• Nuclear Engineering and Technology
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• v.43 no.6
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• pp.557-566
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• 2011

A cold spray coating (CSC) of copper was studied for its application to a high-level radioactive waste (HLW) disposal canister. Several copper coatings of 10 mm thick were fabricated using two kinds of copper powders with different oxygen contents, and SS 304 and nodular cast iron were used as their base metal substrates. The fabricated CSC coppers showed a high tensile strength but were brittle in comparison with conventional non-coating copper, hereinafter defined to as "commercial copper". The corrosion behavior of CSC coppers was evaluated by comparison with commercial coppers, such as extruded and forged coppers. The polarization test results showed that the corrosion potential of the CSC coppers was closely related to its purity; low-purity (i.e., high oxygen content) copper exhibited a lower corrosion potential, and high-purity copper exhibited a relatively high corrosion potential. The corrosion rate converted from the measured corrosion current was not, however, dependent on its purity: CSC copper showed a little higher rate than that of commercial copper. Immersion tests in aqueous HCl solution showed that CSC coppers were more susceptible to corrosion, i.e., they had a higher corrosion rate. However, the difference was not significant between commercial copper and high-purity CSC copper. The decrease of corrosion was observed in a humid air test presumably due to the formation of a protective passive film. In conclusion, the results of this study indicate that CSC application of copper could be a useful option for fabricating a copper HLW disposal canister.

• Journal of the Korean Society for Heat Treatment
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• v.25 no.1
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• pp.22-26
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• 2012

An influence of the addition of copper (0.5, 1.0 and 1.5 mass% Cu) on the microstructure and mechanical properties of high purity iron (99.998 mass%) was characterized. The microstructure and microhardness of high-purity iron based samples, which were rolled at room temperature and subsequently annealed, were investigated in this work. The microstructure of the samples has been observed by electron back scattering diffraction (EBSD) and the mechanical properties have been studied by using micro-Vickers hardness test. The results of microstructural observation showed that deformation band was formed in high purity iron by rolling at room temperature, and it was recovered by annealing up to about 900 K. The microhardness results showed that the softening of high-purity iron occurred by annealing up to about 900 K, while the hardness of iron added with about 0.5-1.5 mass% copper was kept over 100 Hv and at the early time of annealing reached a maximum. The hardness of iron added with a small amount of copper may be attributed to precipitation hardening as well as solution hardening. The orientation of crystal in recrystallized grain was almost same as that of deformed grain.

• Resources Recycling
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• v.26 no.6
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• pp.84-90
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• 2017

The electro-refining process was performed to recovery high purity copper from low grade copper containing sludge in sulfuric acid. The surface morphologies and roughness of electro-refining copper were analyzed with variation of the type and concentration of organic additives, the best surface morphology was obtained 5 ppm of the gelatin type and 5 to 10 ppm of the thiol type organic additive. The crude metal consisted of copper with 86.635, 94.969 and 99.917 wt.%, several impurity metals of iron, nickel, cobalt and tin by pyro-metallurgical process. After electro-refining process, the purity of copper increases to 3N or 4N grade. The impurity concentrations and copper purities of copper crude metals, electrolyte and electro-refining copper were analyzed using ICP-OES, the electro-refining time and purity of copper crude metal to recover 4N grade copper were deduced.

• Resources Recycling
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• v.28 no.1
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• pp.62-72
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• 2019

Generally, $H_2SO_4$ and Cu metal are used as raw materials for producing copper sulfate. The study relates to a method for producing copper sulfate using electrowinning from a waste solution of copper chloride. Uses are used for copper plating for industry, plating, feed, agriculture, electronic grade PCB. Conventional methods for producing copper sulfate have a problem of a large amount of waste water and a high energy cost. A study on the production method of copper sulfate ($CuSO_4$), which is the most used among copper (Cu) compounds, has a low process operation ratio, a small amount of waste water, and a simple manufacturing process. It is easy to remove Na, Ca, Mg, and Al as impurities by using a cationic membrane. At the same time, high purity copper powder could be recovered by an electrowinninng method. Using the recovered copper powder, high purity copper sulfate could be produced.

• Journal of the Korean Chemical Society
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• v.11 no.4
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• pp.132-137
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• 1967

A spectrophotometric method for the determination of major impurities, such as iron and copper, in high purity of antimony with 8-hydroxyquinoline (oxine) has been studied. The iron-oxinate is stable at the pH range 5.0 to 5.7, and the copper-oxinate at the pH range 3.5 to 4.0. To mask antimony in sulfuric acid solution of sample, author has investigated the effect of tartaric acid on antimony, and found that 10ml of 0.5M tartaric acid solution could mask up to 600mg of antimony. The absorbance of iron-oxinate was measured at 580$m{\mu}$ and iron could be determined, but it is necessary for copper-oxinate to measure at 410 and 580m respectively after removing heavy metals other than copper by back extraction with 15% solution of sodium hydroxide, and copper could be determined by making a correction for the amounts of iron present. Up to 150 ${\mu}g$ of iron (0.005-0.03%), and 100 ${\mu}g$ of copper (0.005-0.016%), in 500mg of antimony could be determined.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.413-416
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• 2007

In general, by means of the electrodepositing technique, a copper foil sample was prepared with a high purity and a high density. But the mechanical properties of the electrodepositing copper foil was lower than it's the rolling copper foil. However, the production of copper foil with approximately 36 microns thick in rolling process was very difficult. This paper describes the outline of the high accuracy cold rolling in 6 high mill which was developed for the purpose of rolling very thin accurate gauge copper foil(36 micron thick), and give several rolling characteristic of 600 mm wide copper foil. a) Large strain can be accumulated pass by pass in industrial multi-pass rolling processing to overcome large critical strain for thickness accuracy through optimization of rolling schedule. b) Also, permissible tension for rolling 0.45 $\sim$ 0.036 mm thick copper strip stably in accordance with the each pass work had been established by FEM simulation results. c) During the plate rolling process, considerable values of the forces of material pressure on the tool occur. These pressures cause the elastic deformation of the roll, thus changing the shape of the deformation region. A numerical simulation of roll deflection during cold rolling is presented in the paper. d) The proposed pass schedule can roll very thin copper foil of 36 micron thickness to a tolerance of ${\pm}1$ microns. The validity of simulated results was verified into rolling experiments on the copper foil.

• Journal of the Korean Chemical Society
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• v.39 no.4
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• pp.252-256
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• 1995

A study was carried out for the development of direct determination of antimony in high purity copper metal without preseparation. The large excess of copper seemed to be performed as the matrix modifier to enhance the absorbance of antimony in copper metal. Sensitivity enhancement of Sb was obtained at the condition of the ashing temperature of $600^{\circ}C(20s){\sim}700^{\circ}C(10s)$ rather than $1000^{\circ}C(20s){\sim}1100^{\circ}C(10s)$, and the atomization temperature of $2200^{\circ}C.$ The operating pressure of argon gas was readjusted to the optimum condition at 2.0 kg/$cm^2.$ The linearity of the Sb calibration graph could be obtained in the range of 20 ppb up to 200 ppb Sb in existence of 5,000 ppm Cu with the coefficient of variation of about 5%.

• Resources Recycling
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• v.30 no.6
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• pp.76-82
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• 2021

The separation of palladium from crude metal, which is obtained from electronic waste using pyrometallurgy was achieved through electrolysis. This was done to recover high-purity copper. The oxidation potentials of these metals are a fundamental part of the analysis of electrolytic separation of palladium and impurity metals. To achieve this, copper, iron, and nickel were dissolved in the electrolyte, and palladium and aluminum were found to be recoverable from anode slime. During the electrolysis for palladium separation, palladium was present in the anode slime and was obtained with a recovery of 97.46 % indicating almost no loss. 4N-grade copper was recovered from the electrodeposition layer at the cathode.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.260-260
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• 2009

In high-efficiency crystalline silicon solar cell, If high-efficiency solar cells are to be commercialized, It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper are applied widely in various electronic manufactures as easily formation is available by plating. Ni is shown to be a suitable barrier to Cu diffusin as well as desirable contact metal to silicon. Nickel monosilicide has been suggested as a suitable silicide due to its lower resistivitym lower sintering temperature and lower layer stress than $TiSi_2$. In this paper, Nickel as a seed layer and diffusion barrier is plated by electroless plating to make nickel monosilicide.

• Tribology and Lubricants
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• v.26 no.2
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• pp.122-128
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• 2010

Focused Ion Beam (FIB) has been used for site-specific TEM sample preparation and small scale fabrication. Moreover, analysis on the surface microstructure and phase distribution is possible by ion channeling contrast of FIB with high resolution. This paper describes FIB applications and deformed surface structure induced by sliding. The effect of FIB process on the surface damage was explored as well. The sliding experiments were conducted using high purity aluminum and OFHC(Oxygen-Free High Conductivity) copper. The counterpart material was steel. Pin-on-disk, Rotational Barrel Gas Gun and Explosively Driven Friction Tester were used for the sliding experiments in order to investigate the velocity effect on the microstructural change. From the FIB analysis, it is revealed that ion channeling contrast of FIB has better resolution than SEM and the tribolayer is composed of nanocrystalline structures. And the thickness of tribolayer was constant regardless of sliding velocities.