• Journal of the Korean Society of Industry Convergence
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• v.7 no.4
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• pp.419-424
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• 2004

In order to increase the efficiency of the sawdust machine, the helical type drums with an oblique cutting condition (3D) were developed. The preexisting drums have an orthogonal cutting condition (2D) considering of a saw cutter and a wood cutting pattern. Unfortunately, the disadvantages of this type drum are the big cutting resistance, the high cost of a cutting power and the extreme occurrence of a vibration. To improve this shortcoming, the helical type drum with an oblique cutting condition was developed. Therefore, this type drum decreased the vibration and the cutting resistance of the sawdust machine, and also improved the productivity of 30% or more and the porosity of the sawdust.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.88-93
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• 2023

As the demand for High Bandwidth Memory (HBM) increases and the handling capability of larger wafers expands, ensuring reliable Total Thickness Variation (TTV) measurement for stacked wafers becomes essential. This study presents the design of a measurement module capable of measuring TTV across the entire area of a 300mm wafer, along with estimating potential mechanical measurement errors. The module enables full-area measurement by utilizing a center chuck and lift pin for wafer support. Modal analysis verifies the structural stability of the module, confirming that both the driving and measuring parts were designed with stiffness exceeding 100 Hz. The mechanical measurement error of the designed module was estimated, resulting in a predicted measurement error of 1.34 nm when measuring the thickness of a bonding wafer with a thickness of 1,500 ㎛.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.6
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• pp.130-138
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• 2012

There are increasing demands from the industry for intelligent robot-calibration solutions, which can be tightly integrated to the manufacturing process. A proposed solution can simplify conventional robot-calibration and teaching methods without tedious procedures and lengthy training time. iGPS(Indoor GPS) system is a laser based real-time dynamic tracking/measurement system. The key element is acquiring and reporting three-dimensional(3D) information, which can be accomplished as an integrated system or as manual contact based measurements by a user. A 3D probe is introduced as the user holds the probe in his hand and moves the probe tip over the object. The X, Y, and Z coordinates of the probe tip are measured in real-time with high accuracy. In this paper, a new approach of robot-calibration and teaching system is introduced by implementing a 3D measurement system for measuring and tracking an object with motions in up to six degrees of freedom. The general concept and kinematics of the metrology system as well as the derivations of an error budget for the general device are described. Several experimental results of geometry and its related error identification for an easy compensation / teaching method on an industrial robot will also be included.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1521-1524
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• 2003

Currently the plates used for the various structures has a tendency to being slim to the degree of the sheet metal vis-a-vis the overall measurements of the structure, and the conditions of their usage and load have been getting diverse. As the structure material has been used more and more under the various conditions, the necessity of the strength analysis is to be required. While most of these methods are simply based on the strain gaging method; that is, directly attaching most of the material to the gage, using the non-contact method is still in the early stage. One of the non-contact methods is by the use of the laser that has high-level of the accuracy for the measurement, and this laser also has excellent characteristics on which many studies for its applications are focused throughout the many fields. Therefore, this dissertation is on the measurement of the strain caused by the characteristics of the TIG welded zone which is used with 3D ESPI system that is functionally modified through the laser ESPI system.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1999.03b
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• pp.269-272
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• 1999

It is still hard to measure the strain distribution over entire surface of a medium or large-size stamped part even by using an automated strain measurement system. Several methods which enable to enlarge the measurement range without losing accuracy and precision are suggested in this study, The superposition of images having different high-lightened or damaged part each other results in an enhanced image. A new method for constructing the element connectivity from a line-thinned image makes it possible to identify up to 1,000 elements. And the geometry assembling algorithm is proved very efficient in which the whole area to be measured is divided into several parts ; the coordinate transformation between every two adjacent parts is obtained from the concept of the least square error ; and the 3-D shape or strain distribution over the whole surface is assembled,

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.942-945
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• 2003

Noise cause is dividing to fluid noise by exhaust flow of fan and vibration noise by rotational vibration of motor. Until now, measuring method has been used to measure vibration by the accelerometer, this method has been not measured for the vibration in some parts of brush and commutator because of motor construction. This research was purposed on the accurate analysis. using laser vibration analyzer, of noise cause against the difficult part in old times. By using this measured data, we would like to use for the design of silent motor.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.12
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• pp.15-21
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• 2010

Recently, there is a demand for a thermal imaging microscope in the medical field as well as the semi-conductor industry Although the demand of the advanced thermal imaging microscope has been increased, it is very difficult to obtain the technology of developing a thermal camera, because it is used for defense industry. We developed the ${\times}5$ zoom microscope which has $3\;{\mu}m$ spatial resolution to research the design and fabrication of the IR (Infrared) optical system. The optical system of the IR microscope consists of four spherical lenses and four aspheric lenses. We verified individual sensitivity of each optical parameter as the first order approach to the analysis. And we also performed structure and vibration analysis. The optical elements are fabricated using Freeform 700A. The measurement results of surface roughness and form accuracy using NT 2000 and UA3P are Ra 2.36 nm and P-V $0.13\;{\mu}m$. Finally we ascertained resolution power of $3\;{\mu}m$ using USAF (United State Air Force) 1951 IR resolution test chart.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.3
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• pp.39-45
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• 2002

A simple and low cost stylus profiler made of ferrite cores is developed. The devised profiler consists of a contact probe, a measuring transducer, a signal processing unit, and a motorized stage. The contact probe attached to 4-bar spring maintains sufficient stiffness to protect disturbances. An overlap-area type inductive position sensing system is selected as a measuring transducer, which has high sensitivity, repeatability and linearity. The transducer is composed of coil bundles and ferrite cores which have good electromagnetic characteristics in spite of low cost. The repeatability of the profiler with the proposed inductive sensing system is better than 50nm. Experimental results are shown that the proposed profiler can measure the line or 3D profile of an object with sub-micron features.

• Journal of Korea Multimedia Society
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• v.22 no.7
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• pp.780-789
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• 2019

In this paper, we propose a new indoor localization method for indoor mobile robots using LiDAR. The indoor mobile robots operating in limited areas usually require high-precision localization to provide high level services. The performance of the widely used localization methods based on radio waves or computer vision are highly dependent on their usage environment. Therefore, the reproducibility of the localization is insufficient to provide high level services. To overcome this problem, we propose a new localization method based on the comparison between ceiling shape information obtained from LiDAR measurement and the blueprint. Specifically, the method includes a reliable segmentation method to classify point clouds into connected planes, an effective comparison method to estimate position by matching 3D point clouds and 2D blueprint information. Since the ceiling shape information is rarely changed, the proposed localization method is robust to its usage environment. Simulation results prove that the position error of the proposed localization method is less than 10 cm.

• Korean Journal of Optics and Photonics
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• v.19 no.5
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• pp.376-380
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• 2008

This paper presents the Projection Moire method using a line scan camera. The high resolution feature of a line scan camera makes it possible to scan an image quickly, thus enabling a much quicker 3D profile. This method uses a high resolution line scan camera making it possible to scan an image at high speed simultaneously measuring the 3D profile of a large FOV. When using a high resolution scan camera, a full FOV is scanned, thus requiring just one movement of a projection grating. As a result, the number of grating movements is reduced drastically. The end result is a faster and more accurate 3D measurement. Moving the grating too quickly causes vibration in the imaging system, which will normally be required to apply a stitching technique when using an area scan camera. However the technique is not required when using a line scan camera. Compared with the previous techniques, it has the advantages of simple hardware without moving mechanical parts - single exposure for obtaining three-dimensional information. A method using a high resolution line scan camera can be used in mass production to measure the bump height of wafers or the bump height of package substrates.