• Journal of the Korea Institute of Military Science and Technology
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• v.16 no.4
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• pp.486-492
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• 2013

The pivoting composite wing is developed for the kit to be mounted on the external stores. The wing has a pivoting structure for the installation to an aircraft and high aspect ratio to increase lift drag ratio. The wing needs to be light and have sufficient strength and stiffness to satisfy structural design requirements. The wing is designed with carbon fiber composite and the structural parts are integrated to reduce cost to manufacture. In order to verify the structural performances, the design load analysis and flight load survey, the static analysis and test, the ground vibration test and flutter analysis are performed. It is shown that the wing has sufficient structural strength and stiffness to satisfy the structural design requirements.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1206-1209
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• 2005

In recent, injection molding process for features in sub-micron scale is under active development as patterning nano-scale features, which can provide the master or stamp for molding, and becomes available around the world. Injection molding has been one of the most efficient processes for mass production of the plastic product, and this process is already applied to nano-technology products successfully such as optical storage media like DVD or BD which is a large area plastic thin substrate with nano-scale features on its surface. Bio chip for like DNA sequencing may be another application of this plastic substrate. The DNA can be sequenced using order of 100 nm pore structure when making the DNA flow through the pore structure. Agarose gel and silicon based chip have been used to sequence the DNA, but injection molded plastic chip may have benefit in terms of cost. This plastic DNA sequencing chip has plenty of pillars in order of 100 nm in diameter on the substrate. When the usual features in case of DVD or BD have very low aspect ratio, even less than 0.5, but the DNA chip will have relatively high aspect ratio of about 2. It is not easy to injection mold the large area thin substrate with sub-micron features on its surface due to the characteristics of the molding process and it becomes much more difficult when the aspect ratio of the features becomes high. We investigated the effect of the molding parameters for injection molding with high aspect ratio nano-scale features and injection molded some plastic DNA sequencing chips. We also fabricated PR masters and Ni stamps of the DNA chip to be used for molding

• Tribology and Lubricants
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• v.18 no.3
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• pp.228-234
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• 2002

Generally, space structures are subjected to severe situations, such as, sublimation, strong evaporation of lubricants, thermal stresses, high temperature gradients, irradiation, impacts by microscopic meteorites, and other factors. Recent]y, various kinds of coatings are applied to the parts under heavy contact stresses, in order to insure long wear-free lives and/or reduce friction coefficients. In space structures, molybdenum disulfide is using frequently. Moreover TiN, Al$_2$O$_3$, PTFE(Poly Tetra Fluor Ethylene) are introduced recently for space structure. In this part we are going to apply the partial model method, developed in reference[11] to analyze part with coated layer. In referencer[l1], we compute the reasonable size of partial model and aspect ratio. Using these data, we analyze the structures coated with TiN, Al$_2$O$_3$, PTFE under contact load, temperature and crack model . Beside, we consider the stress analysis under time dependent load and transient thermal effect.

• Electrical & Electronic Materials
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• v.10 no.7
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• pp.668-673
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• 1997

A Single-crystalline Mn-Zn Ferrite (110 orientation) was masklessly etched by focused Ar laser irradiation in an H$_3$PO$_4$ solution. The depth of the etched grooves increases with increasing a laser power, decreasing a scan speed, and increasing the H$_3$PO$_4$concentration. The width of the etched grooves increases with a increasing laser power, but was relatively insensitive to the scan speed and H$_3$PO$_4$concentration. High etching rate of up to 714 ${\mu}{\textrm}{m}$/s and an aspect ratio of 6 for vertical slab structure have been obtained by the light-guiding effect of the laser bean in the H$_3$PO$_4$ solution.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.10a
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• pp.382-385
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• 2008

In the present study, the effect of cold reduction ratio on the spheroidization rate of SK85 high carbon steel sheet was investigated. High carbon steel sheet fabricated by POSCO was soaked at $850^{\circ}C$ for 2 hr in a box furnace and then treated at $570^{\circ}C$ and $670^{\circ}C$ for 10 min in a salt bath furnace followed by water quenching to obtain a fine pearlite structure and coarse pearlite structure. Cold rolling was conducted on the sheets by reduction ratios of 20, 30, and 40 % and heat treatment for spheroidization was carried out at $720^{\circ}C$ for the various time intervals from 1 to 32 hrs. Area fraction of spheroidized cementite was measured with an image analyzer as a function of cold reduction ratios and duration times.

• Proceedings of KOSOMES biannual meeting
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• 2003.05a
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• pp.159-165
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• 2003

To Recently, the buckling is easy to happen a thin plate and High Tensile Steel is used at the structure so that it is wide. Especially, the buckling is becoming important design criteria in the ship structure to use especially the High Tensile Steel. Consequently, it is important that we grasp the conduct after the buckling behaviour accurately at the stability of the body of ship structure. In this study, examined closely about conduct and secondary buckling after initial buckling of thin plate structure which receive compressive load according to various kinds aspect ratio under simply supported condition that make by buckling formula in each payment in advance nile to place which is representative construction of hull. Analysis method is F.E.M by ANSYS and complicated nonlinear behaviour to analyze such as secondary buckling.

• Proceedings of the Computational Structural Engineering Institute Conference
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• 2003.04a
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• pp.496-503
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• 2003

Recently, the buckling is easy to happen a thin plate and High Tensile Steel is used at the structure so that it is wide. Especially, the buckling is becoming important design criteria in the ship structure to use especially the High Tensile Steel. Consequently, it is important that we grasp the conduct after the buckling behaviour accurately at the stability of the body of ship structure. In this study, examined closely about conduct and secondary buckling after initial buckling of thin plate structure which receive compressive load according to various kinds aspect ratio under simply supported condition that make by buckling formula in each payment in advance rule to place which is representative construction of hull. Analysis method is F.E.M by ANSYS and complicated nonlinear behaviour to analyze such as secondary buckling.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2003.05a
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• pp.732-737
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• 2003

Recently, the buckling is easy to happen a thin plate and High Tensile Steel is used at the structure so that it is wide. Especially, the buckling is becoming important design criteria in the ship structure to use especially the High Tensile Steel. Consequently, it is important that we grasp the conduct after the buckling behaviour accurately at the stability of the body of ship structure. In this study, examined closely about conduct and secondary buckling after initial buckling of thin plate structure which receive compressive load according to various kinds aspect ratio under simply supported condition that make by buckling formula in each payment in advance rule to place which is representative construction of hull. Analysis method is F.E.M by ANSYS and complicated nonlinear behaviour to analyze such as secondary buckling.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.7
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• pp.701-707
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• 2004

High aspect ratio silicon structure through deep silicon etching process have become indispensable for advanced MEMS applications. In this paper, we present the results of modified Bosch process to obtain anisotropic silicon structure with conventional Inductively Coupled Plasma (ICP) etcher instead of the expensive Bosch process systems. In modified Bosch process, etching step ($SFsub6$) / sidewall passivation ($Csub4Fsub8$) step time is much longer than commercialized Bosch scheme and process transition time is introduced between process steps to improve gas switching and RF power delivery efficiency. To optimize process parameters, etching ($SFsub6$) / sidewall passivation ($Csub4Fsub8$) time and ion energy effects on etching profile was investigated. Etch profile strongly depends on the period of etch / passivation and ion energy. Furthermore, substrate temperature during etching process was found to be an important parameter determining etching profile. Test structures with different pattern size have been etched for the comparison of the aspect ratio dependent etch rate and the formation of silicon grass. At optimized process condition, micropatterns etched with modified Bosch process showed nearly vertical sidewall and no silicon grass formation with etch rate of 1.2 ${\mu}{\textrm}{m}$/ min and the size of scallop of 250 nm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.418-418
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• 2008

The electrochemical etching of silicon in HF-based solutions is known to form various types of porous structures. Porous structures are generally classified into three categories according to pore sizes: micropore (below 2 nm in size), mesopore (2 ~ 50 nm), and macropore (above 50 nm). Recently, the formation of macropores has attracted increasing interest because of their promising characteristics for an wide scope of applications such as microelectromechanical systems (MEMS), chemical sensors, biotechnology, photonic crystals, and photovoltaic application. One of the promising applications of macropores is in the field of MEMS. Anisotropic etching is essential step for fabrication of MEMS. Conventional wet etching has advantages such as low processing cost and high throughput, but it is unsuitable to fabricate high-aspect-ratio structures with vertical sidewalls due to its inherent etching characteristics along certain crystal orientations. Reactive ion dry etching is another technique of anisotropic etching. This has excellent ability to fabricate high-aspect-ratio structures with vertical sidewalls and high accuracy. However, its high processing cost is one of the bottlenecks for widely successful commercialization of MEMS. In contrast, by using electrochemical etching method together with pre-patterning by lithographic step, regular macropore arrays with very high-aspect-ratio up to 250 can be obtained. The formed macropores have very smooth surface and side, unlike deep reactive ion etching where surfaces are damaged and wavy. Especially, to make vertical microwire or nanowire arrays (aspect ratio = over 1:100) on silicon wafer with top-down photolithography, it is very difficult to fabricate them with conventional dry etching. The electrochemical etching is the most proper candidate to do it. The pillar structures are demonstrated for n-type silicon and the formation mechanism is well explained, while such a experimental results are few for p-type silicon. In this report, In order to understand the roles played by the kinds of etching solution and mask patterns in the formation of microwire arrays, we have undertaken a systematic study of the solvent effects in mixtures of HF, dimethyl sulfoxide (DMSO), iso-propanol, and mixtures of HF with water on the structure formation on monocrystalline p-type silicon with a resistivity with 10 ~ 20 $\Omega{\cdot}cm$. The different morphological results are presented according to mask patterns and etching solutions.