• Title/Summary/Keyword: high power amplifier

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PAPR Reduction using Pre-emphasis and Clipping in OFDM Communication System

  • 유흥균;진병일
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.13 no.3
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    • pp.263-268
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    • 2002
  • DFDM is a good candidate for beyond-3G high-speed wireless communication application because of the robustness to the intersymbol interference and multipath fading. However. an OFDM signal has a serious problem of the high PAPR, which results in the significant nonlinear distortion when it passes through a nonlinear high power amplifier. We propose a new PAPR reduction method using pre-emphasis and clipping. Via the proposed method, the OFDM output signal can have a low PAPR and BER improvement. Then. de-emphasis process is requisite in OFDM receiver. PAPR is reduced to about 5.7 ㏈ at the CCDF= 10$\^$-3/ when the subcarrier number is 16, QPSK modulation is used. pre-emphasis change point Is 3/9 of the peak amplitude of the IFFT output and clipping level is 11 in the IFFT output amplitude. The required SNR at BER=10$\^$-3/ the proposed system is improved by 2 dB than that of the original OFDM system.

A High Speed CMOS Arrayed Optical Transmitter for WPON Applications (WPON 응용을 위한 고속 CMOS어레이 광트랜스미터)

  • Yang, Choong-Reol;Lee, Sang-Soo
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.38B no.6
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    • pp.427-434
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    • 2013
  • In this paper, the design and layout of a 2.5 Gbps arrayed VCSEL driver for optical transceiver having arrayed multi-channel of integrating module is confirmed. In this paper, a 4 channel 2.5 Gbps VCSEL (vertical cavity surface emitting laser) driver array with automatic optical power control is implemented using $0.18{\mu}m$ CMOS process technology that drives a $1550{\mu}m$ high speed VCSEL used in optical transceiver. To enhance the bandwidth of the optical transmitter, active feedback amplifier with negative capacitance compensation is exploited. We report a distinct improvement in bandwidth, voltage gain and operation stability at 2.5Gbps data rate in comparison with existing topology. The 4-CH chip consumes only 140 mW of DC power at a single 1.8V supply under the maximum modulation and bias currents, and occupies the die area of $850{\mu}m{\times}1,690{\mu}m$ excluding bonding pads.

An SLM-Based Real-time PAPR Reduction method using Dummy Sequence Insertion in the OFDM Communication System (OFDM 통신 시스템에서 더미 시퀀스를 추가하는 SLM 기반 실시간 PAPR 저감 방식)

  • Ryu Heung-Gyoon
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.30 no.4A
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    • pp.288-295
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    • 2005
  • OFDM communications system is very attractive for the high data rate wireless transmission. However, it may be distorted in the nonlinear HPA since OFDM signal has high PAPR. So, a new SLM method using dummy sequence is studied for reducing the PAPR, and we call it DSI-SLM method. Unlike the conventional SLM method using the phase rotation, dummy sequences for PAPR reduction are assigned at the predefined sub-carriers. After IFFT, the OFDM data signal of the lowest PAPR is selected to transmit. So, it can cut down the computational complexity because it does not require the transmission and demodulation process of side information about the phase rotation. This proposed method can solve the time delay problem so that PAPR reduction can be made in real time processing.

Concrete structural health monitoring using piezoceramic-based wireless sensor networks

  • Li, Peng;Gu, Haichang;Song, Gangbing;Zheng, Rong;Mo, Y.L.
    • Smart Structures and Systems
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    • v.6 no.5_6
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    • pp.731-748
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    • 2010
  • Impact detection and health monitoring are very important tasks for civil infrastructures, such as bridges. Piezoceramic based transducers are widely researched for these tasks due to the piezoceramic material's inherent advantages of dual sensing and actuation ability, which enables the active sensing method for structural health monitoring with a network of piezoceramic transducers. Wireless sensor networks, which are easy for deployment, have great potential in health monitoring systems for large civil infrastructures to identify early-age damages. However, most commercial wireless sensor networks are general purpose and may not be optimized for a network of piezoceramic based transducers. Wireless networks of piezoceramic transducers for active sensing have special requirements, such as relatively high sampling rate (at a few-thousand Hz), incorporation of an amplifier for the piezoceramic element for actuation, and low energy consumption for actuation. In this paper, a wireless network is specially designed for piezoceramic transducers to implement impact detection and active sensing for structural health monitoring. A power efficient embedded system is designed to form the wireless sensor network that is capable of high sampling rate. A 32 bit RISC wireless microcontroller is chosen as the main processor. Detailed design of the hardware system and software system of the wireless sensor network is presented in this paper. To verify the functionality of the wireless sensor network, it is deployed on a two-story concrete frame with embedded piezoceramic transducers, and the active sensing property of piezoceramic material is used to detect the damage in the structure. Experimental results show that the wireless sensor network can effectively implement active sensing and impact detection with high sampling rate while maintaining low power consumption by performing offline data processing and minimizing wireless communication.

Design and fabrication of Ka-band 100W SSPA using spatial combiner (공간결합기를 활용한 Ka대역 100W급 SSPA 설계 및 제작)

  • Lee, Ju-Heun;Kim, Hyo-Chul;Cho, Heung-Rae;Lee, Deok-Jae;An, Se-Hwan;Lee, Man-Hee;Joo, Ji-Han;Kim, Hong-Rak
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.22 no.1
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    • pp.35-43
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    • 2022
  • In this paper, a study was conducted to produce 20W by combining a 10W MMIC and raising the unit power amplifier to 100W SSPA by combining the 8-way spatial coupler. SSPA requires low-loss, high-efficiency coupling techniques to meet high output with the output of a single element relatively low compared to TWTA. Designed and produced in this paper, the SSPA was manufactured as a 100W SSPA by mounting eight 20W high-power amplification modules in an 8-way spatial coupler with a reflection loss of 20dB or more and an excellent coupling efficiency of 94% or more. When -10dBm was applied, it was 112.2~169.8W at 20kHz 20%, 125.9~173.8W at 400kHz 40%, 117.5~162.2W at 800kHz 40%, showing performance of over 60dB and over 100W in all three PRF conditions.

A Study on High-Power Handling Capability of X-Band Circular Waveguide Cavity Filter (X-대역 원통형 도파관 캐비티 필터의 고전력 핸들링 능력 연구)

  • Lee, Sun-Ik;Kim, Joong-Pyo;Lim, Won-Gyu;Kim, Sang-Goo;Lee, Pil-Yong;Jang, Jin-Baek
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.28 no.1
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    • pp.49-60
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    • 2017
  • In this paper, we presented the result of the study on high-power handling capability of the X-band circular waveguide cavity filter configured at the output of high power amplifier(120 W) for geostationary satellites. The dual mode circular waveguide cavity filter with 6th order is selected and the physical model of the filter is designed after determination of the size of resonator from mode chart. Multipactor margin analysis is performed by the SEM method and the VMF method. The result shows that the VMF method predicts lower multipactor breakdown thresholds than the SEM method. Evaluating the multipactor margin obtained by the VMF method to ECSS criteria, we could decide to perform multipactor test. The multipactor test conducted in ESA facility shows that multipactor did not occur even until the RF power increased up to 540 W. In consequence, by both analysis and test, we could verify that the X-band circular waveguide cavity filter has the sufficient high-power handling capability to operate on orbit.

A Study of the Method for External Noise Shielding using the GIS UHF Sensor Module Applied to the Partial Discharge Signal Sensitivity and Method of Frequency Transforming in the Internal GIS (GIS내부의 부분방전신호 감도개선 및 주파수변환기법에 의한 GIS UHF Sensor 모듈의 외부노이즈차폐기법에 관한 연구)

  • Lee, Seung-Min
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.4
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    • pp.728-732
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    • 2010
  • GIS(Gas insulated switching gear) is power equipment with excellent dielectric strength and is economy merit in high confidence and stability. Recently, because equipment of GIS was occurring problem of confidence used for a long time, partial discharge on-line diagnosis systems have been importantly recognized. Partial discharge (PD) detection is an effective means for monitoring and evaluation of dielectric condition of gas insulated system (GIS). The ultra-high-frequency (UHF) PD detection technique can detect and locate the PD sources inside GIS by detecting electromagnetic wave emitted from PD source. Therefore, real-time diagnostic system using UHF detection method has been developed for this application is being expanded gradually. However, the signal of partial discharge occurring in SF6 gas is very weak and susceptible to external noises which mainly consist of PD in air. Thus, it is important to distinguish the PD in SF6 gas more sensitively from the external noises. Unfortunately, these external noise signals and the partial discharge signals have very similar characteristics. Therefore, to solve this problem, we need the signal processing method for distinguish partial discharge signals with external noise signals for improvement of SNR(signal to noise ratio) and sensitivity. In this paper, we proposed internal signal processing method for removing external noise signals with built-in pre.amplifier and frequency conversion circuit.

Effect of Ultrasonic Vibration on the Friction and Wear Characteristics of Aluminum Alloy (초음파 진동이 알루미늄 합금의 마찰 마모 특성에 미치는 영향)

  • Park, Jae-Nam;Lee, Chul-Hee
    • Tribology and Lubricants
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    • v.34 no.4
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    • pp.132-137
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    • 2018
  • Ultrasonic waves are used in various applications in multiple devices, sensors, and high-power machinery, such as processing machines, welders, and cleaners, because the acoustic vibration frequencies are above the human audible frequency range. In ultrasonic machining, electrical energy at a high frequency of 20 kHz or more is converted into mechanical vibration by a vibrator and an amplifier. This technique allows instantaneous separation between a tool and a workpiece during machining, machining by pulse impulse force at the time of re-contact and minimizes the minute elastic deformations of the workpiece and machine tools due to the cutting effect. The Al7075 alloy used in this study is a typical aluminum alloy with superior strength that is mainly used in aircrafts, automobiles, and sporting goods. To investigate the optimal conditions for machining aluminum alloy using ultrasonic vibration, the present experiment utilized the Taguchi orthogonal array method, and the coefficient of friction was analyzed using the characteristics of the Taguchi technique. In ultrasonic friction and abrasion tests, the changes in the friction coefficient were measured in the absence of ultrasonic vibrations and at 28 kHz and 40 kHz. As a result, the most considerable influence on the friction coefficient was found to be the normal load, and the frequency of ultrasonic vibrations increases, the coefficient of friction increases. It was thus confirmed that the amount of wear increases when ultrasonic vibration is applied.

Design of Dielectric Detector for FRP Hot Stick in EHV Live line Maintenance

  • Chawporn, Talerngkiat;Sriratana, Witsarut;Trisuwannawat, Thanit
    • 제어로봇시스템학회:학술대회논문집
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    • 2005.06a
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    • pp.2063-2066
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    • 2005
  • This paper presents an approach to detect the dielectric condition of FRP Hot Stick in EHV high voltage cable whereas shutting down the power system is not necessary. The radio frequency generating method is adopted by transmitting radio wave into the Electrodes. This instrument is small, easy to use and also inexpensive. Furthermore, the impurity level of dirt on high voltage insulator (non-ceramic type) will be analyzed by using the methods based on IEEE Std.978-1984 at 105 kV.DC. /305 mm. and OSHA Regulation 1910.269 Part J - live line tools. The frequency at 10-20 MHz is applied to FRP Hot Stick via Electrode1 and from FRP Hot Stick surface to Electrode 2. After that the results will be evaluated by testing in each condition of FRP Hot Stick, such as dry surface, hot surface, foil winding and conductor inserting. Finally, the watt loss will be examined and compared with the loss from humidity and Carbon tracking. The important components of this system are radio frequency generating unit, frequency stabilizing unit, frequency amplifier, FRP Hot Stick frequency counter, processing unit, and display unit.

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Design of a 1-8V 6-bit IGSPS CMOS A/D Converter for DVD PRML (DVD PRML을 위한 1.8V 6bit IGSPS 초고속 A/D 변환기의 설계)

  • 유용상;송민규
    • Proceedings of the IEEK Conference
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    • 2002.06b
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    • pp.305-308
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    • 2002
  • An 1.8V 6bit IGSPS ADC for high speed data acquisition is discussed in this paper. This ADC is based on a flash ADC architecture because the flash ADC is the only practical architecture at conversion rates of IGSPS and beyond. A straightforward 6bit full flash A/D converter consists of two resistive ladders with 63 laps, 63 comparators and digital blocks. One important source of errors in flash A/D converter is caused by the capacitive feedthrough of the high frequency input signal to the resistive reference-lauder. Consequently. the voltage at each tap of the ladder network can change its nominal DC value. This means large transistors have a large parasitic capacitance. Therefore, a dual resistive ladder with capacitor is employed to fix the DC value. Each resistive ladder generates 32 clean reference voltages which alternates with each other. And a two-stage amplifier is also used to reduce the effect of the capacitive feedthrough by minimizing the size of MOS connected to reference voltage. The proposed ADC is based on 0.18${\mu}{\textrm}{m}$ 1-poly 6-metal n-well CMOS technology, and it consumes 307㎽ at 1.8V power supply.

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