • 제32권6호
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    • pp.41-46
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    • 2014
  • In this study, cracking susceptibility of laser cladding was investigated according to the processing parameters such as laser power, scan speed and feeding rate with blended powders of stellite#6 and technolase40s (WC+NiCr). The solidification microstructure of clad was composed of Co-based dendrite structures with ${\gamma}+Cr7C3$ eutectic phases at the dendritic boundaries. The crack propagation showed transgranular fracture along dendritic boundaries due to brittle chrome carbide at the eutectic phases. From results of fractography experiments, the fracture surface was typical cleavage brittle fracture in the clad and substrate. The number of clad cracks, caused by a tensile stress after the solidification, increased with increase of laser power, scan speed and feeding rate. Increase of the laser power caused large pores by facilitating WC decarburizing reaction. And the pores affected increase of crack susceptibility. High scan speed caused increment of clad cracks due to thermal stress and WC particle fractures. Also, increase of the feeding rate accompanied an amount of WC particles causing crack initiation and decarburizing reaction.

A High-Speed Single Crystal Silicon AFM Probe Integrated with PZT Actuator for High-Speed Imaging Applications

  • Cho, Il-Joo;Yun, Kwang-Seok;Nam, Hyo-Jin
    • Journal of Electrical Engineering and Technology
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    • 제6권1호
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    • pp.119-122
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    • 2011
  • A new high speed AFM probe has been proposed and fabricated. The probe is integrated with PZT actuated cantilever realized in bulk silicon wafer using heavily boron doped silicon as an etch stop layer. The cantilever thickness can be accurately controlled by the boron diffusion process. Thick SCS cantilever and integrated PZT actuator make it possible to be operated at high speed for fast imaging. The resonant frequency of the fabricated probe is 92.9 kHz and the maximum deflection is 5.3 ${\mu}m$ at 3 V. The fabricated probe successfully measured the surface of standard sample in an AFM system at the scan speed of 600${\mu}m$/sec.

라인스캔 카메라를 이용한 3차원 정밀 측정 (3D Precision Measurement of Scanning Moire Using Line Scan Camera)

  • 김현주;윤두현;김학일
    • 한국광학회지
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    • 제19권5호
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    • pp.376-380
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    • 2008
  • 본 논문에서는 라인스캔 카메라를 통해 모든 영역의 영상을 획득하는 연구를 제안한다. 이 방법은 기존의 면적 카메라를 이용했던 방법에 비해 투영격자의 이동 횟수를 획기적으로 줄일 수 있으며, 그로 인해 측정시간이 매우 빠르고 측정정밀도도 뛰어난 장점을 가진다. 본 논문의 스캐닝 모아레 측정 방법은 넓은 영역의 3차원 형상 정보를 얻는데 매우 유익하며, 대면적의 대상물 측정 시 일반적으로 사용하는 stitching 기법을 사용할 필요가 없으므로 한번에 전 영역의 3차원 형상의 복원이 가능하여 보다 빠른 속도로 3차원 형상 정보를 얻을 수 있는 효과가 있다. 또한, 투영격자 하나만을 이용한 영사식 모아레 방식을 이용하여 작은 높이 단차를 갖는 물체의 3차원 형상을 복원하고 그 높이를 용이하게 측정 할 수 있다. 본 연구는 양산환경(Mass production)의 웨이퍼 범프 높이 검사 및 FC-CSP나 FC-BGA 범프 높이 검사 등에 활용 할 수 있으며, 실험을 통해 기존의 방법에 비해 투영격자의 이동횟수 및 측정 속도가 향상되었음을 확인하였다.

AC PDP에서 고속 어드레싱을 위한 네거티브 리셋 파형 및 구동회로의 구현 (Implementation of the Negative Reset Waveform and Driving Circuit for High Speed Addressing in AC PDP)

  • 임현묵;임승범;이준영;강정원;홍순찬
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2007년도 추계학술대회 논문집
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    • pp.215-217
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    • 2007
  • Recently, the demand for high definition TV is being increased by beginning of the digital broadcasting. The higher resolution of PDP is, the longer addressing time become, then, the sustain period for display image decreases. Because of the reason, dual-scan method which synchronously write information of an image on top and bottom of the screen is used for the high definition PDP. However, as the price competition of PDP becomes severe, we can`t avoid turning to a single-scan method which uses only a half of an expensive address IC. Accordingly, the sustain period becomes much shorter than prior method. In case of XGA level, it is impossible to display, eventually. In this paper, we are going to prove usefulness by realizing negative reset waveform and the driving circuit for high speed addressing.

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고속 3차원 측정 및 칼라 이미징을 위한 다중 광탐침 공초점 주사 현미경 (Confocal Scanning Microscopy with Multiple Optical Probes for High Speed 3D Measurements and Color Imaging)

  • 천완희;이승우;안진우;권대갑
    • 반도체디스플레이기술학회지
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    • 제7권1호
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    • pp.11-16
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    • 2008
  • Confocal scanning microscopy is a widely used technique for three dimensional measurements because it is characterized by high resolution, high SNR and depth discrimination. Generally an image is generated by moving one optical probe that satisfies the confocal condition on the specimen. Measurement speed is limited by movement speed of the optical probe; scanning speed. To improve measurement speed we increase the number of optical probes. Specimen region to scan is divided by optical probes. Multi-point information each optical probe points to can be obtained simultaneously. Therefore image acquisition speed is increased in proportion to the number of optical probes. And multiple optical probes from red, green and blue laser sources can be used for color imaging and image quality, i.e., contrast, is improved by adding color information by this way. To conclude, this technique contributes to the improvement of measurement speed and image quality.

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스캐너를 이용한 고속 펨토초 레이저 가공 기술 (High-Speed Femtosecond Laser Micromachining with a Scanner)

  • 손익부;최성철;노영철;고도경;이종민
    • 한국레이저가공학회지
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    • 제9권2호
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    • pp.11-15
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    • 2006
  • We report experimental results on the high-speed micromachining using a femtosecond laser (800 nm, 130 fs, 1kHz) and galvanometer scanner system (Raylase, Germany). Periodic hole drilling of silicon and glass with the scan speed of 1-20 mm/s is demonstrated. Finally, we demonstrate the utility of the femtosecond laser application to ITO patterning by using a high-speed femtosecond laser scanner system.

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IN718 초내열 합금의 고속 적층 제조 속도 확보를 위한 최적 VED 활용 공정 변수 제어 방안 연구 (Study for the Process Parameter Control to Achieve High Build Rate of Laser Powder Bed Fused IN718 Super Alloy Using Optimal VED)

  • 김상욱;김규식;손용호;이기안
    • 한국분말재료학회지
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    • 제29권5호
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    • pp.390-398
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    • 2022
  • Recently, considerable attention has been given to nickel-based superalloys used in additive manufacturing. However, additive manufacturing is limited by a slow build rate in obtaining optimal densities. In this study, optimal volumetric energy density (VED) was calculated using optimal process parameters of IN718 provided by additive manufacturing of laser powder-bed fusion. The laser power and scan speed were controlled using the same ratio to maintain the optimal VED and achieve a fast build rate. Cube samples were manufactured using seven process parameters, including an optimal process parameter. Analysis was conducted based on changes in density and melt-pool morphology. At a low laser power and scan speed, the energy applied to the powder bed was proportional to ${\frac{P}{\sqrt{V}}}$ and not ${\frac{P}{V}}$. At a high laser power and scan speed, a curved track was formed due to Plateau-Rayleigh instability. However, a wide melt-pool shape and continuous track were formed, which did not significantly affect the density. We were able to verify the validity of the VED formula and succeeded in achieving a 75% higher build rate than that of the optimal parameter, with a slight decrease in density and hardness.

Characteristic of High Voltage Aging in AC PDPs

  • Lee, Yong-Han;Kim, Oe-Dong;Ahn, Byoung-Nam;Choi, Kwang-Yeol;Kim, Sung-Tae
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.932-934
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    • 2006
  • A relationship between discharge delay time and the aging method were investigated: A-Y (Address electrode - Scan electrode) aging and conventional X-Y(Common electrode - Scan electrode) aging with the variation of sustain voltage beyond self-erasing discharge. Although A-Y aging decreases discharge delay time, it has several drawbacks like non-uniformity of discharge, degradation of luminous efficiency and a color temperature. In a conventional aging condition which is carried out near the mid-margin voltage, discharge delay time is short in low voltage and high frequency condition. As an alternative to conventional voltage aging, high voltage aging is suggested which is carried out at self-erasing sustain voltage region. High voltage aging shows lower discharge delay time and fast aging speed than conventional voltage aging.

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